STMICROELECTRONICS L272D

L272
DUAL POWER OPERATIONAL AMPLIFIERS
..
..
..
.
OUTPUT CURRENT TO 1 A
OPERATES AT LOW VOLTAGES
SINGLE OR SPLIT SUPPLY
LARGE COMMON-MODE AND DIFFERENTIAL MODE RANGE
GROUND COMPATIBLE INPUTS
LOW SATURATION VOLTAGE
THERMAL SHUTDOWN
DESCRIPTION
The L272 is a monolithic integrated circuits in Powerdip, Minidip and SO packages intended for use as
power operational amplifiers in a wide range of applications including servo amplifiers and power supplies, compacts disc, VCR, etc.
The high gain and high output power capability provide superior performance whatever an operational
amplifier/power booster combination is required.
Powerdip
(8 + 8)
Minidip
SO16 (Narrow)
ORDERING NUMBERS : L272 (Powerdip)
L272M (Minidip)
L272D (SO16 Narrow)
PIN CONNECTIONS (top view)
L272M
January 1995
L272D
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L272
BLOCK DIAGRAMS
L272
SCHEMATIC DIAGRAM (one only)
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L272D
L272M
L272
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
Vs
Supply Voltage
28
Vi
Input Voltage
Vs
Vi
Differential Input Voltage
Io
DC Output Current
1
A
Ip
Peak Output Current (non repetitive)
1.5
A
Power Dissipation at:
Tamb = 80°C (L272), Tamb = 50°C (L272M), Tcase = 90 °C (L272D)
Tcase = 75 °C (L272)
1.2
5
W
W
Operating Temperature Range (L272D)
– 40 to 85
°C
Storage and Junction Temperature
– 40 to 150
°C
Ptot
Top
Tstg, Tj
± Vs
THERMAL DATA
Symbol
Rth j-case
Parameter
Thermal Resistance Junction-pins
Max.
Powerdip
SO16
Minidip
15
–
* 70
o
Unit
C/W
C/W
C/W
Rth j-amb
Thermal Resistance Junction-ambient
Max.
70
–
100
o
Rth j-alumina
Thermal Resistance Junction-alumina
Max.
–
** 50
–
o
* Thermal resistance junction-pin 4
** Thermal resistance junctions-pins with the chip soldered on the middle of an alumina supporting substrate measuring
15x 20mm; 0.65mm thickness and infinite heatsink.
ELECTRICAL CHARACTERISTICS (VS = 24V, T amb = 25oC unless otherwise specified)
Symbol
Parameter
Vs
Supply Voltage
Is
Quiescent Drain Current
Ib
Test Conditions
Min.
Typ.
Max.
Unit
28
V
8
7.5
12
11
mA
mA
4
VO =
VS
2
Vs = 24V
Vs = 12V
Input Bias Current
0.3
2.5
µA
Vos
Input Offset Voltage
15
60
mV
Ios
Input Offset Current
50
250
SR
Slew Rate
1
V/µs
350
kHz
70
50
dB
dB
µV
B
Gain-bandwidth Product
Ri
Input Resistance
Gv
O. L. Voltage Gain
f = 100Hz
f = 1kHz
eN
Input Noise Voltage
B = 20kHz
10
IN
Input Noise Current
B = 20kHz
200
pA
CRR
Common Mode Rejection
f = 1kHz
60
75
dB
SVR
Supply Voltage Rejection
f = 100Hz, RG = 10kΩ, VR = 0.5V
Vs = 24V
Vs = ± 12V
Vs = ± 6V
54
70
62
56
Ip = 0.1A
Ip = 0.5A
21
Vo
Cs
d
Tsd
Output Voltage Swing
Channel Separation
Distortion
Thermal Shutdown Junction
Temperature
500
nA
f = 1 kHz; RL =10Ω, Gv = 30dB
Vs = 24V
Vs = ± 6V
f = 1kHz, Gv = 3 dB, Vs = 24V, RL = ∞
60
kΩ
dB
23
22.5
V
V
dB
60
60
0.5
%
145
°C
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L272
Figure 1 :
Quiescent Current versus
Supply Voltage
Figure 2 :
Quiescent Drain Current versus
Temperature
Figure 3 :
Open Loop Voltage Gain
Figure 4 :
Output Voltage Swing versus
Load Current
Figure 5 :
Output Voltage Swing versus
Load Current
Figure 6 :
Supply Voltage Rejection versus
Frequency
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L272
Figure 7 :
Channel Separation versus
Frequency
APPLICATION SUGGESTION
NOTE
In order to avoid possible instability occuring into final stage the usual suggestions for the linear power
stages are useful, as for instance :
Figure 8 :
Common Mode Rejection versus
Frequency
- layout accuracy ;
- a 100nF capacitor corrected between supply pins
and ground ;
- boucherotcell (0.1 to 0.2 µF + 1 Ω series) between
outputs and ground or across the load.
Figure 9 : Bidirectional DC Motor Control with µP Compatible Inputs
Figure 10 : Servocontrol for Compact-disc
Figure 11 : Capstan Motor Control in Video Recorders
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L272
Figure 12 : Motor Current Control Circuit.
Note : The input voltage level is compatible with L291 (5-BIT D/A converter).
Figure 13 : Bidirectional Speed Control of DC Motors.
2R3 ° R1
where RM = internal resistance of motor.
For circuit stability ensure that RX >
RM
Vs
2R ° R1
) + Ro ⋅ ΙM where Ro =
The voltage available at the terminals of the motor is VM = 2 (Vi ⋅
2
RX
and IM is the motor current.
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L272
POWERDIP 16 PACKAGE MECHANICAL DATA
mm
DIM.
MIN.
a1
0.51
B
0.85
b
b1
TYP.
inch
MAX.
MIN.
TYP.
MAX.
0.020
1.40
0.033
0.50
0.38
0.020
0.50
D
0.055
0.015
0.020
20.0
0.787
E
8.80
0.346
e
2.54
0.100
e3
17.78
0.700
F
7.10
0.280
I
5.10
0.201
L
Z
3.30
0.130
1.27
0.050
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L272
MINIDIP PACKAGE MECHANICAL DATA
mm
DIM.
MIN.
A
TYP.
MAX.
MIN.
3.32
TYP.
MAX.
0.131
a1
0.51
0.020
B
1.15
1.65
0.045
0.065
b
0.356
0.55
0.014
0.022
b1
0.204
0.304
0.008
0.012
D
E
10.92
7.95
9.75
0.430
0.313
0.384
e
2.54
0.100
e3
7.62
0.300
e4
7.62
0.300
F
6.6
0.260
I
5.08
0.200
L
Z
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inch
3.18
3.81
1.52
0.125
0.150
0.060
L272
SO16 NARROW PACKAGE MECHANICAL DATA
mm
DIM.
MIN.
TYP.
A
a1
inch
MAX.
MIN.
TYP.
1.75
0.1
0.069
0.25
a2
MAX.
0.004
0.009
1.6
0.063
b
0.35
0.46
0.014
0.018
b1
0.19
0.25
0.007
0.010
C
0.5
0.020
c1
45° (typ.)
D
9.8
10
0.386
0.394
E
5.8
6.2
0.228
0.244
e
1.27
0.050
e3
8.89
0.350
F
3.8
4.0
0.150
0.157
L
0.4
1.27
0.150
0.050
M
S
0.62
0.024
8° (max.)
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L272
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for
the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of SGS-THOMSON Microelectronics.
 1995 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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