ESDAxxL ® Application Specific Discretes A.S.D. DUAL TRANSIL ARRAY FOR ESD PROTECTION APPLICATIONS Where transient overvoltage protection in ESD sensitive equipment is required, such as : - COMPUTERS - PRINTERS - COMMUNICATION SYSTEMS It is particulary recommended for the RS232 I/O port protection where the line interface withstands only with 2kV ESD surges. FEATURES n n n SOT23 2 UNIDIRECTIONAL TRANSIL FUNCTIONS. LOW LEAKAGE CURRENT : IR max. < 20µA at VBR. 300 W PEAK PULSE POWER (8/20µs) DESCRIPTION The ESDAxxL is a dual monolithic voltage suppressor designed to protect components which are connected to data and transmission lines against ESD. It clamps the voltage just above the logic level supply for positive transients, and to a diode drop below ground for negative transients. It can also work as bidirectionnal suppressor by connecting only pin1 and 2. FUNCTIONAL DIAGRAM BENEFITS High ESD protection level : up to 25 kV. High integration. Suitable for high density boards. COMPLIES WITH THE FOLLOWING STANDARDS : IEC61000-4-2 level 4 MIL STD 883C-Method 3015-6 : class 3. (human body model) Marchr 2000 - Ed: 4A 1/6 ESDAxxL ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C) Symbol Parameter Value Unit Electrostatic discharge MIL STD 883C - Method 3015-6 IEC61000-4-2 air discharge IEC61000-4-2 contact discharge 25 16 9 PPP Peak pulse power (8/20 µs) 300 W Tstg Tj Storage temperature range Maximum junction temperature - 55 to + 150 150 °C °C TL Maximum lead temperature for soldering during 10s 260 °C Top Operating temperature range - 40 to + 125 °C VPP kV note 1: Evolution of functional parameters is given by curves. ELECTRICAL CHARACTERISTICS (Tamb = 25°C) Symbol Parameter I IF VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current IPP Peak pulse current αT Voltage temperature coefficient VBR Capacitance Rd Dynamic resistance VF Forward voltage drop VBR min. @ V I RM C Types VF V RM Slope: 1 Rd IR max. IRM @ VRM max. I PP Rd αT C typ. max. typ. note 1 note 2 0V bias VF @ IF max. V V mA µA V mΩ 10 /⊃C pF V mA ESDA5V3L 5.3 5.9 1 2 3 280 5 220 1.25 200 ESDA6V1L 6.1 7.2 1 20 5.25 350 6 140 1.25 200 ESDA14V2L 14.2 15.8 1 5 12 650 10 90 1.25 200 ESDA25L 25 30 1 1 24 1000 10 50 1.2 10 note 1 : Square pulse Ipp = 15A, tp=2.5µs. note 2 : ∆ VBR = αT* (Tamb -25°C) * VBR (25°C) 2/6 -4 ESDAxxL CALCULATION OF THE CLAMPING VOLTAGE USE OF THE DYNAMIC RESISTANCE The ESDA family has been designed to clamp fast spikes like ESD. Generally the PCB designers need to calculate easily the clamping voltage VCL. This is why we give the dynamic resistance in addition to the classical parameters. The voltage across the protection cell can be calculated with the following formula: VCL = VBR + Rd IPP As the value of the dynamic resistance remains stable for a surge duration lower than 20µs, the 2.5µs rectangular surge is well adapted. In addition both rise and fall times are optimized to avoid any parasitic phenomenon during the measurement of Rd. Where Ipp is the peak current through the ESDA cell. DYNAMIC RESISTANCE MEASUREMENT The short duration of the ESD has led us to prefer a more adapted test wave, as below defined, to the classical 8/20µs and 10/1000µs surges. I Ipp 2µs t tp = 2.5µs 2.5µs duration measurement wave. 3/6 ESDAxxL Fig. 1: Peak power dissipation versus initial junction temperature. Fig. 2: Peak pulse power versus exponential pulse duration (Tj initial = 25 °C). Ppp[Tj initial]/Ppp[Tj initial=25°C] 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Ppp(W) 3000 1000 100 Tj initial(°C) 0 25 50 75 tp(µs) 100 125 150 Fig. 3: Clamping voltage versus peak pulse current (Tj initial = 25 °C). Rectangular waveform tp = 2.5 µs. 10 ESDA5V3L 10 100 Fig. 4: Capacitance versus reverse applied voltage (typical values). Ipp(A) 50.0 1 C(pF) 200 ESDA6V1L ESDA14V2L F=1MHz Vosc=30mV ESDA5V3L ESDA25L 100 10.0 ESDA6V1L 50 ESDA14V2L 1.0 tp=2.5µs 20 ESDA25L Vcl(V) 0.1 VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 Fig. 5: Relative variation of leakage current versus junction temperature (typical values). 10 1 2 5 10 20 50 Fig. 6: Peak forward voltage drop versus peak forward current (typical values). IR[Tj] / IR[Tj=25°C] IFM(A) 200 5.00 ESDA5V3L Tj=25°C ESDA6V1L & ESDA14V2L 100 ESDA14V2L 1.00 ESDA6V1L ESDA25L ESDA25L 10 0.10 Tj(°C) ESDA5V3L VFM(V) 1 25 4/6 50 75 100 125 0.01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 ESDAxxL 1. ESD protection by the ESDAxxL Electrostatic discharge (ESD) is a major cause of failure in electronic systems. Transient Voltage Suppressors (TVS) are an ideal choice for ESD protection. They are capable of clamping the incoming transient to a low enough level such that damage to the protected semiconductor is prevented. Surface mount TVS arrays offer the best choice for minimal lead inductance. They serve as parallel protection elements, connected between the signal line to ground. As the transient rises above the operating voltage of the device, the TVS array becomes a low impedance path diverting the transient current to ground. The ESDAxxL array is the ideal board level protection of ESD sensitive semiconductor components. The tiny SOT23 package allows design flexibility in the design of high density boards where the space saving is at a premium. This enables to shorten the routing and contributes to hardening againt ESD. I/O I/O I/O I/O ESD sensitive device GND 2 * ESDAXXL 2. Circuit Board Layout Circuit board layout is a critical design step in the suppression of ESD induced transients. The following guidelines are recommended : n The ESDAxxL should be placed as close as possible to the input terminals or connectors. n The path length between the ESD suppressor and the protected line should be minimized n n n All conductive loops, including power and ground loops should be minimized The ESD transient return path to ground should be kept as short as possible. Ground planes should be used whenever possible. 5/6 ESDAxxL ORDER CODE ESDA 6V1 L ESD ARRAY PACKAGE : SOT23 PLASTIC VBR min PACKAGE MECHANICAL DATA SOT23 (Plastic) A E DIMENSIONS REF. e D e1 B S A1 L H Millimeters Inches Min. Max. Min. Max. A 0.89 1.4 0.035 0.055 A1 0 0.1 0 0.004 B 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007 D 2.75 3.04 0.108 0.12 e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083 E 1.2 1.6 0.047 0.063 H 2.1 2.75 0.083 0.108 L 0.6 typ. 0.024 typ. c S FOOT PRINT (in millimeters) 2.35 0.92 1.9 0.075 mm inch 1.1 0.043 1.45 0.037 0.9 0.035 0.65 0.014 0.026 MARKING 0.9 0.035 1.1 0.043 0.9 0.035 0.35 TYPE MARKING ESDA5V3L EL53 ESDA6V1L EL61 ESDA14V2L EL15 ESDA25L EL25 Packaging: Standard packaging is tape and reel. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. 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