STTH1L06/U/A ® TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 1A VRRM 600 V IR (max) 75 µA Tj (max) 175 °C VF (max) 1.05 V trr (max) 80 ns SMB STTH1L06U DO-41 STTH1L06 FEATURES AND BENEFITS ■ ■ ■ ■ Ultrafast switching Low reverse recovery current Reduces switching & conduction losses Low thermal resistance DESCRIPTION The STTH1L06/U/A, which is using ST Turbo 2 600V technology, is specially suited as boost diode in discontinuous or critical mode power factor corrections. The device is also intended for use as a free wheeling diode in power supplies and other power switching applications. SMA STTH1L06A ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) RMS forward current DO-41 SMA / SMB 10 7 A IF(AV) Average forward current Tl = 120°C δ = 0.5 DO-41 TI = 135°C δ = 0.5 SMA TI = 145°C δ = 0.5 SMB 1 1 1 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal DO-41 tp = 10 ms Sinusoidal SMA / SMB 30 20 A Tstg Storage temperature range - 65 + 175 °C + 175 °C Tj Maximum operating junction temperature July 2002 - Ed: 3C 1/8 STTH1L06/U/A THERMAL PARAMETERS Symbol Rth (j-l) Rth (j-a) Parameter Junction to lead L = 10 mm Junction to ambient (note 1) L = 10 mm Maximum Unit DO-41 45 °C/W SMA 30 SMB 25 DO-41 70 2 Note 1: Rth(j-a) is measured with a copper area S = 5cm (see Fig 12) STATIC ELECTRICAL CHARACTERISTICS Symbol IR VF Parameter Tests conditions Reverse leakage current VR = 600V Forward voltage drop IF = 1 A Min. Typ. Tj = 25°C Tj = 150°C 10 Tj = 25°C Max. Unit 1 µA 75 1.3 Tj = 150°C 0.85 V 1.05 To evaluate the maximum conduction losses use the following equation : P = 0.89 x IF(AV) + 0.165 IF2(RMS) DYNAMIC ELECTRICAL CHARACTERISTICS Symbol Parameter trr Reverse recovery time IF = 1 A dIF/dt = - 50 A/µs VR = 30V Tj = 25°C tfr Forward recovery time IF = 1 A dIF/dt = 100 A/µs VFR = 3.5V VFP Forward recovery voltage IF = 1A dIF/dt = 100 A/µs 2/7 Tests conditions Min. Typ. Max. Unit 55 80 ns Tj = 25°C 50 ns Tj = 25°C 10 V STTH1L06/U/A Fig. 1: Conduction losses versus average current. Fig. 2: Forward voltage drop versus forward current. IFM(A) P(W) 1.50 δ = 0.05 δ = 0.1 100.0 δ = 0.2 δ = 0.5 1.25 Tj=150°C (Maximum values) δ=1 1.00 10.0 Tj=150°C (Typical values) 0.75 Tj=25°C (Maximum values) 0.50 1.0 T 0.25 IF(av)(A) δ=tp/T 0.00 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 VFM(V) tp 0.1 1.2 1.3 Fig. 3-1: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, Leads = 10mm) 0.0 2.5 3.0 3.5 4.0 4.5 SMB DO-41 Lleads = 10mm 0.9 0.8 0.7 0.6 0.6 δ = 0.5 δ = 0.5 0.5 0.5 0.4 0.4 0.1 2.0 Zth(j-a)/Rth(j-a) 0.7 0.2 1.5 1.0 0.8 0.3 1.0 Fig. 3-2: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, S = 1cm²) Zth(j-a)/Rth(j-a) 1.0 0.9 0.5 δ = 0.2 0.3 δ = 0.2 T δ = 0.1 0.2 T δ = 0.1 tp(s) Single pulse 0.0 1.E-01 1.E+00 1.E+01 0.1 δ=tp/T tp(s) Single pulse tp δ=tp/T 0.0 1.E+02 1.E+03 Fig. 3-3: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) 1.E-01 1.E+00 1.E+01 tp 1.E+02 1.E+03 Fig. 4: Peak reverse recovery current versus dIF/dt (90% confidence). IRM(A) Zth(j-a)/Rth(j-a) 1.0 2.5 SMA 