STMICROELECTRONICS STB40NS15

STB40NS15
N-CHANNEL 150V - 0.042Ω - 40A D2PAK
MESH OVERLAY™ MOSFET
PRELIMINARY DATA
■
■
■
■
TYPE
VDSS
RDS(on)
ID
STB40NS15
150 V
<0.052Ω
40A
TYPICAL RDS(on) = 0.042Ω
EXTREMELY HIGH dv/dt CAPABILITY
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
DESCRIPTION
This powermos MOSFET is designed using the
company’s consolidated strip layout-based MESH
OVERLAY™ process. This technology matches
and improves the performances compared with
standard parts from various sources.
3
1
D 2PAK
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ HIGH CURRENT SWITCHING
■ UNINTERRUPTIBLE POWER SUPPLY (UPS)
■ PRIMARYSWITCH IN ISOLATED DC-DC
CONVERTERS
ABSOLUTE MAXIMUM RATINGS
Symbol
VDS
VDGR
VGS
ID
ID
IDM (● )
PTOT
Parameter
Value
Unit
Drain-source Voltage (VGS = 0)
150
V
Drain-gate Voltage (RGS = 20 kΩ)
150
V
Gate- source Voltage
±20
V
Drain Current (continuos) at TC = 25°C
40
A
Drain Current (continuos) at TC = 100°C
25
A
Drain Current (pulsed)
160
A
Total Dissipation at TC = 25°C
140
W
0.933
W/°C
Derating Factor
dv/dt
Peak Diode Recovery voltage slope
Tstg
Storage Temperature
Tj
Max. Operating Junction Temperature
9
V/ns
–65 to 175
°C
175
°C
(•)Pulse width limited by safe operating area
December 2001
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/7
STB40NS15
THERMAL DATA
Rthj-case
Thermal Resistance Junction-case Max
1.07
°C/W
Rthj-amb
Thermal Resistance Junction-ambient Max
62.5
°C/W
Maximum Lead Temperature For Soldering Purpose
300
°C
Tl
AVALANCHE CHARACTERISTICS
Symbol
Max Value
Unit
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
Parameter
40
A
EAS
Single Pulse Avalanche Energy
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
500
mJ
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ±20V
V(BR)DSS
Min.
Typ.
Max.
150
Unit
V
VDS = Max Rating, TC = 125 °C
1
µA
10
µA
±100
nA
ON (1)
Symbol
Parameter
Test Conditions
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250µA
RDS(on)
Static Drain-source On
Resistance
VGS = 10V, ID = 40 A
Min.
Typ.
Max.
Unit
2
3
4
V
0.044
0.052
Ω
Typ.
Max.
Unit
DYNAMIC
Symbol
gfs (1)
2/7
Parameter
Forward Transconductance
Test Conditions
VDS > ID(on) x RDS(on)max,
ID = 20A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
20
S
Ciss
Input Capacitance
2400
pF
Coss
Output Capacitance
380
pF
Crss
Reverse Transfer
Capacitance
160
pF
STB40NS15
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol
td(on)
tr
Parameter
Turn-on Delay Time
Rise Time
Test Conditions
Min.
Typ.
Max.
Unit
VDD = 75V, ID = 20A
RG = 4.7Ω, VGS = 10V
(see test circuit, Figure 3)
25
ns
45
ns
VDD = 120V, ID = 40A,
VGS = 10V
100
Qg
Total Gate Charge
110
nC
Qgs
Gate-Source Charge
17
nC
Qgd
Gate-Drain Charge
47
nC
SWITCHING OFF
Symbol
td(off)
Tf
tr(Voff)
tf
tc
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
85
ns
Fall Time
VDD = 75V, ID = 20A
RG = 4.7Ω, VGS = 10V
(see test circuit, Figure 3)
Off-voltage Rise Time
Fall Time
Cross-over Time
Vclamp = 120V, ID = 20 A,
RG = 4.7Ω, VGS = 10V
(see test circuit, Figure 5)
47
35
70
ns
ns
ns
Turn-off Delay Time
SOURCE DRAIN DIODE
Symbol
ISD
ISDM (2)
VSD (1)
trr
Qrr
IRRM
Max.
Unit
Source-drain Current
Parameter
40
A
Source-drain Current (pulsed)
160
A
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Test Conditions
Min.
Typ.
ISD = 40A, VGS = 0
ISD = 40A, di/dt = 100A/µs,
VDD = 50V, Tj = 150°C
(see test circuit, Figure 5)
1.5
270
200
1.5
V
ns
nC
A
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3/7
STB40NS15
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
4/7
STB40NS15
D2PAK MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
0.368
D1
E
8
0.315
10
E1
10.4
0.393
8.5
0.334
G
4.88
5.28
0.192
0.208
L
15
15.85
0.590
0.625
L2
1.27
1.4
0.050
0.055
L3
1.4
1.75
0.055
0.068
M
2.4
3.2
0.094
0.126
R
0.015
0º
8º
3
V2
0.4
5/7
1
STB40NS15
D2PAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
TAPE AND REEL SHIPMENT (suffix ”T4”)*
REEL MECHANICAL DATA
DIM.
mm
MIN.
A
DIM.
mm
inch
MIN.
MAX.
MIN.
MAX.
A0
10.5
10.7
0.413 0.421
B0
15.7
15.9
0.618 0.626
D
1.5
1.6
0.059 0.063
D1
1.59
1.61
0.062 0.063
E
1.65
1.85
0.065 0.073
F
11.4
11.6
0.449 0.456
K0
4.8
5.0
0.189 0.197
P0
3.9
4.1
0.153 0.161
P1
11.9
12.1
0.468 0.476
P2
1.9
2.1
R
50
1.574
T
0.25
0.35 0.0098 0.0137
W
23.7
24.3
* on sales type
6/7
0.075 0.082
0.933 0.956
MAX.
MIN.
330
B
1.5
C
12.8
D
20.2
G
24.4
N
100
T
TAPE MECHANICAL DATA
inch
MAX.
12.992
0.059
13.2
0.504 0.520
26.4
0.960 1.039
0795
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
STB40NS15
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
© 2001 STMicroelectronics – Printed in Italy – All Rights Reserved
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