M54HCT7007 M74HCT7007 HEX BUFFER . . . . . . . HIGH SPEED tpd = 11 ns (TYP.) at VCC = 5 V LOW POWER DISSIPATION ICC = 1 µA (MAX.) AT TA = 25 °C COMPATIBLE WITH TTL OUTPUTS VIH = 2V (MIN.) VIL = 0.8V (MAX) OUTPUT DRIVE CAPABILITY 10 LSTTL LOADS SYMMETRICAL OUTPUT IMPEDANCE |IOH| = IOL = 4 mA (MIN.) BALANCED PROPAGATION DELAYS tPLH = tPHL PIN AND FUNCTION COMPATIBLE WITH 54/74LS07 DESCRIPTION The M54/74HCT7007 is a high speed CMOS HEX BUFFER fabricated in silicon gate C2MOS technology. B1R (Plastic Package) F1R (Ceramic Package) M1R (Micro Package) C1R (Chip Carrier) ORDER CODES : M54HCT7007F1R M74HCT7007M1R M74HCT7000B1R M74HCT7007 C1R PIN CONNECTIONS (top view) It has the same high speed performance of LSTTL combined with true CMOS low power consumption. All inputs are equipped with protection circuits against static discharge and transient excess voltage. The integrated circuit has totally compatible, input and output characteristic, with standard 54/74 LSTTL logic families. M54HCT/74HCT devices are designed to directly interface HSC2MOS systems with TTL and NMOS components. These devices are also plug in replacement for LSTTL devices giving a reduction of power consumption. INPUT AND OUTPUT EQUIVALENT CIRCUIT NC = No Internal Connection February 1993 1/9 M54/M74HCT7007 TRUTH TABLE IEC LOGIC SYMBOL A Y L H L H PIN DESCRIPTION PIN No 1, 3, 5, 9, 11, 13 SYMBOL 1A to 6A NAME AND FUNCTION Data Inputs 2, 4, 6, 8, 10, 12 1Y to 6Y Data Outputs 7 GND Ground (0V) SCHEMATIC CIRCUIT (Per Gate) ABSOLUTE MAXIMUM RATINGS Symbol ICC Value Unit VCC VI Supply Voltage DC Input Voltage Parameter -0.5 to +7 -0.5 to VCC + 0.5 V V VO DC Output Voltage -0.5 to VCC + 0.5 V IIK DC Input Diode Current ± 20 mA IOK DC Output Diode Current ± 20 mA IO or IGND DC Output Source Sink Current Per Output Pin DC VCC or Ground Current ± 25 ± 50 mA mA PD Power Dissipation 500 (*) mW Tstg TL Storage Temperature Lead Temperature (10 sec) -65 to +150 300 o o C C Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these condition isnotimplied. (*) 500 mW: ≅ 65 oC derate to 300 mW by 10mW/oC: 65 oC to 85 oC 2/9 M54/M74HCT7007 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Value Unit VCC Supply Voltage 4.5 to 5.5 V VI VO Input Voltage Output Voltage 0 to VCC 0 to VCC V V Top Operating Temperature: M54HC Series M74HC Series tr, tf Input Rise and Fall Time (VCC = 4.5 to 5.5V) o -55 to +125 -40 to +85 o 0 to 500 C C ns DC SPECIFICATIONS Test Conditions Symbol Parameter VIH High Level Input Voltage V IL Low Level Input Voltage V OH High Level Output Voltage VOL II ICC ∆ICC Low Level Output Voltage Input Leakage Current Quiescent Supply Current Additional worst case supply current Value TA = 25 oC 54HC and 74HC VCC (V) Min. 2.0 4.5 to 5.5 4.5 to 5.5 Typ. Max. -40 to 85 oC -55 to 125 oC 74HC 54HC Min. 2.0 0.8 4.5 VI = IO=-20 µA VIH or IO=-4.0 mA V IL 4.5 VI = IO= 20 µA VIH or IO= 4.0 mA V IL Max. Min. 2.0 0.8 Max. V 0.8 4.4 4.5 4.4 4.4 4.18 4.31 4.13 4.10 Unit V V 0.0 0.1 0.1 0.1 0.17 0.26 0.33 0.4 VI = VCC or GND ±0.1 ±1 ±1 µA 5.5 VI = VCC or GND 1 10 20 µA 5.5 Per Input pin VI = 0.5V or V I = 2.4V Other Inputs at V CC or GND IO= 0 2.0 2.9 3.0 mA 5.5 V 3/9 M54/M74HCT7007 AC ELECTRICAL CHARACTERISTICS (C L = 50 pF, Input t r = tf = 6 ns) Test Conditions Value o -40 to 85 oC -55 to 125 oC 74HC 54HC Min. Max. Min. Max. Symbol Parameter VCC (V) TA = 25 C 54HC and 74HC Min. Typ. Max. tTLH tTHL Output Transition Time 4.5 8 15 19 23 tPLH tPHL Propagation Delay Time 4.5 14 23 29 35 5 22 10 10 10 CIN CPD (*) Input Capacitance Power Dissipation Capacitance Unit ns ns pF pF (*) CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average operting current can be obtained by the following equation. ICC(opr) = CPD •VCC •fIN + ICC/6 (per BUFFER) SWITCHING CHARACTERISTICS TEST CIRCUIT TEST CIRCUIT ICC (Opr.) INPUT WAVEFORM I 4/9 M54/M74HCT7007 Plastic DIP14 MECHANICAL DATA mm DIM. MIN. a1 0.51 B 1.39 TYP. inch MAX. MIN. TYP. MAX. 0.020 1.65 0.055 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 15.24 0.600 F 7.1 0.280 I 5.1 0.201 L Z 3.3 1.27 0.130 2.54 0.050 0.100 P001A 5/9 M54/M74HCT7007 Ceramic DIP14/1 MECHANICAL DATA mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 20 0.787 B 7.0 0.276 D E 3.3 0.130 0.38 e3 0.015 15.24 0.600 F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060 L 0.22 0.31 0.009 0.012 M 1.52 2.54 0.060 0.100 N P Q 10.3 7.8 8.05 5.08 0.406 0.307 0.317 0.200 P053C 6/9 M54/M74HCT7007 SO14 MECHANICAL DATA mm DIM. MIN. TYP. A a1 inch MAX. MIN. TYP. 1.75 0.1 0.068 0.2 a2 MAX. 0.003 0.007 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45° (typ.) D 8.55 E 5.8 8.75 0.336 6.2 0.228 0.344 0.244 e 1.27 0.050 e3 7.62 0.300 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M S 0.68 0.026 8° (max.) P013G 7/9 M54/M74HCT7007 PLCC20 MECHANICAL DATA mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 9.78 10.03 0.385 0.395 B 8.89 9.04 0.350 0.356 D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022 E 7.37 8.38 0.290 0.330 e 1.27 0.050 e3 5.08 0.200 F 0.38 0.015 G 0.101 0.004 M 1.27 0.050 M1 1.14 0.045 P027A 8/9 M54/M74HCT7007 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 9/9