STMICROELECTRONICS STD90NH02L

STD90NH02L
N-CHANNEL 24V - 0.0052 Ω - 60A DPAK/IPAK
STripFET™ III POWER MOSFET
TYPE
STD90NH02L
■
■
■
■
■
■
■
■
VDSS
RDS(on)
ID
24 V
< 0.006 Ω
60 A(2)
TYPICAL RDS(on) = 0.0052 Ω @ 10 V
TYPICAL RDS(on) = 0.007 Ω @ 5 V
RDS(ON) * Qg INDUSTRY’s BENCHMARK
CONDUCTION LOSSES REDUCED
SWITCHING LOSSES REDUCED
LOW THRESHOLD DEVICE
THROUGH-HOLE IPAK (TO-251) POWER
PACKAGE IN TUBE (SUFFIX “-1")
SURFACE-MOUNTING DPAK (TO-252)
POWER PACKAGE IN TAPE & REEL
(SUFFIX “T4")
3
3
1
2
1
IPAK
TO-251
(Suffix “-1”)
DPAK
TO-252
(Suffix “T4”)
INTERNAL SCHEMATIC DIAGRAM
DESCRIPTION
The STD90NH02L utilizes the latest advanced design
rules of ST’s proprietary STripFET™ technology. This is
suitable fot the most demanding DC-DC converter
application where high efficiency is to be achieved.
APPLICATIONS
■ SPECIFICALLY DESIGNED AND OPTIMISED
FOR HIGH EFFICIENCY DC/DC CONVERTES
ABSOLUTE MAXIMUM RATINGS
Symbol
Vspike(1)
VDS
VDGR
Parameter
Value
Unit
Drain-source Voltage Rating
30
V
Drain-source Voltage (VGS = 0)
24
V
Drain-gate Voltage (RGS = 20 kΩ)
24
V
± 20
V
Drain Current (continuous) at TC = 25°C
60
A
Drain Current (continuous) at TC = 100°C
60
A
Drain Current (pulsed)
240
A
Total Dissipation at TC = 25°C
95
W
Derating Factor
0.63
W/°C
Single Pulse Avalanche Energy
600
mJ
-55 to 175
°C
VGS
Gate- source Voltage
ID(2)
ID(2)
IDM(3)
Ptot
EAS (4)
Tstg
Tj
Storage Temperature
Max. Operating Junction Temperature
September 2003
1/12
STD90NH02L
THERMAL DATA
Rthj-case
Rthj-amb
Tl
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
Max
Max
1.58
100
275
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
V(BR)DSS
IDSS
IGSS
Parameter
Test Conditions
Drain-source
Breakdown Voltage
ID = 25 mA, VGS = 0
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = 20 V
VDS = 20 V
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20V
Min.
Typ.
Max.
24
Unit
V
TC = 125°C
1
10
µA
µA
±100
nA
ON (5)
Symbol
Parameter
Test Conditions
VGS(th)
Gate Threshold Voltage
VDS = VGS
ID = 250 µA
RDS(on)
Static Drain-source On
Resistance
VGS = 10 V
VGS = 5 V
ID = 30 A
ID = 15 A
Min.
Typ.
Max.
Unit
1
1.8
2.5
V
0.0052
0.007
0.006
0.011
Ω
Ω
Typ.
Max.
Unit
DYNAMIC
Symbol
Test Conditions
gfs (5)
Forward Transconductance
VDS = 10 V
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
VDS = 15V f = 1 MHz VGS = 0
Gate Input Resistance
f = 1 MHz Gate DC Bias = 0
Test Signal Level = 20 mV
Open Drain
RG
2/12
Parameter
ID = 30 A
Min.
40
S
2850
800
120
pF
pF
pF
1
Ω
STD90NH02L
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
td(on)
tr
Turn-on Delay Time
Rise Time
ID = 30 A
VDD = 10 V
RG = 4.7 Ω
VGS = 10 V
(Resistive Load, Figure 3)
13
75
Qg
Qgs
Qgd
Total Gate Charge Source
Gate Charge
Gate-Drain Charge
VDD= 10 V ID= 60 A VGS= 10 V
47.5
10
7
Qoss (6)
Output Charge
VDS= 16 V
VGS= 0 V
18.8
nC
Qgls (7)
Third-quadrant Gate Charge
VDS< 0 V
VGS= 10 V
44
nC
ns
ns
64
nC
nC
nC
SWITCHING OFF
Symbol
td(off)
tf
Parameter
Turn-off Delay Time
Fall Time
Test Conditions
Min.
ID = 30 A
VDD = 10 V
RG = 4.7Ω,
VGS = 10 V
(Resistive Load, Figure 3)
Typ.
Max.
Unit
50
18
24.3
ns
ns
Typ.
Max.