0.9 VR=400V Tj=125°C 2.3 0.8 2.0 0.7 1.8 IF=2 x IF(av) IF=IF(av) IF=0.5 x IF(av) 0.6 1.5 δ = 0.5 0.5 1.3 0.4 1.0 0.3 0.2 δ = 0.2 0.8 T δ = 0.1 0.1 tp(s) Single pulse 0.0 1.E-01 IF=0.25 x IF(av) 1.E+00 1.E+01 δ=tp/T 1.E+02 0.5 tp 0.3 dIF/dt(A/µs) 0.0 1.E+03 0 5 10 15 20 25 30 35 40 45 50 3/8 STTH1L06/U/A Fig. 5: Reverse recovery time versus dIF/dt (90% confidence). Fig. 6: Reverse recovery charges versus dIF/dt (90% confidence). trr(ns) Qrr(nC) 800 220 VR=400V Tj=125°C 700 VR=400V Tj=125°C 200 IF=2 x IF(av) 180 600 IF=IF(av) 160 500 140 IF=2 x IF(av) IF=0.5 x IF(av) 120 IF=IF(av) 400 IF=0.5 x IF(av) 100 300 80 200 60 40 100 dIF/dt(A/µs) 20 0 dIF/dt(A/µs) 0 0 5 10 15 20 25 30 35 40 45 50 Fig. 7: Softness factor versus dIF/dt (typical values). S factor 0 5 10 15 20 25 30 35 40 45 50 Fig. 8: Relative variations of dynamic parameters versus junction temperature. 1.25 2.0 S factor 1.8 1.00 1.6 1.4 IRM 0.75 1.2 QRR 1.0 0.50 0.8 0.6 0.25 0.4 0.2 dIF/dt(A/µs) 0.00 0.0 25 0 5 10 15 20 25 30 35 40 45 IF=IF(av) VR=400V Reference: Tj=125°C Tj(°C) IF=IF(av) VR=400V Tj=125°C 50 75 100 125 50 Fig. 9: Transient peak forward voltage versus dIF/dt (90% confidence). Fig. 10: Forward recovery time versus dIF/dt (90% confidence). tfr(ns) VFP(V) 200 25 IF=IF(av) VFR=1.1 x VF max. Tj=125°C 180 IF=IF(av) Tj=125°C 160 20 140 120 15 100 80 10 60 40 5 20 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 4/8 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 STTH1L06/U/A Fig. 11: Junction capacitance versus reverse voltage applied (typical values). Fig. 12-1: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm). C(pF) Rth(j-a)(°C/W) 100 110 F=1MHz Vosc=30mV Tj=25°C 100 90 DO-41 Lleads=10mm 80 70 60 10 SMB 50 40 30 20 VR(V) 10 1 1 10 100 1000 S(cm²) 0 0 1 2 3 4 5 6 7 8 9 10 Fig. 12-2: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm). Rth(j-a)(°C/W) 140 130 SMA 120 110 100 90 80 70 60 50 40 30 20 S(cm²) 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5/8 STTH1L06/U/A PACKAGE MECHANICAL DATA SMA DIMENSIONS REF. E1 D E A1 A2 C L b FOOTPRINT 1.65 1.45 6/8 2.40 1.45 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.70 0.075 0.106 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 STTH1L06/U/A PACKAGE MECHANICAL DATA SMB DIMENSIONS REF. E1 D Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 E A1 A2 C L b FOOTPRINT 2.3 1.52 2.75 1.52 7/8 STTH1L06/U/A PACKAGE MECHANICAL DATA DO-41 DIMENSIONS C A ■ ■ O / B REF. Millimeters Inches Min. Max. Min. Max. A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107 C 28 D 0.712 O /D O /D ■ C 1.102 0.863 0.028 0.034 Ordering code Marking Package Weight Base qty Delivery mode STTH1L06 STTH1L06 DO-41 0.34 g 2000 Ammopack STTH1L06RL STTH1L06 DO-41 0.34 g 5000 Tape & reel STTH1L06U BL6 SMB 0.11 g 2500 Tape & reel STTH1L06A HL6 SMA 0.068 g 5000 Tape & reel Epoxy meets UL 94,V0 Band indicated cathode Bending method: Application note AN1471 Information furnished is believed to be accurate and reliable. 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