STMICROELECTRONICS M74HCT651M1R

M74HCT651
M74HCT652
HCT651 OCTAL BUS TRANSCEIVER/REGISTER (3-STATE, INV.)
HCT652 OCTAL BUS TRANSCEIVER/REGISTER (3-STATE)
.
.
.
.
.
.
.
HIGH SPEED
fMAX = 60 MHz (TYP.) AT VCC = 5V
COMPATIBLE WITH TTL OUTPUTS
VIH = 2 V (MIN.) AT VIL = 0.8V (MAX)
LOW POWER DISSIPATION
o
ICC = 4 µA (MAX) AT TA = 25 C
OUTPUT DRIVE CAPABILITY
15 LSTTL LOADS
SYMMETRICAL OUTPUT IMPEDANCE
IOH = IOL = 6 mA (mIN.)
BALANCED PROPAGATION DELAYS
tPLH = tPHL
PIN AND FUNCTION COMPATIBLE
WITH 54/74LS651/652
DESCRIPTION
M74HCT651/652 are high speed CMOS OCTAL
BUS
TRANSCEIVERS
AND
REGISTERS
(3-STATE), fabricated in silicon gate C2MOS
technology. They have the same high speed
performance of LSTTL combined with true CMOS
low power consumption. These devices consist of
bus transceiver circuits, D-type flip-flops, and control
circuitry arranged for multiplexed transmission of
data directly from the input bus or from the internal
storage registers. Enable GAB and GBA are
provided to control the transceiver functions. Select
AB and Select BA control pins are provided to select
whether real-time or stored data is transfered. A low
input level selects real-time data, and a high selects
stored data. Data on the A or B bus, or both, can be
stored in the internal D flip-flops by low-to-high
transitions at the appropriate clock pins (CLOCK AB
or CLOCK BA) regardless of the select or enable
control pins. When select AB and select BA are in the
real-time transfer mode, it is also possible to store
data without using the internal D-type flip-flops by
simultaneously enabling GAB and GBA. In this
configuration each output reinforces its input. Thus,
when all other data sources to the two sets of bus
lines are at high impedance, each set of bus lines will
remain at its last state. All inputs are equipped with
protection circuits against static discharge and
transient excess voltage.This integrated circuit has
input and output characteristics that are fully
compatible with 54/74 LSTTL logic families.
M54/74HCT devices are designed to directly
interface HSCMOS systems with TTL and NMOS
components. They are also plug in replacements for
LSTTL devices giving a reduction of power
consumption.
October 1993
B1R
(Plastic Package)
M1R
(Micro Package)
ORDER CODES :
M74HCXXXM1R
M74HCXXXB1R
PIN CONNECTIONS (top view)
INPUT AND OUTPUT EQUIVALENT CIRCUIT
GAB, GAB, CAB,
SAB, SBA, CBA
A, B
1/12
M74HCT651/652
LOGIC DIAGRAM (HCT651)
Note : In case of 74HCT652 output inverter marked * at A bus and B bus are eliminated.
TIMING CHART
2/12
M74HCT651/652
TRUTH TABLE
HCT652 (The truth table for HCT651 is the same as this, but with the outputs inverted)
GAB GBA CAB CBA SAB SBA
X
L
X
H
X*
X
X*
L
X
X*
X
H
X
Z
Z
X
INPUTS
INPUTS
Both the A and B bus are used for inputs to the
internal flip-flops. Data at the bus will be stored on
low to high transition of the clock inputs
X
L
OUTPUTS
L
INPUTS
L
The A bus are outputs and the B bus are inputs
The data at the B bus are displayed at the A bus
H
H
X
L
L
H
L
H
The data at the B bus ar displayed at the A bus.
The data of the B bus are stored to the internal
flip-flop on low to high transition of th clock pulse
X
H
Qn
X
X
H
The data stored to the internal flip-flop are dispayed
at the A bus
The data at the B bus are stored to the internal flipflop on low to high transition of the clock pulse. The
states of the internal flip-flops output directly to the
A bus
X*
L
X
X*
L
X
X
The output functions of the A and B bus are disabled
L
L
H
H
INPUTS
OUTPUTS
The A bus are inputs and the B bus are outputs
L
H
L
L
H
L
The data at the A bus are displayed at the B bus
H
H
The data at the A bus are displayed at the B bus.
