STMICROELECTRONICS DTV32G

DTV32G-1500B

(CRT HORIZONTAL DEFLECTION)
HIGH VOLTAGE DAMPER DIODE
MAIN PRODUCTS CHARACTERISTICS
6A
VRRM
1500 V
VF (max)
1.5 V
K
FEATURES AND BENEFITS
A
IF(AV)
K
HIGH BREAKDOWN VOLTAGE CAPABILITY
HIGH FREQUENCY OPERATION
SPECIFIED
TURN
ON
SWITCHING
CHARACTERISTICS
TYPICAL TOTAL LOSSES: 3.5 W
(IFpeak = 6 A, F = 56 kHz)
SUITABLE WITH BUH TRANSISTORS SERIES
SMD PACKAGE
A
NC
D2PAK
DESCRIPTION
High voltage diode especially designed for
horizontal deflection stage in standard and high
resolution displays for TV’s and monitors.
This device is packaged in D2PAK.
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
15
A
IF(RMS)
RMS forward current
VRRM
Repetitive Peak Reverse Voltage
1500
V
VRWM
Reverse Working Voltage
1350
V
IF(AV)
Average forward current
Tc=130°C
6
A
IFSM
Surge Non Repetitive Forward Current
tp = 10ms
sinusoidal
100
A
Tstg
Storage Temperature
- 40 to 150
°C
Tj
δ = 0.5
Maximum Operating JunctionTtemperature
November 1997 - Ed: 2
150
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DTV32G-1500B
THERMAL RESISTANCE
Symbol
Rth(j-c)
Parameter
Value
Unit
2
°C/W
Junction to Case
STATIC ELECTRICAL CHARACTERISTICS
Symbol
IR
VF
*
**
Test Conditions
VR = VRWM
IF =6A
Min
Typ
Max
Unit
Tj = 25°C
200
µA
Tj = 100°C
1
mA
Tj = 25°C
1.5
V
Tj = 100°C
1.4
pulse test : * tp = 5 ms , δ < 2%
** tp = 380 µs, δ < 2%
RECOVERY CHARACTERISTICS
Symbol
trr (1)
trr
Test Conditions
Tj = 25°C
Tj = 25°C
Min
Typ
IF = 1 A dIF/dt = -50A/µs VR =30V
IF = 1 A dIF/dt = -15A/µs VR =30V
250
IF = 1 A
140
IR = 100mA
Max
Unit
175
ns
ns
TURN-ON SWITCHING CHARACTERISTICS
Symbol
tfr (2)
VFp (2)
Test Conditions
Tj = 100°C
IF = 6 A
VFR = 2 V
dIF/dt = 80 A/µs
(1) Test following JEDEC standard
(2) Test representativeof the application
To evaluate the maximum conduction losses use the following equation :
VF = 1.2 + 0.034 IF
P = 1.2 x IF(av) + 0.034 x IF2(RMS)
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
Min
Typ
Max
Unit
0.6
µs
39
V
DTV32G-1500B
Fig. 1: Average forward power dissipation versus
average forward current.
Fig. 2: Peak current versus form factor.
=0.5
T
=tp/T
tp
T
=tp/T
Fig. 3: Average
temperature.
current
tp
versus
ambient
Fig. 4: Non repetitive surge peak forward current
versus overload duration (maximum values).
IM
=0.5
=0.5
=tp/T
T
tp
Fig. 5: Relative variation of thermal transient
impedance junction to case versus pulse duration.
=0.5
=tp/T
Fig. 6: Forward voltage drop versus forward
current (maximum values).
T
tp
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
DTV32G-1500B
Fig. 7: Junction capacitance versus reverse
voltage applied (typical values).
Fig. 8: Recovery charge versus dIF/dt.
Fig. 9: Peak reverse current versus dIF/dt.
Fig. 10: Dynamic parameters versus junction
temperature.
;
Fig. 11: Recovery time versus dIF/dt.
Fig. 12: Peak forward voltage versus dIF/dt.
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
DTV32G-1500B
BASIC HORIZONTAL DEFLECTION CIRCUIT
+V
TRANSFORMER
EHT
LINE YOKE
L
D
T
C
(BUH715)
(D=DAMPER DIODE DTV32-1500)
BASIC E-W DIODE MODULATOR CIRCUIT
+V
TRANSFORMER
EHT
C1
T
LINE YOKE
D1
(BUH715)
C2
L
D2
D1=DTV32-1500
D2=BYT08-400
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
DTV32G-1500B
PACKAGE DATA
D2PAK
DIMENSIONS
REF.
Min.
A
E
C2
L2
D
L
L3
A1
B2
B
Millimeters
Typ.
Inches
Max.
Min.
Typ.
Max.
A
4.30
4.60 0.169
0.181
A1
2.49
2.69 0.098
0.106
A2
0.03
0.23 0.001
0.009
B
0.70
0.93 0.027
0.037
B2
1.25
1.40 0.049
0.055
C
0.45
0.60 0.017
0.024
C2
1.21
1.36 0.047
0.054
D
9.00
9.35 0.354
0.368
E
10.00
10.28 0.393
0.405
G
4.88
5.28 0.192
0.208
L
15.00
15.85 0.590
0.624
L2
1.27
1.37 0.050
0.054
L3
1.40
1.75 0.055
0.069
R
C
G
A2
2.0 MIN.
FLAT ZONE
V2
R
V2
0.40
0°
0.016
8°
0°
8°
Marking: DTV32G-1500B
Cooling method : C.
Weight : 1.8 g.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Micr oelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in lif esupport devices or systems without express
written approval of SGS-THOMSON Microelectronics.
 1997 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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