SMBYW01-200 ® HIGH EFFICIENCY FAST RECOVERY DIODE MAIN PRODUCT CHARACTERISTICS IF(AV) 1A VRRM 200 V VF(max) 0.71 V Tj (max) 150 °C FEATURES AND BENEFITS VERY LOW SWITCHING LOSSES LOW FORWARD VOLTAGE DROP BIPOLAR DEVICE LOW PEAK FORWARD VOLTAGE FOR TELECOM TRANSIENT OPERATION SUCH AS IN LIGHTING PROTECTION CIRCUITS SMB (JEDEC DO-214AA) DESCRIPTION Single chip rectifier suited to Switch Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, this surface mount device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) RMS forward current IF(AV) Average forward current IFSM Surge non repetitive forward current Tstg Storage and junction temperature range Tj Maximum operating junction temperature October 1999 - Ed: 4A Value Unit 200 V 8 A Tlead=140°C δ = 0.5 1 A tp=10ms sinusoidal 60 A - 65 to + 150 °C 150 °C 1/5 SMBYW01-200 THERMAL RESISTANCES Symbol Rth (j-l) Parameter Value Unit 13 °C/W Junction to lead STATIC ELECTRICAL CHARACTERISTICS Symbol VF * IR ** Parameters Test Conditions Forward voltage drop Reverse leakage current Tj = 25°C IF = 1 A Tj = 150°C IF = 1 A Tj = 25°C VR = VRRM Min. Typ. 0.65 Max. Unit 0.9 V 0.71 3 Tj = 125°C µA 180 400 Typ. Max. Unit 25 ns Pulse test : * tp = 380 µs, δ < 2 % ** tp = 5 ms, δ < 2 % To evaluate the maximum conduction losses use the following equation : P = 0.58 x IF(AV) + 0.118 x IF2(RMS) RECOVERY CHARACTERISTICS Symbol trr Test Conditions Tj = 25°C IF = 0.5 A Min. Irr = 0.25 A IR = 1A IF = 1 A dIF/dt = - 50 A/µs VR = 30V 25 35 tfr Tj = 25°C IF = 1A dIF/dt = 100 A/µs 25 ns VFP Tj = 25°C IF = 1A dIF/dt = 100 A/µs 5 V 2/5 SMBYW01-200 Fig. 1: Average forward power dissipation versus average forward current . Fig. 2: Peak current versus form factor. IM(A) PF(av)(W) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 δ = 0.05 δ = 0.1 δ = 0.2 10 9 8 7 6 5 4 3 2 1 0 0.0 δ = 0.5 δ=1 IF(av) (A) 0.2 0.4 0.6 0.8 1.0 P=1.5W P=1.0W P=0.5W P=0.25W 0.1 0.2 0.3 0.4 1.2 Fig. 3: Average forward current versus ambient temperature (δ=0.5). 0.5 δ 0.6 0.7 0.8 0.9 1.0 Fig. 4: Non repetitive surge peak forward current versus overload duration. IF(av)(A) IM(A) 1.2 8 Rth(j-a)=Rth(j-l) 1.0 7 0.8 6 0.6 Ta=25°C 5 Ta=50°C Rth(j-a)=100°C/W 0.4 4 3 0.2 Ta=75°C Tamb(°C) 0.0 0 25 50 75 100 125 150 Fig. 5: Variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, epoxy FR4, e(Cu)=35µm). t(s) 2 1E-3 1E-2 1E-1 1E+0 Fig 6: Forward voltage drop versus forward current (maximum values). VFM(V) Zth(j-a)(°C/W) 50.00 1.00 10.00 δ = 0.5 Tj=125°C δ = 0.2 0.10 1.00 δ = 0.1 Tj=25°C 0.10 Single pulse tp(s) 0.01 1E-2 1E-1 1E+0 IFM(A) 1E+1 1E+2 5E+2 0.01 0.0 0.4 0.8 1.2 1.6 2.0 2.4 3/5 SMBYW01-200 Fig. 7: Junction capacitance versus reverse voltage applied (typical values). Fig. 8: Reverse recovery current versus dIF/dt . C(pF) IRM(A) 6 12 F=1MHz Tj=25°C 10 IF=IF(av) 90% confidence Tj=125°C 5 8 4 6 3 4 2 2 1 VR(V) 0 1 dIF/dt(A/µs) 10 100 200 Fig. 9: Reverse recovery time versus dIF/dt. 0 0 dIF/dt(A/µs) 20 60 80 100 120 140 160 180 200 Qrr(nC) IF=IF(av) 90% confidence Tj=125°C 0 40 Fig. 10: Reverse recovery charges versus dIF/dt. trr(ns) 100 90 80 70 60 50 40 30 20 10 0 20 40 60 80 100 120 140 160 180 200 Fig. 11: Dynamic parameters versus junction temperature. 100 90 80 70 60 50 40 30 20 10 0 IF=IF(av) 90% confidence Tj=125°C dIF/dt(A/µs) 0 20 40 60 80 100 120 140 160 180 200 Fig. 12: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) Rth(j-a) (°C/W) Qrr;IRM[Tj] / Qrr;IRM[Tj=125°C] 120 1.25 100 1.00 80 IRM 0.75 60 40 Qrr 0.50 20 Tj(°C) 0.25 4/5 0 25 50 75 S(Cu) (cm²) 100 125 150 0 0 1 2 3 4 5 SMBYW01-200 PACKAGE MECHANICAL DATA SMB E1 DIMENSIONS REF. A1 A2 C L Inches Min. Max. Min. Max. A1 A2 b c 1.90 0.05 1.95 0.15 2.45 0.20 2.20 0.41 0.075 0.002 0.077 0.006 0.096 0.008 0.087 0.016 E E1 D L 5.10 4.05 3.30 0.75 5.60 4.60 3.95 1.60 0.201 0.159 0.130 0.030 0.220 0.181 0.156 0.063 D E Millimeters b FOOT PRINT DIMENSIONS (in millimeters) SMB (Plastic) 2.3 1.52 2.75 1.52 Ordering type Marking Package Weight Base qty Delivery mode SMBYW01-200 B20 SMB 0.11g 2500 Tape & reel Band indicates cathode Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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