VISHAY VLMT3100-GS08

VLMT3100
www.vishay.com
Vishay Semiconductors
Low Current SMD LED PLCC-2
FEATURES
• SMD LED with exceptional brightness
• Compatible with automatic placement
equipment
• EIA and ICE standard package
These new devices have been designed to meet the
increasing demand for low current SMD LEDs.
The package of the VLMT3100 is the PLCC-2 (equivalent to
a size B tantalum capacitor).
It consists of a lead frame which is embedded in a white
thermoplast. The reflector inside this package is filled up
with clear epoxy.
• Compatible with infrared, vapor phase and
wave solder processes according to CECC
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: Excellent for coupling to
light pipes and backlighting
• Very low power consumption
• Luminous intensity ratio in one packaging unit
IVmax./IVmin.  1.6
• AEC-Q101 qualified
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT GROUP AND PACKAGE DATA
APPLICATIONS
•
•
•
•
• Automotive: Backlighting in dashboards and switches
• Telecommunication: Indicator and backlighting in
telephone and fax
• Indicator and backlight for audio and video equipment
• Indicator and backlight for battery driven equipment
• Small indicator for outdoor applications
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches, and symbols
• General use
19225
DESCRIPTION
Product group: LED
Package: SMD PLCC-2
Product series: Low current
Angle of half intensity: ± 60°
PARTS TABLE
PART
COLOR
LUMINOUS INTENSITY
WAVELENGTH
FORWARD VOLTAGE
at IF
at IF
at IF
(mcd)
(nm)
(V)
TECHNOLOGY
(mA)
(mA)
(mA)
MIN.
TYP. MAX.
MIN. TYP. MAX.
MIN.
TYP. MAX.
VLMT3100-GS08
Red
0.28
1.1
-
2
612
-
625
2
-
2.2
2.9
2
GaAsP on GaP
VLMT3100-GS18
Red
0.28
1.1
-
2
612
-
625
2
-
2.2
2.9
2
GaAsP on GaP
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) 
VLMT3100
PARAMETER
TEST CONDITION
Reverse voltage (1)
DC forward current
Surge forward current
tp  10 μs
Power dissipation
SYMBOL
VALUE
UNIT
VR
6
V
mA
IF
7
IFSM
0.5
A
PV
20
mW
Tj
100
°C
Operating temperature range
Tamb
- 40 to + 100
°C
Storage temperature range
Tstg
- 40 to + 100
°C
t5s
Tsd
260
°C
Mounted on PC board (pad size > 16 mm2)
RthJA
500
K/W
Junction temperature
Soldering temperature
Thermal resistance junction/ambient
Note
(1) Driving the LED in reverse direction is suitable for short term application
Rev. 1.2, 15-Mar-11
Document Number: 81710
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMT3100
www.vishay.com
Vishay Semiconductors
OPTICAL AND ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
VLMT3100, RED
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
Luminous intensity (1)
PARAMETER
IF = 2 mA
IV
0.28
1.1
-
mcd
Dominant wavelength
IF = 2 mA
d
612
-
625
nm
Peak wavelength
IF = 2 mA
p
-
635
-
nm
deg
Angle of half intensity
IF = 2 mA

-
± 60
-
Forward voltage
IF = 2 mA
VF
-
2.2
2.9
V
Reverse voltage
IR = 10 μA
VR
6
15
-
V
VR = 0 V, f = 1 MHz
Cj
-
50
-
pF
Junction capacitance
Note
(1) In one packing unit I
Vmax./IVmin.  1.6
LUMINOUS INTENSITY CLASSIFICATION
LUMINOUS INTENSITY (mcd)
GROUP
MIN.
MAX.
C1
0.28
0.36
C2
0.36
0.45
D1
0.45
0.56
D2
0.56
0.71
E1
0.71
0.90
E2
0.9
1.12
F1
1.12
1.4
F2
1.4
1.8
G1
1.8
2.24
G2
2.24
2.8
Note
• Luminous intensity is tested at a current pulse duration of 25 ms
and an accuracy of ± 11 %.
The above type numbers represent the order groups which
include only a few brightness groups. Only one group will be
shipped on each reel (there will be no mixing of two groups on
each reel). In order to ensure availability, single brightness
groups will not be orderable.
In a similar manner for colors where wavelength groups are
measured and binned, single wavelength groups will be shipped
on any one reel.
In order to ensure availability, singe wavelength groups will not
be orderable.
