STMICROELECTRONICS STPS3030CG-TR

STPS3030CT/CG/CR
®
LOW DROP POWER SCHOTTKY RECTIFIER
MAJOR PRODUCTS CHARACTERISTICS
A1
IF(AV)
2 x 15 A
VRRM
30 V
Tj (max)
150°C
VF (max)
0.42 V
FEATURES AND BENEFITS
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
EXTREMELY FAST SWITCHING
LOW FORWARD VOLTAGE DROP FOR
HIGHER EFFICIENCY
LOW THERMAL RESISTANCE
AVALANCHE CAPABILITY SPECIFIED
DESCRIPTION
Dual Schottky rectifier suited for switch Mode
Power Supply and high frequency DC to DC
converters.
Packaged in TO-220AB, D2PAK and I2PAK, this
device is intended for use in low voltage high
frequency inverters, free wheeling and polarity
protection applications.
K
A2
K
A2
■
A1
■
■
■
A1
K
A2
TO-220AB
STPS3030CT
D2PAK
STPS3030CG
■
■
K
A1
A2
I2PAK
STPS3030CR
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
Parameter
VRRM Repetitive peak reverse voltage
IF(RMS) RMS forward current
Value
30
Unit
V
30
A
15
30
A
IF(AV)
Average forward
current
Tc = 135°C
δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
250
A
IRRM
Peak repetitive reverse current
tp=2 µs square F=1kHz
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
3
A
PARM
Repetitive peak avalanche power
tp = 1µs
4100
W
- 65 to + 150
°C
Tstg
Tj
dV/dt
* :
Per diode
Per device
Tj = 25°C
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage (rated VR, Tj = 25°C)
150
°C
10000
V/µs
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j − a )
July 2003 - Ed: 3A
1/6
STPS3030CT/CG/CR
THERMAL RESISTANCES
Symbol
Rth(j-c)
Parameter
2
2
Value
1.2
0.8
0.4
Per diode
Total
Coupling
Junction to case TO-220AB - D PAK - I PAK
Rth(c)
Unit
°C/W
°C/W
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
IR *
Parameter
Tests Conditions
Reverse leakage
current
VF *
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Forward voltage drop
Min.
VR = VRRM
IF =
IF =
IF =
IF =
15 A
15 A
30 A
30 A
Typ.
0.23
125
0.44
0.36
0.53
0.49
Max.
1.0
180
0.49
0.40
0.58
0.53
Unit
mA
V
Pulse test : * tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation :
P = 0.26 x IF(AV) + 0.0107 IF2(RMS)
Fig. 1: Conduction losses versus average current.
Fig. 2: Average forward current versus ambient
temperature(δ = 0.5).
P(W)
IF(av)(A)
10
δ = 0.05
9
δ = 0.2
δ = 0.1
18
δ = 0.5
16
8
Rth(j-a)=Rth(j-c)
14
δ=1
7
12
6
10
5
8
4
Rth(j-a)=50°C/W
6
3
T
2
1
IF(av)(A)
0
2
4
6
8
10
2
δ=tp/T
0
12
14
16
4
Tamb(°C)
tp
0
18
20
Fig. 3: Normalized avalanche power derating
versus pulse duration.
0
50
75
100
125
150
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
25
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
0.001
0.01
2/6
Tj(°C)
tp(µs)
0.1
1
0
10
100
1000
0
25
50
75
100
125
150
STPS3030CT/CG/CR
Fig. 5: Non repetitive surge peak forward
current versus overload duration (maximum
values).
Fig. 6: Relative variation of thermal impedance
junction to case versus pulse duration.
IM(A)
Zth(j-c)/Rth(j-c)
250
1.0
225
0.9
200
0.8
175
0.7
150
0.6
125
0.5
TC=25°C
100
TC=75°C
75
TC=125°C
50
δ = 0.5
0.4
δ = 0.2
0.3
δ = 0.1
T
0.2
Single pulse
25
0.1
t(s)
tp(s)
δ=tp/T
0.0
0
1.E-03
1.E-02
1.E-01
1.E+00
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
1.E-03
1.E-02
tp
1.E-01
1.E+00
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values).
C(nF)
IR(mA)
1.E+03
10.0
F=1MHz
Vosc=30mV
Tj=25°C
Tj=150°C
1.E+02
Tj=125°C
Tj=100°C
1.E+01
1.0
Tj=75°C
1.E+00
Tj=50°C
1.E-01
Tj=25°C
VR(V)
VR(V)
0.1
1.E-02
0
5
10
15
20
25
1
30
Fig. 9: Forward voltage drop versus forward
current.
10
100
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (epoxy printed
board FR4, Cu = 35µm).
IFM(A)
Rth(j-a)(°C/W)
100
80
D²PAK
70
Tj=125°C
(Maximum values)
60
Tj=125°C
(Typical values)
50
10
40
Tj=25°C
(Maximum values)
30
20
10
VFM(V)
1
S(cm²)
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
5
10
15
20
25
30
35
40
3/6
STPS3030CT/CG/CR
PACKAGE MECHANICAL DATA
I²PAK
REF.
DIMENSIONS
Millimeters
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
b
0.70
0.93
0.028
0.037
b1
1.14
1.17
0.044
0.046
b2
1.14
1.17
0.044
0.046
c
0.45
0.60
0.018
0.024
c2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
E
10.0
10.4
0.394
0.409
L
13.1
13.6
0.516
0.535
L1
3.48
3.78
0.137
0.149
L2
1.27
1.40
0.050
0.055
A
E
c2
L2
D
L1
A1
b2
L
b1
b
e
4/6
c
Inches
STPS3030CT/CG/CR
PACKAGE MECHANICAL DATA
D²PAK
REF.
DIMENSIONS
Millimeters
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
R
V2
0.40 typ.
0°
8°
0.016 typ.
0°
8°
FOOTPRINT
16.90
10.30
5.08
1.30
3.70
8.90
5/6
STPS3030CT/CG/CR
PACKAGE MECHANICAL DATA
TO-220AB
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
F
M
G1
E
G
■
■
■
■
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
2.40
2.70
0.094
0.106
10
10.40
0.393
0.409
16.4 typ.
0.645 typ.
13
14
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
COOLING METHOD : C
RECOMMENDED TORQUE VALUE : 0.55 M.N
MAXIMUM TORQUE VALUE : 0.70 M.N
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS3030CT
STPS3030CT
TO-220AB
2.2 g
50
Tube
STPS3030CG
STPS3030CG
D²PAK
1.48 g
50
Tube
STPS3030CG-TR
STPS3030CG
D²PAK
1.48 g
1000
Tape & reel
STPS3030CR
STPS3030CR
I²PAK
1.49 g
50
Tube
EPOXY MEETS UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore
Spain - Sweden - Switzerland - United Kingdom - United States.
http://www.st.com
6/6