STMICROELECTRONICS STL22NF10

STL22NF10
N-CHANNEL 100V - 0.055 Ω - 22A PowerFLAT™
LOW GATE CHARGE STripFET™ II MOSFET
■
■
■
■
■
TYPE
VDSS
RDS(on)
ID
STL22NF10
100 V
<0.060 Ω
22 A(1)
TYPICAL RDS(on) = 0.055 Ω
IMPROVED DIE-TO-FOOTPRINT RATIO
VERY LOW PROFILE PACKAGE (1mm MAX)
VERY LOW THERMAL RESISTANCE
VERY LOW GATE CHARGE
PowerFLAT™(5x5)
DESCRIPTION
This application specific Power MOSFET is the second
generation of STMicroelectronis unique "STripFET™"
technology. The resulting transistor shows extremely low
on-resistance and minimal gate charge. The new
PowerFLAT™ package allows a significant reduction in
board space without compromising performance.
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ HIGH-EFFICIENCY ISOLATED DC-DC
CONVERTERS
■ TELECOM AND AUTOMOTIVE
ABSOLUTE MAXIMUM RATINGS
Symbol
VDS
Parameter
Drain-source Voltage (VGS = 0)
Unit
100
V
Drain-gate Voltage (RGS = 20 kΩ)
100
V
VGS
Gate- source Voltage
± 20
V
ID(2)
Drain Current (continuous) at TC = 25°C (Steady State)
5.3
A
ID(2)
Drain Current (continuous) at TC = 100°C
3.8
A
IDM(3)
Drain Current (pulsed)
22
A
Ptot(2)
Total Dissipation at TC = 25°C (Steady State)
4
W
Ptot(1)
Total Dissipation at TC = 25°C
70
W
VDGR
Derating Factor
0.03
W/°C
dv/dt (5)
Peak Diode Recovery voltage slope
16
V/ns
EAS (6)
Single Pulse Avalanche Energy
82
mJ
-55 to 150
°C
Tstg
Tj
February 2003
.
Value
Storage Temperature
Operating Junction Temperature
1/8
STL22NF10
THERMAL DATA
Rthj-F
Rthj-pcb(4)
(*)Thermal Resistance Junction-Foot (Drain)
Thermal Operating Junction-pcb
1.8
31.5
°C/W
°C/W
(*) Mounted on FR-4 board (t [ 10 sec.)
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20 V
V(BR)DSS
Min.
Typ.
Max.
100
Unit
V
1
10
µA
µA
±100
nA
Max.
Unit
ON (7)
Symbol
Parameter
Test Conditions
VGS(th)
Gate Threshold Voltage
VDS = VGS
RDS(on)
Static Drain-source On
Resistance
VGS = 10 V
ID = 250 µA
Min.
Typ.
2
ID = 11 A
V
0.055
0.060
Ω
Typ.
Max.
Unit
DYNAMIC
Symbol
2/8
Parameter
Test Conditions
gfs (7)
Forward Transconductance
VDS = 20 V
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
VDS = 25V, f = 1 MHz, VGS = 0
ID = 11 A
Min.
16
S
885
130
56
pF
pF
pF
STL22NF10
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
td(on)
tr
Turn-on Delay Time
Rise Time
ID = 11 A
VDD = 50 V
RG = 4.7 Ω
VGS = 10 V
(Resistive Load, Figure 3)
20
45
Qg
Qgs
Qgd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD= 80V ID= 22A VGS=10V
30
6
10
40
nC
nC
nC
Typ.
Max.
Unit
ns
ns
SWITCHING OFF
Symbol
td(off)
tf
Parameter
Turn-off Delay Time
Fall Time
Test Conditions
Min.
ID = 11 A
VDD = 50 V
RG = 4.7Ω,
VGS = 10 V
(Resistive Load, Figure 3)
45
10
ns
ns
SOURCE DRAIN DIODE
Symbol
Parameter
ISD
ISDM
Source-drain Current
Source-drain Current (pulsed)
VSD (7)
trr
Qrr
IRRM
Test Conditions
Forward On Voltage
ISD = 22 A
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
di/dt = 100A/µs
ISD =22 A
VDD = 30 V
Tj = 150°C
(see test circuit, Figure 5)
Min.
Typ.
VGS = 0
100
375
7.5
Max.
Unit
5.3
22
A
A
1.3
V
ns
nC
A
(1) The value is rated according Rthj-F.
(2) The value is rated according Rthj-pcb.
(3) Pulse width limited by safe operating area.
(4) When Mounted on FR-4 Board of 1 inch², 2 oz Cu, t<10s.
(5) ISD ≤22A, di/dt ≤300A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX.
(6) Starting Tj = 25 oC, ID = 11 A, VDD = 30V.
(7) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
Safe Operating Area
Thermal Impedance
3/8
STL22NF10
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
4/8
STL22NF10
Normalized Gate Threshold Voltage vs Temperature
Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics
Normalized Breakdown Voltage vs Temperature.
.
.
5/8
STL22NF10
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For Resistive
Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/8
STL22NF10
7/8
STL22NF10
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is registered trademark of STMicroelectronics
 2003 STMicroelectronics - All Rights Reserved
All other names are the property of their respective owners.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.
http://www.st.com
8/8