EMIF10-LCD01F1 ® 10 LINES EMI FILTER AND ESD PROTECTION IPADTM MAIN PRODUCT CHARACTERISTICS: Where EMI filtering in ESD sensitive equipment is required : LCD for Mobile phones Computers and printers Communication systems MCU Boards DESCRIPTION The EMIF10-LCD01F1 is a 10 lines highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry, which prevents the device from destruction when subjected to ESD surges up 15kV. ■ ■ ■ ■ BENEFITS EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consuming: 2.64mm x 2.64mm Very thin package: 0.65 mm High efficiency in ESD suppression on input pins (IEC6100-4-2 level 4) High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging. Flip Chip package PIN CONFIGURATION (ball side) 5 4 3 2 1 ■ I5 I4 I3 I2 I1 A ■ I10 I9 I8 I7 I6 B GND GND GND GND GND C O10 O9 O8 O7 O6 D O5 O4 O3 O2 O1 E ■ ■ ■ ■ ■ COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 input pins 15kV (air discharge) 8 kV (contact discharge) Level 1 output pins 2kV (air discharge) 2kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 BASIC CELL CONFIGURATION Low-pass Filter Output Input Ri/o = 100Ω Cline = 35pF GND GND GND TM : IPAD is a trademark of STMicroelectronics. November 2003 - Ed: 2A 1/6 EMIF10-LCD01F1 ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C) Symbol Tj Parameter and test conditions Value Unit 125 °C Maximum junction temperature Top Operating temperature range -40 to + 85 °C Tstg Storage temperature range -55 to +150 °C ELECTRICAL CHARACTERISTICS (Tamb = 25°C) Symbol I Parameters VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current RI/O Series resistance between Input & Output Cline Input capacitance per line Symbol IF IR = 1mA IRM VRM = 3V IPP RI/O Cline Rt / Ft V IRM IR Test conditions VBR VF VCL VBR VRM Min Typ Max Unit 6 8 10 V 500 nA 90 100 110 Ω 35 pF At 0V bias Induced rise and fall time 10-90% at 26 MHz frequency signal V = 1.9 V (Rt / Ft input 1 ns, 50Ω impedance generator) 8 (1) (1) guaranteed by design Fig. 1: S21(dB) all lines attenuation measurement and Aplac simulation. 2/6 Fig. 2: Analog crosstalk measurements. ns EMIF10-LCD01F1 Fig. 3: ESD response to IEC61000-4-2 (+15kV air discharge) on one input and one output. Fig. 4: ESD response to IEC61000-4-2 (-15kV air discharge) on one input and one output. Vin Vout Fig. 5: Line capacitance versus applied voltage. CLine(pF) 35 30 25 20 15 10 5 0 0.0 1.0 Fig. 6: Rise time 10-90% measurements with 1.9V signal at 26 MHz frequency (50Ω generator). VLine(V) 2.0 3.0 4.0 5.0 Fig. 7: Fall time 10-90% measurements with 1.9V signal at 26 MHz frequency (50Ω generator). 3/6 EMIF10-LCD01F1 Aplac model. EMIF10-LCD01F1 model Ground return Aplac parameters. ZRZ structure aplacvar Remif10low 100 aplacvar Cemif10flow 17.5pF Bumps aplacvar Lbump 50pH aplacvar Rbump 20m aplacvar Cbump 1.5pF Bulk aplacvar Rsub 100m Gnd connections aplacvar Rgnd 100m aplacvar Lgnd 200pH aplacvar Cgnd 0.15pF BV = 7 CJO = Cemif10low IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = 0.015 VJ = 0.6 TT = 50n ORDER CODE EMIF yy - xxx zz F x 1: Pitch = 500µm Bump = 315µm 2: Leadfree Pitch = 500µm Bump = 315µm 3: Leadfree Pitch = 400µm Bump = 250µm 4: Pitch = 500µm Bump = 250µm EMI Filter Number of lines Flip Chip x: resistance value (Ohms) z: capacitance value / 10(pF) or Application (3 letters) and Version (2 digits) 4/6 EMIF10-LCD01F1 PACKAGE MECHANICAL DATA FLIP CHIP 500µm ± 50 650µm ± 65 2.64mm ± 50µm 500µm ± 50 315µm ± 50 250µm ± 40 2.64mm ± 50µm FOOT PRINT RECOMMENDATIONS Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 315µm copper pad diameter MARKING 545 400 545 Dot, ST logo xxx = marking yww = datecode (y = year ww = week) 100 230 x x x y ww All dimensions in µm 5/6 EMIF10-LCD01F1 PACKING Dot identifying Pin A1 location 1.75 +/- 0.1 Ø 1.5 +/- 0.1 4 +/- 0.1 3.5 +/- 0.1 ST xxx yww ST xxx yww ST xxx yww 8 +/- 0.3 0.73 +/- 0.05 4 +/- 0.1 User direction of unreeling All dimensions in mm OTHER INFORMATION Ordering code Marking Package Weight Base qty Delivery mode EMIF10-LCD01F1 FLT Flip Chip 9.3 mg 5000 Tape & reel (7”) Note: More information are available in the application notes: - AN1235: ''Flip-Chip: Package description and recommandations for use'' - AN1751: "EMI Filters: Recommendations and measurements" Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2003 STMicroelectronics - All rights reserved. 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