STMICROELECTRONICS STTH1506TPI

STTH1506TPI
®
Tandem 600V Hyperfast Rectifer
MAJOR PRODUCTS CHARACTERISTICS
IF(AV)
15 A
VRRM
600 V (in series)
Tj (max)
150 °C
VF (max)
2.6 V
IRM (typ.)
4.8 A
1
3
2
1
2
FEATURES AND BENEFITS
Especially suited as boost diode in continuous
mode power factor correctors and hard
switching conditions.
Designed for high di/dt operation. Hyperfast
recovery current to compete with GaAs devices.
Allows downsizing of mosfet and heatsinks.
Internal ceramic insulated devices with equal
thermal conditions for both 300V diodes.
Insulation (2500V RMS) allows placement on
same heatsink as mosfet and flexible
heatsinking on common or separate heatsink.
Matched diodes for typical PFC application
without need for voltage balance network.
C = 7pF
3
■
TOP3I
(insulated)
■
■
DESCRIPTION
■
The TURBOSWITCH “H” is an ultra high
performance diode composed of two 300V dice in
series. TURBOSWITCH “H” family drastically cuts
losses in the associated MOSFET when run at
high dIF/dt.
■
■
ABSOLUTE RATINGS (limiting values for both diodes in series)
Symbol
VRRM
IF(RMS)
Parameter
Repetitive peak reverse voltage
RMS forward current
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
Tj
tp = 10 ms sinusoidal
Maximum operating junction temperature
Value
600
Unit
V
26
A
130
A
-65 +150
°C
+ 150
°C
TM: TURBOSWITCH is a trademark of STMicroelectronics
May 2002 - Ed: 1A
1/5
STTH1506TPI
THERMAL AND POWER DATA
Symbol
Rth (j-c)
Parameter
Test conditions
Value
Unit
Per diode
2.9
°C/W
Coupling
0.3
Junction to case
Total
1.6
Conduction power dissipation for
both diodes
IF(AV) = 15 A
Tc = 70°C
Junction to case
Rth (c)
Rth (j-c)
P1
δ = 0.5
50
W
STATIC ELECTRICAL CHARACTERISTICS (for both diodes)
Symbol
Parameter
IR*
Reverse leakage current
VR = VRRM
Forward voltage drop
IF = 15 A
VF**
Tests Conditions
Min.
Typ.
Max.
Unit
20
µA
Tj = 25°C
30
Tj = 125°C
200
3.6
Tj = 25°C
2.1
Tj = 125°C
V
2.6
Pulse test: * tp = 5ms, δ < 2%
** tp = 380µs, δ < 2%
To evaluate the maximum conduction losses use the following equation:
P = 1.8 x IF(AV) + 0.053 x IF2(RMS)
RECOVERY CHARACTERISTICS
Symbol
Parameter
trr
Reverse recovery
time
Tests Conditions
IF = 0.5 A Irr = 0.25A
IR = 1 A
Min.
Typ.
16
Tj = 25°C
Sfactor
Reverse recovery
current
VR = 400 V IF = 15 A
dIF/dt = -200 A/µs
Unit
ns
35
IF = 1 A dIF/dt = - 50A/µs
VR = 30 V
IRM
Max.
4.8
Tj = 125°C
6.0
0.4
A
-
TURN-ON SWITCHING CHARACTERISTICS
Symbol
tfr
VFP
2/5
Parameter
Tests Conditions
Min.
Typ.
Max.
Unit
Forward
recovery time
IF = 15 A dIF/dt = 100A/µs,
VFR = 1.1 x VFmax
Tj = 25°C
200
ns
Forward
recovery voltage
IF = 15 A dIF/dt = 100 A/µs
Tj = 25°C
6
V
STTH1506TPI
Fig. 1: Conduction losses versus average current.
Fig. 2: Forward voltage drop versus forward
current.