The data of the A bus are stored to the internal flipflop on low to high transition of the clock pulse
X*
H
X
X
Qn
The data stored to the internal flip-flops are
displayed at the B bus
X*
H
X
L
H
L
H
the data at the A bus are stored to the internal flipflop on low to high transition of the clock pulse. The
states of the internal flip-flops output directly to the
B bus
OUTPUTS OUTPUTS
H
FUNCTION
Both the A bus and the B bus are inputs
X
H
X
B
INPUTS
X
L
X*
A
INPUTS
X
H
H
Qn
Qn
H
H
Qn
Qn
L
Both the A bus and the B bus are outputs
The data stored to the internal flip-flops are
displayed at the A and B bus respactively
The output at the A bus are displayed at the B bus,
the output at the B bus are displayed at the A bus
respectively
X
: DON’T CARE
Z
: HIGH IMPEDANCE
Qn : THE DATA STORED TO THE INTERNAL FLIP-FLOPS BY MOST RECENT LOW TO HIGH TRANSITION OF THE CLOCK INPUTS
*
: THE DATA AT THE A AND B BUS WILL BE STORED TO THE INTERNAL FLIP-FLOPS ON EVERY LOW TO HIGH TRANSITION OF
THE CLOCK INPUTS
3/12
M74HCT651/652
PIN DESCRIPTION
PIN No
1
2
3
4, 5, 6, 7, 8, 9, 10, 11
20, 19, 18, 17, 16, 15, 14, 13
21
22
23
12
24
SYMBOL
CLOCK AB
SELECT AB
GAB
A1 to A8
B1 to B8
GBA
SELECT BA
CLOCK BA
GND
VCC
NAME AND FUNCTION
A to B Clock Input (LOW to HIGH, Edge-Trigged)
Select A to B Source Input
Direction Control Input
A data Inputs/Outputs
B Data Inputs/Outputs
Output Enable Input (Active LOW)
Select B to A Source Input
B to A Clock Input (LOW to HIGH, Edge-Triggered)
Ground (0V)
Positive Supply Voltage
IEC LOGIC SYMBOLS
HCT651
4/12
HCT652
M74HCT651/652
ABSOLUTE MAXIMUM RATINGS
Symbol
Value
Unit
VCC
VI
Supply Voltage
DC Input Voltage
-0.5 to +7
-0.5 to VCC + 0.5
V
V
VO
DC Output Voltage
-0.5 to VCC + 0.5
V
IIK
IOK
DC Input Diode Current
DC Output Diode Current
± 20
± 20
mA
mA
IO
DC Output Source Sink Current Per Output Pin
± 35
mA
DC VCC or Ground Current
± 70
mA
500 (*)
mW
ICC or IGND
Parameter
PD
Power Dissipation
Tstg
TL
Storage Temperature
Lead Temperature (10 sec)
-65 to +150
300
o
o
C
C
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these condition isnotimplied.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
VI
Input Voltage
VO
Top
Output Voltage
Operating Temperature:
tr, tf
Input Rise and Fall Time (VCC = 4.5 to 5.5V)
Value
4.5 to 5.5
Unit
V
0 to VCC
V
0 to VCC
-40 to +85
0 to 500
V
C
o
ns
5/12
M74HCT651/652
DC SPECIFICATIONS
Test Conditions
Symbol
Parameter
TA = 25 oC
Min. Typ. Max.
2.0
VIH
High Level Input Voltage
4.5
to
5.5
V IL
Low Level Input
Voltage
4.5
to
5.5
V OH
High Level Output Voltage
VOL
II
-40 to 85 oC
Min. Max.
