EMIF03-SIM01F2 ® 3 LINES EMI FILTER INCLUDING ESD PROTECTION IPAD™ MAIN PRODUCT APPLICATIONS: EMI filtering and ESD protection for: ■ SIM Interface (Subscriber Identify Module) ■ UIM Interface (Universal Identify Module) DESCRIPTION The EMIF03-SIM01F2 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF03 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. BENEFITS ■ EMI symmetrical (I/O) low-pass filter ■ High efficiency in EMI filtering ■ Lead free package ■ Very low PCB space consuming: 1.42mm x 1.42mm ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression ■ High reliability offered by monolithic integration ■ High reducing of parasitic elements through integration & wafer level packaging. Flip-Chip (8 Bumps) Table 1: Order Code Part Number EMIF03-SIM01F2 Marking FC Figure 1: Pin Configuration (Ball side) 3 2 1 RST in RST out COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 15kV (air discharge) 8kV (contact discharge) CLT in Gnd CLT out B MIL STD 883E - Method 3015-6 Class 3 Data in VCC Data out C A Figure 2: Configuration VCC 100 Ω RST in RST out R1 47 Ω CLK in CLK out R2 100 Ω Data out Data in R3 Cline = 35pF max. GND TM: IPAD is a trademark of STMicroelectronics. December 2004 REV. 2 1/7 EMIF03-SIM01F2 Table 2: Absolute Ratings (limiting values) Symbol Tj Parameter and test conditions Value Unit 125 °C Maximum junction temperature Top Operating temperature range - 40 to + 85 °C Tstg Storage temperature range - 55 to + 150 °C Table 3: Electrical Characteristics (Tamb = 25°C) Symbol Parameter VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage I IF Dynamic impedance IPP Peak pulse current RI/O Series resistance between Input & Output Cline Input capacitance per line IRM V IRM IR Rd Symbol VBR VF VCL VBR VRM IPP Test conditions Min. IR = 1 mA Typ. Max. 6 V VRM = 3V per line 1 Rd Unit µA Ω 1.5 R1 95 100 105 Ω R2 44.65 47 49.35 Ω R3 95 100 105 Ω 35 pF Cline @ 0V Figure 3: S21 (dB) attenuation measurement Figure 4: Analog crosstalk measurements Aplac 7.60 User: STMicroelectronics Feb 22 2001 0.00 dB -5.00 dB -10.00 -15.00 -20.00 -25.00 -30.00 -35.00 -40.00 -45.00 -50.00 100.0k 1.0M 10.0M 100.0M 1.0G f/Hz B3_B1(CLK) 2/7 A3_A2(RST) C3_C1(DAT) MHz EMIF03-SIM01F2 Figure 5: Digital crosstalk measurement Figure 6: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and on one output (Vout) V(in1) V(out1) Figure 7: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and on one output (Vout) Figure 8: Line capacitance versus applied voltage (typical) V(in1) C(pF) 35 F=1MHz Vosc=30mV Tj=25°C 30 25 20 V(out1) 15 VR(V) 10 0 1 2 3 4 5 6 3/7 EMIF03-SIM01F2 Figure 9: Aplac model Rseries Port2 50 Port1 50 MODEL = demif03 sub MODEL = demif03 sub DEMIF03 diodes Model - RS = 1.2 - CJO = 17p - M = 0.3333 - VJ = 0.6 - ISR = 100p - BV = 6.8 - IBV = 1m - TT = 100n Vcc 50p 0.05 MODEL = demif03_Vcc 0.08nH 0.1 4/7 Rseries = 47R (CLK line) = 100R (RST & Data lines) sub DEMIF03_Vcc diode Model - RS = 1.5 - CJO = 20p - M = 0.3333 - VJ = 0.6 - ISR = 100p - BV = 6.8 - IBV = 1m - TT = 100n EMIF03-SIM01F2 Figure 10: Ordering Information Scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500µm, Bump = 315µm = 2: Leadfree Pitch = 500µm, Bump = 315µm = 3: Leadfree Pitch = 400µm, Bump = 250µm Figure 11: FLIP-CHIP Package Mechanical Data 500µm ± 50 650µm ± 65 1.42mm ± 50µm 500µm ± 50 315µm ± 50 1.42mm ± 50µm Figure 12: Foot print recommendations Figure 13: Marking 365 240 365 Copper pad Diameter : 250µm recommended , 300µm max Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) E Solder stencil opening : 330µm x x z y ww 40 220 Solder mask opening recommendation : 340µm min for 315µm copper pad diameter All dimensions in µm 5/7 EMIF03-SIM01F2 Figure 14: FLIP-CHIP Tape and Reel Specification Dot identifying Pin A1 location 1.75 +/- 0.1 Ø 1.5 +/- 0.1 4 +/- 0.1 3.5 +/- 0.1 ST E xxz yww ST E xxz yww ST E xxz yww 8 +/- 0.3 0.73 +/- 0.05 4 +/- 0.1 User direction of unreeling All dimensions in mm Table 4: Ordering Information Ordering code Marking Package Weight Base qty Delivery mode EMIF03-SIM01F2 FC Flip-Chip 2.9 mg 5000 Tape & reel 7” Note: More informations are available in the application notes: AN1235: “Flip-Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" Table 5: Revision History 6/7 Date Revision Description of Changes 08-Oct-2004 1 First issue 13-Dec-2204 2 Table 4 on page 6: Flip-Chip weight corrected from 3.3 mg to 2.9 mg. EMIF03-SIM01F2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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