Unit
60
240
A
A
1.3
V
47
47
ns
nC
A
SOURCE DRAIN DIODE
Symbol
Parameter
ISD
ISDM
Source-drain Current
Source-drain Current (pulsed)
VSD (5)
trr
Qrr
IRRM
Test Conditions
Forward On Voltage
ISD = 30 A
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
di/dt = 100A/µs
ISD = 60 A
VDD = 16 V
Tj = 150°C
(see test circuit, Figure 5)
Min.
VGS = 0
35
35
2
(1) Garanted when external Rg=4.7 Ω and tf < tfmax.
(2) Value limited by wire bonding
(3) Pulse width limited by safe operating area.
(4) Starting Tj = 25 oC, ID = 30A, VDD = 15V .
(5) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
(6) Q oss = Coss*∆ Vin , Coss = Cgd + Cds . See Appendix A
(7) Gate charge for synchronous operation
Safe Operating Area
Thermal Impedance
3/12
STD90NH02L
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
4/12
STD90NH02L
Normalized Gate Threshold Voltage vs Temperature
Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics
Normalized Breakdown Voltage vs Temperature.
.
.
5/12
STD90NH02L
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For Resistive
Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/12
STD90NH02L
TO-251 (IPAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
2.2
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A3
0.7
1.3
0.027
0.051
B
0.64
0.9
0.025
0.031
B2
5.2
5.4
0.204
0.212
B3
0.85
B5
0.033
0.3
0.012
B6
0.95
0.037
C
0.45
0.6
0.017
0.023
C2
0.48
0.6
0.019
0.023
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
4.4
4.6
0.173
0.181
H
15.9
16.3
0.626
0.641
L
9
9.4
0.354
0.370
L1
0.8
1.2
0.031
0.047
L2
0.8
1
0.031
0.039
A1
C2
A3
A
C
H
B
B3
=
1
=
2
G
=
=
=
E
B2
=
3
B5
L
D
B6
L2
L1
0068771-E
7/12
STD90NH02L
TO-252 (DPAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
2.2
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.9
0.025
0.035
B2
5.2
5.4
0.204
0.212
C
0.45
0.6
0.017
0.023
C2
0.48
0.6
0.019
0.023
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
4.4
4.6
0.173
0.181
H
9.35
10.1
0.368
0.397
L2
0.8
L4
0.031
0.6
1
0.023
0.039
A1
C2
A
H
A2
C
DETAIL "A"
L2
D
=
1
=
G
2
=
=
=
E
=
B2
3
B
DETAIL "A"
L4
0068772-B
8/12
STD90NH02L
9/12
STD90NH02L
APPENDIX A
Buck Converter: Power Losses Estimation
SW1
SW2
The power losses associated with the FETs in a Synchronous Buck converter can be
estimated using the equations shown in the table below. The formulas give a good
approximation, for the sake of performance comparison, of how different pairs of devices
affect the converter efficiency. However a very important parameter, the working
temperature, is not considered. The real device behavior is really dependent on how the
heat generated inside the devices is er moved to allow for a safer working junction
temperature.
The low side (SW2) device requires:
•
•
•
•
•
Very low RDS(on) to reduce conduction losses
Small Qgls to reduce the gate charge losses
Small Coss to reduce losses due to output capacitance
Small Qrr to reduce losses on SW1 during its turn-on
The Cgd/Cgs ratio lower than Vth/Vgg ratio especially with low drain to source
voltage to avoid the cross conduction phenomenon;
The high side (SW1) device requires:
•
Small Rg and Ls to allow higher gate current peak and to limit the voltage
feedback on the gate
•
Small Qg to have a faster commutation and to reduce gate charge losses
•
Low RDS(on) to reduce the conduction losses.
10/12
STD90NH02L
Pconduction
Pswitching
Low Side Switch (SW2)
R DS(on)SW1 * I 2L * d
R DS(on)SW2 * I 2L * (1 − d )
Vin * (Q gsth(SW1) + Q gd(SW1) ) * f *
IL
Ig
Zero Voltage Switching
Recovery
Not Applicable
Conduction
Not Applicable
Vf(SW2) * I L * t deadtime * f
Pgate(Q G )
Q g(SW1) * Vgg * f
Q gls(SW2) * Vgg * f
PQoss
Vin * Q oss(SW1) * f
Vin * Q oss(SW2) * f
2
2
Pdiode
Parameter
d
Qgsth
Qgls
Pconduction
Pswitching
Pdiode
Pgate
PQoss
1
High Side Switch (SW1)
1
Vin * Q rr(SW2) * f
Meaning
Duty-cycle
Post threshold gate charge
Third quadrant gate charge
On state losses
On-off transition losses
Conduction and reverse recovery diode losses
Gate drive losses
Output capacitance losses
Dissipated by SW1 during turn-on
11/12
STD90NH02L
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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12/12