STMICROELECTRONICS STP20NE10

STP20NE10

N - CHANNEL 100V - 0.07Ω - 20A - TO-220
STripFET MOSFET
TYPE
ST P20NE10
■
■
■
■
V DSS
R DS(on)
ID
100 V
< 0.1 Ω
20 A
TYPICAL RDS(on) = 0.07 Ω
EXCEPTIONAL dv/dt CAPABILITY
100% AVALANCHE TESTED
APPLICATION ORIENTED
CHARACTERIZATION
DESCRIPTION
This Power MOSFET is the latest development of
SGS-THOMSON unique ”Single Feature Size ”
strip-based process.The resulting transistor
shows extremely high packing density for low onresistance, rugged avalanche characteristics and
less critical alignment steps therefore a remarkable manufacturing reproducibility.
1
2
3
TO-220
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■
SOLENOID AND RELAY DRIVERS
■
MOTOR CONTROL, AUDIO AMPLIFIERS
■
DC-DC CONVERTERS
■
AUTOMOTIVE ENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
Symbol
Value
Uni t
Drain-source Voltage (V GS = 0)
100
V
V DGR
Drain- gate Voltage (R GS = 20 kΩ)
100
V
V GS
Gate-source Voltage
± 20
V
V DS
Parameter
o
ID
Drain Current (continuous) at Tc = 25 C
20
A
ID
Drain Current (continuous) at Tc = 100 oC
14
A
Drain Current (pulsed)
80
A
Total Dissipation at Tc = 25 C
90
W
Derating F actor
0.6
W/ o C
7
V/ ns
IDM (•)
P t ot
dv/dt( 1 )
T stg
Tj
o
Peak Diode Recovery voltage slope
Storage T emperature
Max. O perating Junction Temperature
(•) Pulse width limited by safe operating area
July 1998
-65 to 175
o
C
175
o
C
( 1) ISD ≤ 20 A, di/dt ≤ 300 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
1/8
STP20NE10
THERMAL DATA
R t hj-ca se
Rthj -amb
R thc- si nk
Tl
Thermal Resistance Junction-case
Max
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature For Soldering Purpose
o
1.67
62.5
0.5
300
C/W
oC/W
o
C/W
o
C
Max Valu e
Unit
20
A
170
mJ
AVALANCHE CHARACTERISTICS
Symb ol
Parameter
I AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max, δ < 1%)
E AS
Single Pulse Avalanche Energy
(starting Tj = 25 o C, I D = IAR , VDD = 30 V)
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symb ol
V (BR)DSS
I DSS
I GSS
Parameter
Drain-source
Breakdown Voltage
Test Cond ition s
I D = 250 µA
Gate-body Leakage
Current (V DS = 0)
Typ .
Max.
100
V GS = 0
Zero G ate Voltage
V DS = Max Rating
Drain Current (VGS = 0) V DS = Max Rating
o
C
Min.
Un it
V
T c = 125
V GS = ± 20 V
1
10
µA
µA
± 100
nA
ON (∗)
Symb ol
Parameter
Test Cond ition s
ID = 250 µA
V GS(th)
Gate Threshold
Voltage
R DS( on)
Static Drain-source On V GS = 10V
Resistance
ID(o n)
V DS = VGS
Min.
Typ .
Max.
Un it
2
3
4
V
0.07
0.1
Ω
ID = 10 A
On State Drain Current V DS > I D(on) x R DS(on) max
V GS = 10 V
20
A
DYNAMIC
Symb ol
g fs (∗)
C iss
C oss
C rss
2/8
Parameter
Test Cond ition s
Forward
Transconductance
V DS > I D(on) x R DS(on) max
Input Capacitance
Output Capacitance
Reverse T ransfer
Capacitance
V DS = 25 V
f = 1 MHz
I D =10 A
VGS = 0
Min.
Typ .
Max.
6
Un it
S
1600
180
50
2100
250
70
pF
pF
pF
STP20NE10
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symb ol
Typ .
Max.
Un it
t d(on)
tr
Turn-on Time
Rise Time
Parameter
V DD = 30 V
ID = 10 A
VGS = 10 V
R G =4.7 Ω
(see test circuit, figure 3)
Test Cond ition s
17
37
23
50
ns
ns
Qg
Q gs
Q gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 80 V
38
10
12
50
nC
nC
nC
Typ .
Max.
Un it
11
18
32
15
25
44
ns
ns
ns
Typ .
Max.
Un it
16
64
A
A
1.5
V
I D = 20 A
Min.
V GS = 10 V
SWITCHING OFF
Symb ol
t r(Vof f)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Cond ition s
Min.
V DD = 80 V I D = 20 A
R G =4.7 Ω VGS = 10 V
(see test circuit, figure 5)
SOURCE DRAIN DIODE
Symb ol
Parameter
Test Cond ition s
I SD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward On Voltage
I SD = 20 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
di/dt = 100 A/µs
I SD = 20 A
o
Tj = 150 C
V DD = 30 V
(see test circuit, figure 5)
t rr
Q rr
I RRM
Min.
V GS = 0
110
ns
440
µC
8
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Safe Operating Area
Thermal Impedance
3/8
STP20NE10
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
4/8
STP20NE10
Normalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
5/8
STP20NE10
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/8
STP20NE10
TO-220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
0.050
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
G1
2.4
2.7
0.094
0.106
H2
10.0
10.40
0.393
0.409
14.0
0.511
0.551
L2
16.4
L4
0.645
13.0
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
L9
3.5
3.93
0.137
0.154
DIA.
3.75
3.85
0.147
0.151
D1
C
D
A
E
L5
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9
L7
L6
L4
P011C
7/8
STP20NE10
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical compone nts in life support devices or systems without express written approval of STMicroelectronics.
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 1998 STMicroelectronics – Printed in Italy – All Rights Reserved
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