STMICROELECTRONICS STP4NC60AFP

STP4NC60A - STP4NC60AFP
STB4NC60A-1
N-CHANNEL 600V - 1.8Ω - 4.2A TO-220/TO-220FP/I2PAK
PowerMesh™II MOSFET
TYPE
STP4NC60A
STP4NC60AFP
STB4NC60A-1
■
■
■
■
■
VDSS
RDS(on)
ID
600V
600V
600V
< 2Ω
< 2Ω
< 2Ω
4.2A
4.2A
4.2A
TYPICAL RDS(on) = 1.8Ω
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
NEW HIGH VOLTAGE BENCHMARK
GATE CHARGE MINIMIZED
DESCRIPTION
The PowerMESH™II is the evolution of the first
generation of MESH OVERLAY™. The layout refinements introduced greatly improve the Ron*area
figure of merit while keeping the device at the leading edge for what concerns swithing speed, gate
charge and ruggedness.
3
1
TO-220
2
TO-220FP
12
3
(Tabless TO-220)
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
■ SWITH MODE POWER SUPPLIES (SMPS)
■ DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVERS
■
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
STP(B)4NC60A(-1)
VDS
VDGR
VGS
Unit
STP4NC60AFP
Drain-source Voltage (VGS = 0)
600
V
Drain-gate Voltage (RGS = 20 kΩ)
600
V
Gate- source Voltage
±30
V
ID
Drain Current (continuos) at TC = 25°C
4.2
4.2(*)
A
ID
Drain Current (continuos) at TC = 100°C
2.6
2.6(*)
A
Drain Current (pulsed)
16.8
16.8(*)
A
Total Dissipation at TC = 25°C
100
35
W
Derating Factor
0.8
0.28
W/°C
Peak Diode Recovery voltage slope
3.5
3.5
V/ns
-
2500
V
IDM (●)
PTOT
dv/dt(1)
VISO
Insulation Withstand Voltage (DC)
Tstg
Storage Temperature
Tj
Max. Operating Junction Temperature
(•)Pulse width limited by safe operating area
(1)ISD ≤4.2A, di/dt ≤300A/µs, VDD ≤ V (BR)DSS, Tj ≤ T JMAX.
July 2001
–60 to 150
°C
(*)Limited only by maximum Temperature allowed
1/10
STP4NC60A/FP/STB4NC60A-1
THERMAL DATA
TO-220/I2PAK
TO-220FP
1.25
3.57
Rthj-case
Thermal Resistance Junction-case Max
Rthj-amb
Thermal Resistance Junction-ambient Max
62.5
°C/W
Maximum Lead Temperature For Soldering Purpose
300
°C
Tl
°C/W
AVALANCHE CHARACTERISTICS
Symbol
Parameter
Max Value
Unit
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
4.2
A
EAS
Single Pulse Avalanche Energy
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
250
mJ
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ±30V
V(BR)DSS
Min.
Typ.
Max.
600
Unit
V
VDS = Max Rating, TC = 125 °C
1
µA
50
µA
±100
nA
Typ.
Max.
Unit
ON (1)
Symbol
VGS(th)
RDS(on)
Parameter
Test Conditions
Gate Threshold Voltage
VDS = VGS, ID = 250µA
Static Drain-source On
Resistance
VGS = 10V, ID =1.5 A
Min.
2
3
4
V
1.8
2
Ω
Typ.
Max.
Unit
DYNAMIC
Symbol
gfs (1)
2/10
Parameter
Forward Transconductance
Test Conditions
VDS > ID(on) x RDS(on)max,
ID = 2A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
3.7
S
475
pF
Ciss
Input Capacitance
Coss
Output Capacitance
72
pF
Crss
Reverse Transfer
Capacitance
10
pF
STP4NC60A/FP/STB4NC60A-1
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol
td(on)
tr
Parameter
Turn-on Delay Time
Rise Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Test Conditions
Min.
VDD = 300V, ID = 2A
RG = 4.7Ω ,VGS = 10V
(see test circuit, Figure 3)
VDD = 480V, ID = 4A,
VGS = 10V
Typ.
Max.
Unit
14
ns
14
ns
16.5
21.1
nC
2.5
nC
9
nC
SWITCHING OFF
Symbol
tr(Voff)
Parameter
Off-voltage Rise Time
tf
Fall Time
tc
Cross-over Time
Test Conditions
Min.
VDD = 480V, ID = 4A,
RG = 4.7Ω, VGS = 10V
(see test circuit, Figure 5)
Typ.
Max.
Unit
15
ns
19
ns
24
ns
SOURCE DRAIN DIODE
Symbol
ISD
Parameter
Test Conditions
Min.
Typ.
Source-drain Current
ISDM (2)
Source-drain Current (pulsed)
VSD (1)
Forward On Voltage
ISD = 4.2A, VGS = 0
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD = 4A, di/dt = 100A/µs,
VDD = 100V, Tj = 150°C
(see test circuit, Figure 5)
IRRM
Reverse Recovery Current
Max.
Unit
4.2
A
16.8
A
1.6
V
600
ns
2.7
µC
9
A
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Safe Operating Area for TO-220/I2PAK
Safe Operating Area for TO-220FP
3/10
STP4NC60A/FP/STB4NC60A-1
Thermal Impedance for TO-220/I2PAK
Thermal Impedance for TO-220FP
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
4/10
STP4NC60A/FP/STB4NC60A-1
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized Gate Thereshold Voltage vs Temp.
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
5/10
STP4NC60A/FP/STB4NC60A-1
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/10
STP4NC60A/FP/STB4NC60A-1
TO-220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
0.050
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
G1
2.4
2.7
0.094
0.106
H2
10.0
10.40
0.393
0.409
L2
16.4
0.645
13.0
14.0
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
L9
3.5
3.93
0.137
0.154
DIA.
3.75
3.85
0.147
0.151
D1
C
D
A
E
L4
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9
L7
L6
L4
P011C
7/10
STP4NC60A/FP/STB4NC60A-1
TO-220FP MECHANICAL DATA
mm
DIM.
MIN.
inch
MAX.
MIN.
A
4.4
TYP.
4.6
0.173
TYP.
MAX.
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
28.6
30.6
1.126
1.204
L4
9.8
10.6
0.385
0.417
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
L2
16
0.630
B
D
A
E
L3
L3
L6
F2
H
G
G1
¯
F
F1
L7
1 2 3
L2
8/10
L4
STP4NC60A/FP/STB4NC60A-1
TO-262 (I2PAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
0.368
e
2.4
2.7
0.094
0.106
E
10
10.4
0.393
0.409
L
13.1
13.6
0.515
0.531
L1
3.48
3.78
0.137
0.149
L2
1.27
1.4
0.050
0.055
E
e
B
B2
C2
A1
A
C
A
L1
L2
D
L
P011P5/E
9/10
STP4NC60A/FP/STB4NC60A-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
© 2000 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
10/10