SD1542-04 RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS . .. .. . . DESIGNED FOR HIGH POWER PULSED IFF 600 WATTS (min.) IFF 1030/1090 MHz REFRACTORY GOLD METALLIZATION 6.0 dB MIN. GAIN BALLASTING AND LOW THERMAL REISTANCE FOR RELIABILITY AND RUGGEDNESS 30:1 LOAD VSWR CAPABILITY AT SPECIFIED OPERATING CONDITIONS INPUT MATCHED, COMMON BASE CONFIGURATION .400 x .500 2LFL (M112) hermetically sealed ORDER CODE SD1542-04 BRANDING SD1542-4 PIN CONNECTION DESCRIPTION The SD1542-04 is a hermetically sealed, gold metallized, silicon NPN power transistor. The SD154204 is designed for applications requiring high peak power and low duty cycles such as IFF. The SD1542-04 is packaged in a hermetic metal/ceramic package with internal input matching, resulting in improved broadband performance and low thermal reistance. 1. Collector 2. Base 3. Emitter 4. Base ABSOLUTE MAXIMUM RATINGS (T case = 25 ° C) Symbol Parameter Value Unit VCBO Collector-Base Voltage 65 V VCES Collector-Emitter Voltage 65 V VEBO Emitter-Base Voltage 3.5 V Device Current 40 A Power Dissipation 1350 W TJ Junction Temperature +200 °C TSTG Storage Temperature − 65 to +150 °C 0.06 °C/W IC PDISS THERMAL DATA RTH(j-c) November 1992 Junction-Case Thermal Resistance 1/5 SD1542-04 ELECTRICAL SPECIFICATIONS (T case = 25 ° C) STATIC Symbol Value Test Conditions Min. Typ. Max. Unit BVCBO IC = 25mA IE = 0mA 65 — — V BVEBO IE = 10mA IC = 0mA 3.5 — — V ICES VCE = 50V IE = 0mA — — 35 mA hFE VCE = 5V IC = 1A 5 — 200 — DYNAMIC Symbol Value Test Conditions Min. Typ. Max. Unit POUT f = 1090 MHz PIN = 150 W VCE = 50 V 600 — — W GP f = 1090 MHz PIN = 150 W VCE = 50 V 6.0 — — dB Note: Pulse Width = 10 µ Sec, Duty Cyle = 1% TYPICAL PERFORMANCE POWER OUTPUT vs POWER INPUT 2/5 POWER OUTPUT vs FREQUENCY SD1542-04 IMPEDANCE DATA TYPICAL INPUT IMPEDANCE TYPICAL COLLECTOR LOAD IMPEDANCE 3/5 SD1542-04 TEST CIRCUIT C1, C2, C3 : C4 : C5 : C6 : C7 : L1 L2 .8 - 4.8pF Gigatrim 120pF Chip Capacitor 680pF Chip Capacitor 1000µF 63Vdc Electrolytic 56pF Chip Capacitor : 100mils Wide Brass Strip : #18 AWG Wire Z1 Z2 Z3 Z4 Z5 Z6 Z7 : : : : : : : 510 mils x 20mils 120mils x 380mils 210mils x 20mils 270mils x 725mils 400mils x 720mils 340mils x 20 mils 245mils x 20 mils CIRCUIT BOARD LAYOUT 4/5 SD1542-04 PACKAGE MECHANICAL DATA Ref.: Dwg. No.12-0112 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. © 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 5/5