FAIRCHILD FGAF40N60SMD

FGAF40N60SMD
600 V, 40 A Field Stop IGBT
Features
General Description
• Maximum Junction Temperature : TJ =
175oC
Using novel field stop IGBT technology, Fairchild®’s new series
of field stop 2nd generation IGBTs offer the optimum performance for solar inverter, UPS, welder and PFC applications
where low conduction and switching losses are essential.
• Positive Temperaure Co-efficient for easy Parallel Operating
• High Current Capability
• Low Saturation Voltage: VCE(sat) = 1.9 V(Typ.) @ IC = 40 A
• High Input Impedance
• Fast Swiching: EOFF = 6.5 uJ/A
• Tightened Parameter Distribution
• RoHS Compliant
Applications
• Sewing Machine, CNC
• Home Appliances, Motor-Control
C
G
E
Absolute Maximum Ratings
Symbol
Description
Ratings
Unit
VCES
Collector to Emitter Voltage
600
V
VGES
Gate to Emitter Voltage
± 20
V
IC
ICM (1)
IF
IFM (1)
PD
25oC
Collector Current
@ TC =
Collector Current
@ TC = 100oC
Pulsed Collector Current
Diode Forward Current
@ TC = 25oC
Diode Forward Current
@ TC = 100oC
Pulsed Diode Maximum Forward Current
25oC
Maximum Power Dissipation
@ TC =
Maximum Power Dissipation
@ TC = 100oC
80*
A
40*
A
120*
A
40*
A
20*
A
120*
A
115
W
58
W
TJ
Operating Junction Temperature
-55 to +175
o
Tstg
Storage Temperature Range
-55 to +175
oC
TL
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
300
C
o
C
Notes:
*Drain current limited by maximum junction temperature
1: Repetitive rating: Pulse width limited by max. junction temperature
©2012 Fairchild Semiconductor Corporation
FGAF40N60SMD Rev. C4
1
www.fairchildsemi.com
FGAF40N60SMD 600 V 40 A Field Stop IGBT
May 2013
Symbol
RθJC(IGBT)
Parameter
Typ.
Max.
-
1.3
o
C/W
o
C/W
Thermal Resistance, Junction to Case
RθJC(Diode)
Thermal Resistance, Junction to Case
-
3.27
RθJA
Thermal Resistance, Junction to Ambient
-
40
Unit
oC/W
Package Marking and Ordering Information
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
FGAF40N60SMD
FGAF40N60SMD
TO-3PF
-
-
30
Electrical Characteristics of the IGBT
Symbol
Parameter
TC = 25°C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Unit
Off Characteristics
BVCES
Collector to Emitter Breakdown Voltage
VGE = 0V, IC = 250µA
600
-
-
V
∆BVCES
∆TJ
Temperature Coefficient of Breakdown
Voltage
VGE = 0V, IC = 250µA
-
0.6
-
V/oC
ICES
Collector Cut-Off Current
VCE = VCES, VGE = 0V
-
-
250
µA
IGES
G-E Leakage Current
VGE = VGES, VCE = 0V
-
-
±400
nA
IC = 250µA, VCE = VGE
On Characteristics
VGE(th)
VCE(sat)
G-E Threshold Voltage
Collector to Emitter Saturation Voltage
3.5
4.5
6.0
V
IC = 40A, VGE = 15V
-
1.9
-
V
IC = 40A, VGE = 15V,
TC = 175oC
-
2.1
-
V
-
1880
-
pF
VCE = 30V, VGE = 0V,
f = 1MHz
-
180
-
pF
-
50
-
pF
Dynamic Characteristics
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
Switching Characteristics
td(on)
Turn-On Delay Time
-
12
-
ns
tr
Rise Time
-
20
-
ns
td(off)
Turn-Off Delay Time
-
92
-
ns
tf
Fall Time
-
13
17
ns
Eon
Turn-On Switching Loss
-
0.87
-
mJ
Eoff
Turn-Off Switching Loss
-
0.26
0.34
mJ
Ets
Total Switching Loss
-
1.13
-
mJ
td(on)
Turn-On Delay Time
-
15
-
ns
tr
Rise Time
-
22
-
ns
td(off)
Turn-Off Delay Time
-
116
-
ns
tf
Fall Time
-
16
-
ns
Eon
Turn-On Switching Loss
-
0.97
-
mJ
Eoff
Turn-Off Switching Loss
-
0.60
-
mJ
Ets
Total Switching Loss
-
1.57
-
mJ
©2012 Fairchild Semiconductor Corporation
FGAF40N60SMD Rev. C4
VCC = 400V, IC = 40A,
RG = 6Ω, VGE = 15V,
Inductive Load, TC = 25oC
VCC = 400V, IC = 40A,
RG = 6Ω, VGE = 15V,
Inductive Load, TC = 175oC
2
www.fairchildsemi.com
FGAF40N60SMD 600 V 40 A Field Stop IGBT
Thermal Characteristics
Symbol
Qg
Parameter
(Continued)
Test Conditions
Total Gate Charge
Qge
Gate to Emitter Charge
Qgc
Gate to Collector Charge
VCE = 400V, IC = 40A,
VGE = 15V
Electrical Characteristics of the Diode
Symbol
Parameter
Min.