IFM(A)
P(W)
55
50
130
δ = 0.2
δ = 0.1
δ = 0.5
120
110
45
δ = 0.05
100
40
δ=1
90
35
80
30
70
25
60
20
50
Tjj=125°C
(Maximum values)
values)
(Maximum
Tj=125°C
(Typical values)
40
15
T
30
10
Tj=25°C
(Maximum values)
20
5
δ=tp/T
IF(AV)(A)
VFM(V)
10
tp
0
0
0
2
4
6
8
10
12
14
16
18
20
Fig. 3: Relative variation of thermal impedance
junction to case versus pulse duration.
0
1
2
3
4
5
6
7
8
Fig. 4: Peak reverse recovery current versus dIF/dt
(90% confidence).
Zth(j-c)/Rth(j-c)
1.0
22
0.9
20
IRM(A)
IF=2 x IF(AV)
VR=400V
Tj=125°C
18
0.8
IF=IF(AV)
16
0.7
δ = 0.5
0.6
IF=0.5 x IF(AV)
14
12
IF=0.25 x IF(AV)
0.5
10
0.4
δ = 0.2
0.3
δ = 0.1
8
6
T
0.2
4
Single pulse
0.1
δ=tp/T
tp(s)
2
tp
dIF/dt(A/µs)
0
0.0
1.E-03
1.E-02
1.E-01
1.E+00
Fig. 5: Reverse recovery time versus dIF/dt (90%
confidence).
0
200
400
600
800
1000
Fig. 6: Reverse recovery charges versus dIF/dt
(90% confidence).
Qrr(nC)
trr(ns)
100
350
VR=400V
Tj=125°C
VR=400V
Tj=125°C
90
300
80
250
70
60
IF=2 x IF(AV)
200
IF=IF(AV)
IF=2 x IF(AV)
50
150
40
30
IF=IF(AV)
IF=0.5 x IF(AV)
100
IF=0.5 x IF(AV)
20
50
10
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
0
200
400
600
800
1000
0
200
400
600
800
1000
3/5
STTH1506TPI
Fig. 7: Softness factor versus dIF/dt (typical
values).
Fig. 8: Relative variations of dynamic parameters
versus junction temperature.
S factor
2.50
0.80
IF=IF(AV)
VR=400V
Tj=125°C
0.70
IF=IF(AV)
VR=400V
Reference: Tj=125°C
2.25
2.00
S factor
1.75
0.60
1.50
1.25
0.50
1.00
IRM
0.75
0.40
0.50
0.30
0.25
dIF/dt(A/µs)
Tj(°C)
0.00
0.20
25
0
200
400
600
800
50
75
100
125
1000
Fig. 9: Transient peak forward voltage versus
dIF/dt (90% confidence).
Fig. 10: Forward recovery time versus dIF/dt (90%
confidence).
VFP(V)
tfr(ns)
400
16
IF=IF(AV)
Tj=125°C
14
350
12
300
10
250
8
200
6
150
4
100
2
IF=IF(AV)
VFR=1.1 x VF max.
Tj=125°C
50
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
0
50
100
150
200
250
300
350
400
450
500
Fig. 11: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
1000
F=1MHz
VOSC=30mV
Tj=25°C
100
VR(V)
10
1
4/5
10
100
1000
0
100
200
300
400
500
STTH1506TPI
PACKAGE MECHANICAL DATA
TOP3I
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
4.4
4.6
0.173
0.181
B
1.45
1.55 0.057
0.061
C
14.35
15.60 0.565
0.614
D
0.5
0.7
0.020
0.028
E
2.7
2.9
0.106
0.114
F
15.8
16.5 0.622
0.650
G
20.4
21.1 0.815
0.831
H
15.1
15.5 0.594
0.610
J
5.4
5.65 0.213
0.222
K
3.4
3.65 0.134
0.144
L
4.08
4.17 0.161
0.164
P
1.20
1.40 0.047
0.055
R
■
4.60
0.181
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
STTH1506TPI
STTH1506TPI
TOP3I
4.46 g.
30
Tube
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore
Spain - Sweden - Switzerland - United Kingdom - United States.
http://www.st.com
5/5