STMICROELECTRONICS STD20NE06

STD20NE06
N - CHANNEL ENHANCEMENT MODE
” SINGLE FEATURE SIZE ” POWER MOSFET
TYPE
ST D20NE06
■
■
■
■
■
V DSS
R DS(on)
ID
60 V
< 0.040 Ω
20 A
TYPICAL RDS(on) = 0.032 Ω
EXCEPTIONAL dv/dt CAPABILITY
100% AVALANCHE TESTED
APPLICATION ORIENTED
CHARACTERIZATION
FOR THROUGH-HOLE VERSION CONTACT
SALES OFFICE
3
1
DESCRIPTION
This Power MOSFET is the latest development of
SGS-THOMSON unique ”Single Feature Size ”
strip-based process. The resulting transistor
shows extremely high packing density for low onresistance, rugged avalanche characteristics and
less critical alignment steps therefore a remarkable manufacturing reproducibility.
DPAK
TO-252
(Suffix ”T4”)
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■
SOLENOID AND RELAY DRIVERS
■
MOTOR CONTROL, AUDIO AMPLIFIERS
■
DC-DC CONVERTERS
■
AUTOMOTIVE ENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
Symbol
V DS
Parameter
Value
Uni t
Drain-source Voltage (V GS = 0)
60
V
V DGR
Drain- gate Voltage (R GS = 20 kΩ)
60
V
V GS
Gate-source Voltage
± 20
V
20**
A
Drain Current (continuous) at Tc = 100 C
17
A
Drain Current (pulsed)
80
A
50
W
0.33
W/ o C
7
V/ ns
o
ID
Drain Current (continuous) at Tc = 25 C
ID
o
IDM (•)
P t ot
o
Total Dissipation at Tc = 25 C
Derating F actor
dv/dt
T stg
Tj
Peak Diode Recovery voltage slope
Storage T emperature
Max. O perating Junction Temperature
(•) Pulse width limited by safe operating area
(**) Value limited only by the package
January 1998
-65 to 175
o
C
175
o
C
( 1) ISD ≤ 36 A, di/dt ≤ 300 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
1/8
STD20NE06
THERMAL DATA
R t hj-ca se
Rthj -amb
R thc- si nk
Tl
Thermal Resistance Junction-case
Max
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature For Soldering Purpose
o
3.0
100
1.5
275
C/W
oC/W
o
C/W
o
C
Max Valu e
Unit
AVALANCHE CHARACTERISTICS
Symb ol
Parameter
I AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max, δ < 1%)
20
A
E AS
Single Pulse Avalanche Energy
(starting Tj = 25 o C, I D = IAR , VDD = 25 V)
80
mJ
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symb ol
V (BR)DSS
I DSS
I GSS
Parameter
Drain-source
Breakdown Voltage
Test Cond ition s
I D = 250 µA
Gate-body Leakage
Current (V DS = 0)
Typ .
Max.
60
V GS = 0
Zero G ate Voltage
V DS = Max Rating
Drain Current (VGS = 0) V DS = Max Rating
o
C
Min.
Un it
V
T c = 125
V GS = ± 20 V
1
10
µA
µA
± 100
nA
ON (∗)
Symb ol
Parameter
Test Cond ition s
ID = 250 µA
V GS(th)
Gate Threshold
Voltage
R DS( on)
Static Drain-source On V GS = 10V
Resistance
ID(o n)
V DS = VGS
Min.
Typ .
Max.
Un it
2
3
4
V
0.032
0.04
Ω
ID = 10 A
On State Drain Current V DS > I D(on) x R DS(on) max
V GS = 10 V
20
A
DYNAMIC
Symb ol
g fs (∗)
C iss
C oss
C rss
2/8
Parameter
Test Cond ition s
Forward
Transconductance
V DS > I D(on) x R DS(on) max
Input Capacitance
Output Capacitance
Reverse T ransfer
Capacitance
V DS = 25 V
f = 1 MHz
I D =10 A
VGS = 0
Min.
Typ .
7
13
2115
260
65
Max.
Un it
S
2800
350
90
pF
pF
pF
STD20NE06
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symb ol
t d(on)
tr
(di/dt) on
Qg
Q gs
Q gd
Typ .
Max.
Un it
Turn-on Time
Rise Time
Parameter
V DD = 30 V
R G =4.7 Ω
Test Cond ition s
ID = 18 A
VGS = 10 V
28
85
40
115
ns
ns
Turn-on Current Slope
V DD = 48 V
R G = 47 Ω
ID = 36 A
VGS =10 V
250
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 48 V
I D = 36 A
Min.
V GS = 10 V
A/µs
50
13
18
70
nC
nC
nC
Typ .
Max.
Un it
12
25
40
16
35
55
ns
ns
ns
Typ .
Max.
Un it
20
80
A
A
SWITCHING OFF
Symb ol
t r(Vof f)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Cond ition s
Min.
V DD = 48 V I D = 36 A
R G =4.7 Ω VGS = 10 V
SOURCE DRAIN DIODE
Symb ol
I SD
I SDM (•)
V SD (∗)
t rr
Q rr
I RRM
Parameter
Test Cond ition s
Min.
Source-drain Current
Source-drain Current
(pulsed)
Forward On Voltage
I SD = 20 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 36 A
V DD = 30 V
V GS = 0
di/dt = 100 A/µs
o
Tj = 150 C
1.5
V
75
ns
245
nC
6.5
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Safe Operating Area
Thermal Impedance
3/8
STD20NE06
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
4/8
STD20NE06
Normalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
5/8
STD20NE06
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/8
STD20NE06
TO-252 (DPAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
2.2
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.9
0.025
0.035
B2
5.2
5.4
0.204
0.212
C
0.45
0.6
0.017
0.023
C2
0.48
0.6
0.019
0.023
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
4.4
4.6
0.173
0.181
H
9.35
10.1
0.368
0.397
L2
0.8
L4
0.031
0.6
1
0.023
0.039
A1
C2
A
H
A2
C
DETAIL ”A”
L2
D
=
1
=
G
2
=
=
=
E
=
B2
3
B
DETAIL ”A”
L4
0068772-B
7/8
STD20NE06
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
 1998 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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