Typ.
Max
Unit
-
119
-
nC
-
13
-
nC
-
58
-
nC
Min.
Typ.
Max
Unit
TC = 25°C unless otherwise noted
Test Conditions
-
2.3
-
TC = 175oC
-
1.67
-
Reverse Recovery Energy
TC = 175oC
-
48.9
-
trr
Diode Reverse Recovery Time
TC = 25oC
-
36
-
TC = 175oC
-
110
-
Qrr
Diode Reverse Recovery Charge
TC = 25oC
-
46.8
-
-
445
-
VFM
Diode Forward Voltage
Erec
©2012 Fairchild Semiconductor Corporation
FGAF40N60SMD Rev. C4
TC =
25oC
IF = 20A
IF =20A, dIF/dt = 200A/µs
TC =
3
175oC
V
uJ
ns
nC
www.fairchildsemi.com
FGAF40N60SMD 600 V 40 A Field Stop IGBT
Electrical Characteristics of the IGBT
Figure 1. Typical Output Characteristics
VGE= 20V
Figure 2. Typical Output Characteristics
120
12V
90
VGE= 20V
15V
Collector Current, IC [A]
Collector Current, IC [A]
120
10V
60
30
o
TC = 25 C
90
15V
12V
10V
60
8V
30
o
8V
0
0
TC = 175 C
2
4
6
8
Collector-Emitter Voltage, VCE [V]
0
10
Figure 3. Typical Saturation Voltage
Characteristics
0
2
4
6
8
Collector-Emitter Voltage, VCE [V]
10
Figure 4. Transfer Characteristics
120
120
90
60
Common Emitter
VGE = 15V
30
o
Collector Current, IC [A]
Collector Current, IC [A]
Common Emitter
VCE = 20V
TC = 25 C
90
o
TC = 175 C
60
30
o
TC = 25 C
o
TC = 175 C
0
0
0
1
2
3
4
Collector-Emitter Voltage, VCE [V]
5
Figure 5. Saturation Voltage vs. Case
Temperature at Variant Current Level
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
80A
3
40A
2
IC = 20A
Common Emitter
o
TC = -40 C
16
12
80A
8
4
40A
4
0
50
75
100
125
150
175
o
Collector-EmitterCase Temperature, TC [ C]
FGAF40N60SMD Rev. C4
15
20
Common Emitter
VGE = 15V
©2012 Fairchild Semiconductor Corporation
3
6
9
12
Gate-Emitter Voltage,VGE [V]
Figure 6. Saturation Voltage vs. VGE
4
1
25
0
IC = 20A
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
www.fairchildsemi.com
FGAF40N60SMD 600 V 40 A Field Stop IGBT
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. VGE
Figure 8. Saturation Voltage vs. VGE
20
Common Emitter
o
TC = 25 C
16
12
80A
8
40A
4
0
IC = 20A
4
8
12
16
Gate-Emitter Voltage, VGE [V]
Common Emitter
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
20
o
TC = 175 C
16
12
80A
8
40A
4
IC = 20A
0
20
Figure 9. Capacitance Characteristics
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
Figure 10. Gate charge Characteristics
15
4000
Common Emitter
Common Emitter
VGE = 0V, f = 1MHz
Gate-Emitter Voltage, VGE [V]
o
o
TC = 25 C
Capacitance [pF]
3000
Cies
2000
1000
Coes
TC = 25 C
400V
12
VCC = 200V
300V
9
6
3
Cres
0
0.1
0
1
10
Collector-Emitter Voltage, VCE [V]
0
30
Figure 11. SOA Characteristics
40
80
Gate Charge, Qg [nC]
Figure 12. Turn-on Characteristics vs.
Gate Resistance
200
100
100
10µs
tr
1ms
10
Switching Time [ns]
Collector Current, Ic [A]
100µs
10 ms
DC
1
*Notes:
0.1
o
1. TC = 25 C
td(on)
10
Common Emitter
VCC = 400V, VGE = 15V
IC = 40A
o
TC = 25 C
o
2. TJ =175 C
3. Single Pulse
0.01
0.1
120
1
10
100
Collector-Emitter Voltage, VCE [V]
©2012 Fairchild Semiconductor Corporation
FGAF40N60SMD Rev. C4
o
TC = 175 C
1
1000
0
5
10
20
30
40
Gate Resistance, RG [Ω]
50
www.fairchildsemi.com
FGAF40N60SMD 600 V 40 A Field Stop IGBT
Typical Performance Characteristics
Figure 13. Turn-off Characteristics vs.
Gate Resistance
Figure 14. Turn-on Characteristics vs.
Collector Current
1000
1000
Common Emitter
VGE = 15V, RG = 6Ω
o
TC = 25 C
100
tf
Common Emitter
VCC = 400V, VGE = 15V
IC = 40A
10
o
Switching Time [ns]
Switching Time [ns]
td(off)
TC = 175 C
100
tr
10
td(on)
o
TC = 25 C
o
TC = 175 C
1
0
10
20
30
40
1
20
50
30
40
50
60
70
80
Collector Current, IC [A]
Gate Resistance, RG [Ω]
Figure 15. Turn-off Characteristics vs.