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
0°
6
4
2
0
0
95 10842
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 1 - Forward Current vs. Ambient Temperature
Rev. 1.2, 15-Mar-11
10°
20°
30°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
8
IV rel - Relative Luminous Intensity
IF - Forward Current (mA)
10
80°
0.6
0.4
0.2
0
95 10319
Fig. 2 - Relative Luminous Intensity vs. Angular Displacement
Document Number: 81710
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMT3100
www.vishay.com
Vishay Semiconductors
red
10
1
tp/T = 0.001
tp = 10 µs
0.1
0
2
1
95 10050
3
100
IV rel - Relative Luminous Intensity
IF - Forward Current (mA)
100
4
red
10
1
0.1
0.01
0.1
5
Fig. 3 - Forward Current vs. Forward Voltage
10
100
Fig. 6 - Relative Luminous Intensity vs. Forward Current
2.0
1.2
IV rel - Relative Luminous Intensity
IV rel - Relative Luminous Intensity
1
IF - Forward Current (mA)
95 10061
VF - Forward Voltage (V)
red
1.6
1.2
0.8
0.4
IF = 2 mA
0
0
95 10051
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 4 - Relative Luminous Intensity vs. Ambient Temperature
red
1.0
0.8
0.6
0.4
0.2
0
590
95 10040
610
630
650
670
690
λ - Wavelength (nm)
Fig. 7 - Relative Intensity vs. Wavelength
IV rel - Relative Luminous Intensity
2.4
red
2.0
1.6
1.2
0.8
0.4
95 10321
0
10
1
20
0.5
50
0.2
100 200
0.1 0.05
500 IF (mA)
0.02 tp/T
Fig. 5 - Relative Luminous Intensity vs. Forward Current/Duty Cycle
Rev. 1.2, 15-Mar-11
Document Number: 81710
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMT3100
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
technical drawings
according to DIN
specifications
0.9
1.75 ± 0.1
3.5 ± 0.2
Pin identification
Mounting Pad Layout
4
A
area covered with
solder resist
2.6 (2.8)
C
2.2
2.8 ± 0.15
1.2
4
1.6 (1.9)
Ø 2.4
3 + 0.15
Drawing-No.: 6.541-5067.01-4
Issue: 5; 04.11.08
20541
METHOD OF TAPING/POLARITY AND TAPE AND REEL
SMD LED (VLM.3-SERIES)
TAPING OF VLM.3...
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN IEC 40
(CO) 564) for automatic component insertion. The blister
tape is a plastic strip with impressed component cavities,
covered by a top tape.
2.2
2.0
3.5
3.1
5.75
5.25
3.6
3.4
Adhesive tape
4.0
3.6
8.3
7.7
1.85
1.65
Blister tape
1.6
1.4
4.1
3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Fig. 8 - Tape Dimensions in mm for PLCC-2
Component cavity
Rev. 1.2, 15-Mar-11
94 8670
Document Number: 81710
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMT3100
www.vishay.com
Vishay Semiconductors
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08 
(= 1500 PCS.)
SOLDERING PROFILE
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC level 2a
10.0
9.0
120°
300
2.5
1.5
13.00
12.75
63.5
60.5
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
Temperature (°C)
4.5
3.5
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
200
max. 30 s
150
max. 100 s
max. 120 s
100
max. ramp down 6 °C/s
max. ramp up 3 °C/s
50
0
0
14.4 max.
180
178
50
150
Time (s)
200
250
300
max. 2 cycles allowed
19885
94 8665
Fig. 11 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020)
Fig. 9 - Reel Dimensions - GS08
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS18 
(= 8000 PCS.) PREFERRED
TTW Soldering (acc. to CECC00802)
300
5s
10.4
8.4
120°
4.5
3.5
2.5
1.5
Temperature (°C)
250
13.00
12.75
235 °C
to 260 °C
first wave
200
lead temperature
second
full line: typical
wave
dotted line: process limits
ca. 200 K/s
150
100 °C
to 130 °C
ca. 2 K/s
100
2 K/s
62.5
60.0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
100
ca. 5 K/s
50
forced cooling
0
0
948626-1
50
100
150
200
250
Time (s)
Fig. 12 - Double Wave Soldering of Opto Devices (all Packages)
321
329
14.4 max.
18857
Fig. 10 - Reel Dimensions - GS18
Rev. 1.2, 15-Mar-11
Document Number: 81710
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMT3100
www.vishay.com
Vishay Semiconductors
BAR CODE PRODUCT LABEL (example)
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
106
A
H
VISHAY
37
B
C
D
E
F
G
RECOMMENDED METHOD OF STORAGE
20126
• Storage temperature 10 °C to 30 °C
• Storage humidity  60 % RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
A. Type of componenent
B. Manufacturing plant
C. SEL - selection code (bin):
e.g.: J1 = code for luminous intensity group
3 = code for color group
192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen)
or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label is
included on all dry bags.
D. Date code year/week
E. Day code (e.g. 1: Monday)
F. Batch no.
L E V E L
G. Total quantity
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
H. Company code
2a
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
3. Devices require baking before mounting if:
a)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
b)
2a or 2b is not met.
Aluminum bag
Label
4. If baking is required, devices may be baked for:
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
o
or
96 hours at 60±5 Cand <5%RH
For all device containers
24 hours at 100±5°C
Not suitable for reels or tubes
Bag Seal Date: ______________________________
(If blank, see bar code label)
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
Reel
15973
19786
Example of JESD22-A112 level 2a label
ESD PRECAUTION
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electro-static
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABEL
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
Rev. 1.2, 15-Mar-11
Document Number: 81710
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000