STBR606/608 ® 50-60Hz RECTIFICATION BRIDGE MAJOR PRODUCT CHARACTERISTICS + IF(AV) 6A VRRM 600 V / 800 V VF (max) 1.05 V ~ ~ - FEATURES AND BENEFITS Dielectric strength of 2000V High Surge overload rating High Surge current capability UL94V0 Planar technology ■ - ■ ~~ + ■ ■ GBU STBR606/608 ■ DESCRIPTION Single-phase 6A Bridge for 50 & 60Hz rectification in Switch Mode Power Supplies. Applications: Home appliances, Automation, Telecommunications, PC, Servers. ABSOLUTE RATINGS (limiting values) Symbol VRRM Parameter STBR606 STBR608 600 800 Repetitive peak reverse voltage Unit V VRMS RMS Voltage 420 560 V VDC DC Blocking voltage 600 800 V IF(AV) Average Forward Current TC = 60°C IFSM Non repetitive surge peak forward current tp = 8.3 ms Single sine wave (JEDEC method) 6 A 175 A I2t Rating for Fusing (tp < 8.3ms) 127 A2S Tj Maximum operating junction temperature 150 °C - 50 to 150 °C Tstg Storage temperature range August 2001 - Ed: 4D 1/4 STBR606/608 THERMAL PARAMETERS Symbol Rth(j-c) Parameter Min. Typ. 7.4 Junction to case Rth(j-a) Junction to ambient Max. 8 Unit °C/W 35 °C/W ELECTRICAL CHARACTERISTICS Symbol VF Parameter IR C Test conditions Forward voltage drop IF = 6A Reverse leakage current per leg VR = VRRM Junction capacitance per leg (note 1) Min. Typ. Max. 1.05 Unit V Tj = 25°C 5 µA Tj = 125°C 50 µA 55 pF Note 1: Measured at 1MHz and applied reverse voltage of 4V. Fig. 1: Average power dissipation of bridge versus average output current. Fig. 2: Average output current versus ambient temperature (resistive load or inductive load) PF(av)(W) IF(av)(A) 7 12 11 IP / IF(av)=10 IP / IF(av)=20 IP / IF(av)=5 (capacitive load) Rth(j-a)=Rth(j-c) 6 10 9 5 8 Rth(j-a)=15°C/W IP / IF(av)=P (resistive load) 7 4 6 3 5 Rth(j-a)=35°C/W 4 2 3 2 1 1 Tamb(°C) IF(av)(A) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Fig. 3: Variation of thermal impedance junction to ambient versus pulse duration (printed circuit board epoxy FR4) 0 25 50 75 100 125 150 Fig. 4: Forward voltage drop versus forward current (typical values, per leg). IFM(A) Zth(j-a)(°C/W) 1000.0 100.0 Free air 100.0 10.0 Tj=125°C 10.0 Tj=25°C 1.0 1.0 VFM(V) tp(s) 0.1 0.1 1.E-02 2/5 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0.0 0.5 1.0 1.5 2.0 2.5 STBR606/608 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values, per leg). Fig. 6: Relative leakage current versus junction temperature (typical values). IR(µA) IR(µA) 1.E+01 1.E+01 VR=800V Tj=150°C 1.E+00 1.E+00 Tj=125°C 1.E-01 1.E-01 1.E-02 1.E-02 Tj=75°C 1.E-03 1.E-03 1.E-04 1.E-04 Tj=25°C Tj(°C) VR(V) 1.E-05 1.E-05 0 100 200 300 400 500 600 700 0 800 Fig. 7: Junction capacitance versus reverse voltage applied (typical values). 25 50 75 100 125 150 Fig. 8: Softness factor versus dIF/dt (typical values). C(pF) S(Softness factor) 100 1.6 F=1MHz Vosc=30mVRMS Tj=25°C IF=6A VR=400V Tj=125°C 1.4 1.2 1.0 10 0.8 0.6 IF S=[dIF/dt]/[dIR/dt] 0.4 VR(V) dIF/dt(A/µs) 1 t 0.2 1 10 100 1000 Fig. 9: Surge peak forward current versus number of cycles (per leg). IFSM(A) 180 160 tp=10ms 140 120 Non repetitive Tj initial=150°C 100 80 60 40 Repetitive Tj initial=50°C 20 Number of cycles 0 1 3/4 dIF/dt 10 100 1000 1 10 100 STBR606/608 PACKAGE MECHANICAL DATA GBU DIMENSIONS A J K C O O Q E F B - ~ ~ ØP + O Front Side G L H I D M N ■ ■ ■ ■ N N O REF. Millimeters Inches A B C D E F G H I J K L M N O P Q Min. Max. 21.8 22.3 18.3 18.8 3.2 typ. 45° 17.5 18 7.4 7.9 1.65 2.16 2.25 2.75 1.95 2.35 1.02 1.27 3.5 4.1 3.3 3.56 0.76 1 0.46 0.56 4.83 5.33 7° typ. 1.9 typ. 7° typ. Min. Max. 0.86 0.88 0.72 0.74 0.125 typ. 45° 0.69 0.71 0.29 0.31 0.065 0.085 0.089 0.108 0.077 0.093 0.04 0.05 0.14 0.16 0.13 0.14 0.03 0.04 0.018 0.022 0.19 0.21 7° typ. 0.075 typ. 7° typ. Ordering type Marking Package Weight Base qty Delivery mode STBR606 STBR606 GBU 4.0g 20 Tube STBR608 STBR608 GBU 4.0g 20 Tube Epoxy meets UL94,V0 Cooling method: C Recommended torque value: 0.8 m.N Maximum torque value: 1.0 m.N Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2001 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 4/4