STPS41L60CG/CT/CR ® POWER SCHOTTKY RECTIFIER MAIN PRODUCTS CHARACTERISTICS IF(AV) 2 x 20 A VRRM 60 V Tj (max) 150 °C VF (max) 0.58 V A1 K A2 FEATURES AND BENEFITS NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE AVALANCHE CAPABILITY SPECIFIED A2 ■ A1 ■ ■ K A1 I2PAK STPS41L60CR ■ DESCRIPTION Dual center tab Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in D2PAK, I2PAK and TO-220AB this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. A2 K TO-220AB STPS41L60CT K A2 A1 D2PAK STPS41L60CG ABSOLUTE RATINGS (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) Parameter Repetitive peak reverse voltage RMS forward current Average forward current Tc = 125°C δ = 0.5 40 IRRM Peak repetitive reverse current tp = 2 µs square F=1kHz PARM Repetitive peak avalanche power tp = 1µs Tj * : A Per device tp = 10 ms sinusoidal dV/dt 30 20 Surge non repetitive forward current Storage temperature range Unit V Per diode IFSM Tstg Value 60 A 220 A 1 A 9500 W - 65 to + 175 °C Tj = 25°C Maximum operating junction temperature * Critical rate of rise reverse voltage 150 °C 10000 V/µs dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) July 2003 - Ed : 3A 1/6 STPS41L60CG / STPS41L60CT / STPS41L60CR THERMAL RESISTANCES Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Per diode Total Value Unit 1.5 0.8 0.1 °C/W When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol Parameter Tests Conditions IR * Reverse leakage current Min. Typ. VR = VRRM Tj = 25°C 77 Tj = 125°C VF * Forward voltage drop Tj = 25°C IF = 20 A Tj = 125°C IF = 20 A Tj = 25°C IF = 40 A Tj = 125°C IF = 40 A 0.50 Max. Unit 240 µA 130 mA 0.60 V 0.58 0.77 0.67 0.71 Pulse test : * tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.007 IF2(RMS) Fig. 1: Conduction losses versus average current. Fig. 2: Average forward current versus ambient temperature (δ = 0.5). PF(av)(W) IF(av)(A) 16 22 δ = 0.5 14 Rth(j-a)=Rth(j-c) 20 δ = 0.2 12 18 δ=1 δ = 0.1 16 14 δ = 0.05 10 12 8 10 6 8 4 6 T Rth(j-a)=50°C/W 4 2 IF(av)(A) δ=tp/T 0 0 2/6 5 10 15 20 T 2 tp δ=tp/T 0 25 0 Tamb(°C) tp 25 50 75 100 125 150 STPS41L60CG / STPS41L60CT / STPS41L60CR Fig. 3: Normalized avalanche power derating versus pulse duration. Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 1.2 PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 1 0 10 100 0 1000 Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). 50 75 100 125 150 Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) IM(A) 250 1.0 225 0.9 200 0.8 175 0.7 150 0.6 Tc=25°C δ = 0.5 0.5 125 Tc=75°C 100 75 50 25 Tc=125°C 0.4 δ = 0.2 0.3 δ = 0.1 T 0.2 IM Single pulse 25 t 0.1 t(s) δ=0.5 0 tp(s) δ=tp/T 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). 1.E-03 1.E-02 1.E-01 tp 1.E+00 Fig. 8: Junction capacitance versus reverse voltage applied (typical values). IR(mA) C(nF) 1.E+03 10.0 F=1MHz Vosc=30mV Tj=25°C Tj=150°C 1.E+02 Tj=125°C Tj=100°C 1.E+01 1.0 Tj=75°C 1.E+00 Tj=50°C 1.E-01 Tj=25°C VR(V) VR(V) 1.E-02 0.1 0 5 10 15 20 25 30 35 40 45 50 55 60 1 10 100 3/6 STPS41L60CG / STPS41L60CT / STPS41L60CR Fig. 9: Forward voltage drop versus forward current. Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35µm) (STPS41L60CG only). IFM(A) Rth(j-a)(°C/W) 100 80 70 Tj=125°C (Maximum values) 60 Tj=125°C (Typical values) 50 10 40 Tj=25°C (Maximum values) 30 20 10 VFM(V) 1 S(cm²) 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 5 10 15 20 25 30 35 PACKAGE MECHANICAL DATA I2PAK DIMENSIONS REF. A E c2 L2 D L1 Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 b1 E 10.0 10.4 0.394 0.409 L 13.1 13.6 0.516 0.535 L1 3.48 3.78 0.137 0.149 L2 1.27 1.40 0.050 0.055 L b 4/6 Inches b2 A1 e Millimeters c 40 STPS41L60CG / STPS41L60CT / STPS41L60CR PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E Min. C2 L2 D L L3 A1 B2 R C B G A2 M * Millimeters V2 * FLAT ZONE NO LESS THAN 2mm A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 Max. 4.40 4.60 2.49 2.69 0.03 0.23 0.70 0.93 1.14 1.70 0.45 0.60 1.23 1.36 8.95 9.35 10.00 10.40 4.88 5.28 15.00 15.85 1.27 1.40 1.40 1.75 2.40 3.20 0.40 typ. 0° 8° Inches Min. Max. 0.173 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.045 0.067 0.017 0.024 0.048 0.054 0.352 0.368 0.393 0.409 0.192 0.208 0.590 0.624 0.050 0.055 0.055 0.069 0.094 0.126 0.016 typ. 0° 8° FOOTPRINT (dimensions in mm) 16.90 10.30 5.08 1.30 3.70 8.90 5/6 STPS41L60CG / STPS41L60CT / STPS41L60CR PACKAGE MECHANICAL DATA TO-220AB DIMENSIONS A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 F M G1 E G Ordering type STPS41L60CG STPS41L60CG Package Millimeters Inches A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. Min. Max. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 1.14 1.70 4.95 5.15 2.40 2.70 10 10.40 16.4 typ. 13 14 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.044 0.066 0.194 0.202 0.094 0.106 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 Weight Base qty Delivery mode 2 1.48 g 50 Tube 2 D PAK STPS41L60CG-TR STPS41L60CG D PAK 1.48 g 1000 Tape & reel STPS41L60CT STPS41L60CT TO-220AB 2.20 g 50 Tube 1.49 g 50 Tube STPS41L60CR ■ Marking REF. STPS41L60CR 2 I PAK EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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