Collector Current
Figure 16. Switching Loss vs.
Gate Resistance
1000
5
Switching Loss [mJ]
Switching Time [ns]
td(off)
100
tf
10
Common Emitter
VGE = 15V, RG = 6Ω
o
Eon
1
Eoff
IC = 40A
o
TC = 25 C
TC = 25 C
o
o
TC = 175 C
1
20
30
40
50
Common Emitter
VCC = 400V, VGE = 15V
60
TC = 175 C
70
0.1
80
0
Collector Current, IC [A]
Figure 17. Switching Loss vs.
Collector Current
10
20
30
40
Gate Resistance, RG [Ω]
50
Figure 18. Turn off Switching
SOA Characteristics
200
6
Collector Current, IC [A]
Switching Loss [mJ]
100
Eon
1
Eoff
Common Emitter
VGE = 15V, RG = 6Ω
o
10
Safe Operating Area
TC = 25 C
o
VGE = 15V, TC = 175 C
o
TC = 175 C
0.1
20
1
30
40
50
60
70
80
Collector Current, IC [A]
©2012 Fairchild Semiconductor Corporation
FGAF40N60SMD Rev. C4
6
1
10
100
Collector-Emitter Voltage, VCE [V]
1000
www.fairchildsemi.com
FGAF40N60SMD 600 V 40 A Field Stop IGBT
Typical Performance Characteristics
Figure 19. Current Derating
Figure 20. Power Dissipation
50
120
Common Emitter
VGE = 15V
40
PD, Power Dissipation [W]
Collector Current, Ic[A]
Common Emitter
VGE = 15V
30
20
10
0
25
50
75
100
125
150
175
o
Collector-Emitter Case Temperature, TC [ C]
90
60
30
0
25
50
75
100
125
150
175
o
Collector-Emitter Case Temperature, TC [ C]
Figure 21. Load Current Vs. Frequency
Figure 22. Forward Characteristics
100
120
Square Wave
110
o
TJ < 175 C, D = 0.5, VCE = 400V
VGE = 15/0V, RG = 6Ω
Collector Current, IC [A]
100
Forward Current, IF [A]
90
80
70
o
Tc = 75 C
60
o
Tc = 100 C
50
40
30
o
TC = 175 C
10
o
TC = 25 C
20
10
1
0
1k
10k
100k
Switching Frequency, f [Hz]
1M
Figure 23. Reverse Current
0
1
2
3
Forward Voltage, VF [V]
4
Figure 24. Stored Charge
1000
700
Reverse Currnet, ICES [µ A]
Stored Recovery Charge, Qrr [nC]
o
o
100
TC = 175 C
10
o
TC = 100 C
1
0.1
o
0.01
TC = 25 C
1E-3
0
100
200
300
VR [V]
©2012 Fairchild Semiconductor Corporation
FGAF40N60SMD Rev. C4
400
500
TC = 25 C
600
o
TC = 175 C
500
400
300
200
di/dt = 200A/µs
di/dt = 100A/µs
100
0
600
0
7
5
10
15 20 25 30 35
Forwad Current, IF [A]
40
45
www.fairchildsemi.com
FGAF40N60SMD 600 V 40 A Field Stop IGBT
Typical Performance Characteristics
FGAF40N60SMD 600 V 40 A Field Stop IGBT
Typical Performance Characteristics
Figure 25. Reverse Recovery Time
200
o
Reverse Recovery Time, trr [ns]
TC = 25 C
o
TC = 175 C
150
100
di/dt = 100A/µs
di/dt = 200A/µs
50
0
0
5
10 15 20 25 30 35
Forward Current, IF [A]
40
45
Figure 26.Transient Thermal Impedance of IGBT
2
Thermal Response [Zthjc]
1
0.5
0.2
0.1
0.05
0.1
0.02
0.01
0.01
PDM
t1
single pulse
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-3
1E-5
1E-4
1E-3
0.01
0.1
1
10
100
Rectangular Pulse Duration [sec]
Figure 27.Transient Thermal Impedance of Diode
Thermal Response [Zthjc]
4
0.5
1
0.2
0.1
0.05
0.1
0.02
PDM
0.01
t1
0.01
1E-5
1E-4
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
single pulse
1E-3
0.01
0.1
1
10
100
Rectangular Pulse Duration [sec]
©2012 Fairchild Semiconductor Corporation
FGAF40N60SMD Rev. C4
8
www.fairchildsemi.com
FGAF40N60SMD 600 V 40 A Field Stop IGBT
Mechanical Dimensions
TO-3PF
Dimensions in Millimeters
©2012 Fairchild Semiconductor Corporation
FGAF40N60SMD Rev. C4
9
www.fairchildsemi.com
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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THEREIN, WHICH COVERS THESE PRODUCTS.
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As used here in:
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intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I64
©2012 Fairchild Semiconductor Corporation
FGAF40N60SMD Rev. C4
10
www.fairchildsemi.com
FGAF40N60SMD 600 V 40 A Field Stop IGBT
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