2.0
0.8
4.5
VI = IO=-20 µA
VIH IO=-6.0 mA
or
V IL
4.5
VI = IO= 20 µA
VIH IO= 6.0 mA
or
V IL
5.5
Low Level Output Voltage
Input Leakage Current (*)
Value
VCC
(V)
4.4
4.5
4.4
4.31
4.13
0.0
0.17
V
0.8
4.18
Unit
V
V
0.1
0.26
0.1
0.33
V
VI = VCC or GND
±0.1
±1
µA
IOZ
3 State Output Off State Current
5.5
VI = VCC or GND
±0.5
±5.0
µA
ICC
∆ICC
Quiescent Supply Current
Additional worst case supply
current
5.5
5.5
VI = VCC or GND
Per Input pin
VI = 0.5V or
V I = 2.4V
Other Inputs at
V CC or GND
1
2.0
10
2.9
µA
mA
(*): Applicable only to GAB, GBA, CAB, CBA, SAB, SBA input
6/12
M74HCT651/652
AC ELECTRICAL CHARACTERISTICS (Input t r = t f = 6 ns)
Symbol
Parameter
Test Conditions
VCC CL
(V) (pF)
Unit
tTLH
tTHL
tPLH
tPHL
Output Transition Time
4.5
Propagation Delay Time
(BUS - BUS)
4.5
50
20
30
38
ns
tPLH
tPHL
Propagation Delay Time
(CLOCK - BUS)
tPLH
tPHL
Propagation Delay Time
(SELECT - BUS)
4.5
4.5
4.5
4.5
150
50
150
50
25
29
34
24
38
44
52
34
48
55
65
43
ns
ns
ns
ns
tPZL
tPZH
3-State Output Enable Time
(GAB, GBA - BUS)
tPLZ
tPHZ
fMAX
Output Disable Time
(GAB, GBA - BUS)
Maximum Clock Frequency
4.5
4.5
4.5
4.5
150
50
150
50
29
22
27
24
42
33
41
35
53
41
51
44
ns
ns
ns
ns
4.5
50
tW(H)
tW(L)
ts
Minimum Clock Pulse Width
4.5
50
8
15
19
ns
Minimum Set-up Time
4.5
50
3
10
13
ns
th
CIN
Minimum Hold Time
Input Capacitance
4.5
50
5
5
10
5
10
ns
pF
CI/O
CPD (*)
Bus Terminal Capacitance
Power Dissipation Capacitance
50
Value
TA = 25 C
-40 to 85 oC
Min. Typ. Max. Min. Max.
7
12
15
o
RL = 1 KΩ
RL = 1 KΩ
RL = 1 KΩ
for HCT651
for HCT652
31
55
13
38
39
25
ns
MHz
pF
pF
(*) CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load.
(Refer to Test Circuit). Average operting current can be obtained by the following equation. ICC(opr) = CPD •VCC •fIN + ICC/8 (per Channel)
7/12
M74HCT651/652
SWITCHING CHARACTERISTICS TEST CIRCUIT AND WAVEFORM
WAVEFORM 1
WAVEFORM 2
WAVEFORM 3
WAVEFORM 5
WAVEFORM 4
GAB = ”L”
GBA = ”H”
8/12
M74HCT651/652
TEST WAVEFORM ICC (Opr.)
INPUT TRANSITION TIME IS THE SAME AS THAT IN CASE OF SWITCHING CHARACTERISTICS TEST.
9/12
M74HCT651/652
Plastic DIP24 (0.25) MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
a1
0.63
0.025
b
0.45
0.018
b1
0.23
b2
0.31
1.27
D
E
0.009
0.012
0.050
32.2
15.2
16.68
1.268
0.598
0.657
e
2.54
0.100
e3
27.94
1.100
F
MAX.
14.1
0.555
I
4.445
0.175
L
3.3
0.130
P043A
10/12
M74HCT651/652
SO24 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
A
a1
MIN.
TYP.
MAX.
2.65
0.10
0.104
0.20
a2
0.004
0.007
2.45
0.096
b
0.35
0.49
0.013
0.019
b1
0.23
0.32
0.009
0.012
C
0.50
0.020
c1
45° (typ.)
D
15.20
15.60
0.598
0.614
E
10.00
10.65
0.393
0.420
e
1.27
0.05
e3
13.97
0.55
F
7.40
7.60
0.291
0.299
L
0.50
1.27
0.19
0.050
S
8° (max.)
L
s
e3
b1
e
a1
b
A
a2
C
c1
E
D
13
1
12
F
24
11/12
M74HCT651/652
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
 1994 SGS-THOMSON Microelectronics - All Rights Reserved
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12/12