STMICROELECTRONICS STPS140U

STPS140
®
POWER SCHOTTKY RECTIFIER
Table 1: Main Product Characteristics
IF(AV)
1A
VRRM
40 V
Tj (max)
150°C
VF(max)
0.5 V
FEATURES AND BENEFITS
■
■
■
■
■
SMA
(JEDEC DO-214AC)
STPS140A
Very small conduction losses
Negligible switching losses
Low forward voltage drop
Surface mount miniature packages
Avalanche capability specified
SMB
(JEDEC DO-214AA)
STPS140U
DESCRIPTION
Table 2: Order Codes
Part Number
STPS140A
STPS140U
Single chip Schottky rectifiers suited to Switched
Mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMA and SMB, this device is
especially intended for surface mounting and used
in low voltage, high frequency inverters, free
wheeling and polarity protection applications.
Marking
S140
G14
Table 3: Absolute Ratings (limiting values)
Symbol
Parameter
VRRM Repetitive peak reverse voltage
IF(RMS) RMS forward voltage
Value
40
Unit
V
7
A
SMA
TL = 130°C δ = 0.5
SMB
TL = 135°C δ = 0.5
1
A
Surge non repetitive forward current
tp = 10ms sinusoidal
60
A
IRRM
Repetitive peak reverse current
tp = 2µs F = 1kHz square
1
A
IRSM
Non repetitive peak reverse current
tp = 100µs square
1
A
PARM
Repetitive peak avalanche power
tp = 1µs Tj = 25°C
IF(AV)
Average forward current
IFSM
Tstg
Tj
dV/dt
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
900
W
-65 to + 150
°C
150
10000
°C
V/µs
1
dPtot
* : --------------- > -------------------------- thermal runaway condition for a diode on its own heatsink
dTj
Rth ( j – a )
August 2004
REV. 8
1/7
STPS140
Table 4: Thermal Resistance
Symbol
Parameter
Rth(j-l)
Value
30
25
SMA
SMB
Junction to lead
Unit
°C/W
Table 5: Static Electrical Characteristics
Symbol
Parameter
Tests conditions
Tj = 25°C
VR = VRRM
Reverse leakage current
Tj = 100°C
IR *
Tj = 25°C
VF **
Tj = 125°C
Forward voltage drop
Tj = 25°C
Tj = 125°C
Min.
Typ
Max.
12
Unit
µA
0.25
2
mA
0.55
IF = 1A
0.43
0.45
V
0.65
IF = 2A
0.53
0.6
* tp = 5 ms, δ < 2%
Pulse test:
** tp = 380 µs, δ < 2%
2
To evaluate the conduction losses use the following equation: P = 0.4 x IF(AV) + 0.10 IF (RMS)
Figure 1: Average forward power dissipation
versus average forward current
Figure 2: Average forward current versus
ambient temperature (δ = 0.5)
IF(AV)(A)
PF(AV)(W)
1.2
0.7
δ = 0.05
0.6
δ = 0.1
δ = 0.2
Rth(j-a)=Rth(j-I)
δ = 0.5
1.0
0.5
0.4
SMA
Rth(j-a)=100°C/W
S(CU)=1.5cm2
0.8
δ=1
0.6
SMB
Rth(j-a)=80°C/W
S(CU)=1.5cm2
0.3
0.4
0.2
T
T
0.2
0.1
IF(AV)(A)
δ=tp/T
tp
0.0
δ=tp/T
0.0
0.0
0.2
0.4
0.6
0.8
1.0
Figure 3: Normalized avalanche
derating versus pulse duration
1.2
power
0
Tamb(°C)
tp
25
50
75
100
125
Figure 4: Normalized avalanche
derating versus junction temperature
PARM(tp)
PARM(1µs)
150
power
PARM(tp)
PARM(25°C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
0.001
0.01
2/7
Tj(°C)
tp(µs)
0.1
1
0
10
100
1000
25
50
75
100
125
150
STPS140
Figure 5: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMA)
Figure 6: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMB)
IM(A)
IM(A)
8
8
7
7
6
6
5
Ta=25°C
5
Ta=25°C
4
4
Ta=50°C
Ta=50°C
3
2
3
IM
1
t
t(s)
δ=0.5
Ta=100°C
2
Ta=100°C
IM
1
0
t
t(s)
δ=0.5
0
1E-3
1E-2
1E-1
1E+0
Figure 7: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMA)
1E-3
1E-2
1E-1
1E+0
Figure 8: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMB)
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
δ = 0.5
δ = 0.5
0.5
0.5
0.4
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
Single pulse
T
δ=tp/T
tp(s)
0.0
1E-2
1E-1
1E+0
tp
0.3
δ = 0.2
0.2
δ = 0.1
0.1
Single pulse
T
δ=tp/T
tp(s)
0.0
1E+1
1E+2
Figure 9: Reverse leakage current versus
reverse voltage applied (typical values)
1E-2
1E-1
1E+0
1E+1
tp
1E+3
1E+2
Figure 10: Junction capacitance versus
reverse voltage applied (typical values)
IR(µA)
C(pF)
1E+3
200
Tj=125°C
F=1MHz
Tj=25°C
1E+2
100
Tj=75°C
1E+1
50
1E+0
Tj=25°C
20
1E-1
VR(V)
VR(V)
10
1E-2
0
5
10
15
20
25
30
35
40
1
2
5
10
20
50
3/7
STPS140
Figure 11: Forward voltage drop versus
forward current (maximum values)
Figure 12: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA)
IFM(A)
Rth(j-a)(°C/W)
1E+1
140
Tj=125°C
P=1.5W
120
100
1E+0
80
60
1E-1
40
20
S(Cu)(cm²)
VFM(V)
0
1E-2
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Figure 13: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMB)
Rth(j-a)(°C/W)
120
P=1.5W
100
80
60
40
20
S(Cu)(cm²)
0
0
4/7
1
2
3
4
5
0
1
2
3
4
5
STPS140
Figure 14: SMA Package Mechanical Data
DIMENSIONS
REF.
E1
D
E
A1
A2
C
L
b
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.03
0.075
0.080
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.41
0.006
0.016
E
4.80
5.60
0.189
0.220
E1
3.95
4.60
0.156
0.181
D
2.25
2.95
0.089
0.116
L
0.75
1.60
0.030
0.063
Figure 15: SMA Foot Print Dimensions
(in millimeters)
1.65
1.45
2.40
1.45
5/7
STPS140
Figure 16: SMB Package Mechanical Data
DIMENSIONS
REF.
E1
D
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.41
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.60
0.030
0.063
E
A1
A2
C
L
b
Figure 17: SMB Foot Print Dimensions
(in millimeters)
2.3
1.52
6/7
2.75
1.52
STPS140
Table 6: Ordering Information
Ordering type
STPS140A
STPS140U
■
■
Marking
S140
G14
Package
SMA
SMB
Weight
0.068 g
0.107 g
Base qty
5000
2500
Delivery mode
Tape & reel
Tape & reel
Band indicates cathode
Epoxy meets UL94, V0
Table 7: Revision History
Date
Revision
Description of Changes
Jul-2003
7
Last update.
Aug-2004
8
SMA package dimensions update. Reference A1 max.
changed from 2.70mm (0.106inc.) to 2.03mm (0.080).
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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