STMICROELECTRONICS STTH5L06B-TR

STTH5L06D/B/FP
®
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
5A
VRRM
600 V
IR (max)
125 µA
Tj (max)
175 °C
VF (max)
1.05 V
trr (max)
95 ns
A
A
K
K
TO-220AC
STTH5L06D
TO-220FPAC
STTH5L06FP
FEATURES AND BENEFITS
■
■
■
■
Ultrafast switching
Low reverse recovery current
Reduces switching & conduction losses
Low thermal resistance
K
DESCRIPTION
The STTH5L06D/B/FP, which is using ST Turbo 2
600V technology, is specially suited as boost
diode in discontinuous or critical mode power
factor corrections.
The device, available in TO-220AC, TO-220FPAC
and DPAK, is also intended for use as a free
wheeling diode in power supplies and other power
switching applications.
A
NC
DPAK
STTH5L06B
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
600
V
VRRM
Repetitive peak reverse voltage
IF(RMS)
RMS forward current
TO-220AC/TO-220FPAC
DPAK
20
10
A
Average forward
current
TO-220AC / DPAK
Tc = 150°C δ =0.5
5
A
TO-220FPAC
Tc = 135°C δ =0.5
IFSM
Surge non
repetitive forward
current
tp = 10 ms Sinusoidal
tp = 10 ms Sinusoidal
TO-220AC/TO-220FPAC
DPAK
90
60
A
Tstg
Storage temperature range
- 65 + 175
°C
+ 175
°C
IF(AV)
Tj
Maximum operating junction temperature
November 2002 - Ed: 4B
1/7
STTH5L06D/B/FP
THERMAL PARAMETERS
Symbol
Rth(j-c)
Parameter
Junction to case
Maximum
Unit
TO-220AC / DPAK
3.5
°C/W
TO-220FPAC
6.0
STATIC ELECTRICAL CHARACTERISTICS
Symbol
IR
VF
Parameter
Tests conditions
Reverse leakage
current
VR = 600V
Forward voltage drop
IF = 5 A
Min.
Typ.
Max.
Unit
5
µA
Tj = 25°C
Tj = 150°C
10
125
Tj = 25°C
1.3
Tj = 150°C
0.85
V
1.05
To evaluate the maximum conduction losses use the following equation :
P = 0.89 x IF(AV) + 0.033 IF2(RMS)
DYNAMIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Tests conditions
trr
Reverse recovery
time
IF = 1 A dIF/dt = - 50 A/µs
VR = 30V
Tj = 25°C
tfr
Forward recovery
time
IF = 5 A dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
VFP
Forward recovery
time
IF = 5 A dIF/dt = 100 A/µs
Fig. 1: Conduction losses versus average current.
Min.
Typ.
Max.
Unit
65
95
ns
Tj = 25°C
150
ns
Tj = 25°C
7
V
Fig. 2: Forward voltage drop versus forward
current.
IFM(A)
P(W)
7
δ = 0.1
δ = 0.2
100.0
δ = 0.5
δ = 0.05
6
Tj=150°C
(maximum values)
5
δ=1
Tj=150°C
(typical values)
10.0
4
Tj=25°C
(maximum values)
3
1.0
2
T
1
IF(AV)(A)
δ=tp/T
0
VFM(V)
tp
0.1
0.0
2/7
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
STTH5L06D/B/FP
Fig. 3-1: Relative variation of thermal impedance
junction to case versus pulse duration (TO-220AC,
DPAK).
Fig. 3-2: Relative variation of thermal impedance
junction to case versus pulse duration
(TO-220FPAC).
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
δ = 0.5
δ = 0.5
0.6
0.5
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.4
δ = 0.2
0.3
T
0.2
Single pulse
0.1
tp(s)
1.E-03
1.E-02
T
0.1
δ=tp/T
0.0
δ = 0.1
0.2
tp(s)
Single pulse
tp
δ=tp/T
0.0
1.E-01
1.E+00
Fig. 4: Peak reverse recovery current versus dIF/dt
(90% confidence).
1.E-03
1.E-02
1.E-01
tp
1.E+00
1.E+01
Fig. 5: Reverse recovery time versus dIF/dt
(90% confidence).
trr(ns)
IRM(A)
8
1000
VR=400V
Tj=125°C
VR=400V
Tj=125°C
900
7
IF=2 x IF(AV)
800
6
IF=IF(AV)
5
700
IF=0.5 x IF(AV)
IF=2 x IF(AV)
600
4
IF=IF(AV)
500
IF=0.25 x IF(AV)
IF=0.5 x IF(AV)
400
3
300
2
200
1
dIF/dt(A/µs)
100
0
dIF/dt(A/µs)
0
0
10
20
30
40
50
60
70
80
90
100
Fig. 6: Reverse recovery charges versus dIF/dt
(90% confidence).
10
20
30
40
50
60
70
80
90
100
Fig. 7: Softness factor versus dIF/dt (typical
values).
S factor
Qrr(nC)
2.4
500
IF=2 x IF(AV)
VR=400V
Tj=125°C
450
0
IF=IF(AV)
VR=400V
Tj=125°C
2.2
2.0
400
IF=IF(AV)
1.8
350
1.6
IF=0.5 x IF(AV)
300
1.4
250
1.2
200
1.0
150
0.8
100
0.6
50
0.4
dIF/dt(A/µs)
dIF/dt(A/µs)
0.2
0
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90
100
3/7
STTH5L06D/B/FP
Fig. 8: Relative variations of dynamic
parameters versus junction temperature.
Fig. 9: Transient peak forward voltage versus
dIF/dt (90% confidence).
1.25
10
VFP(V)
S factor
IF=IF(AV)
Tj=125°C
9
1.00
8
7
IRM
0.75
6
QRR
5
0.50
4
3
0.25
2
IF=IF(AV)
VR=400V
Reference: Tj=125°C
Tj(°C)
1
dIF/dt(A/µs)
0.00
25
50
75
100
125
0
0
Fig. 10: Forward recovery time versus dIF/dt
(90% confidence).
20
40
60
80
100
120
140
160
180
200
Fig. 11: Junction capacitance versus reverse
voltage applied (typical values).
tfr(ns)
C(pF)
200
100
IF=IF(AV)
VFR=1.1 x VF max.
Tj=125°C
180
F=1MHz
VOSC=30mV
Tj=25°C
160
140
120
100
10
80
60
40
20
VR(V)
dIF/dt(A/µs)
0
1
0
20
40
60
80
100
120
140
160
180
200
Fig. 12: Thermal resistance junction to ambient
versus copper surface under tab (epoxy printed circuit
board FR4, copper thickness: 35µm) (DPAK).
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
S(Cu)(cm²)
0
0
4/7
2
4
6
8
10
12
14
16
18
20
1
10
100
1000
STTH5L06D/B/FP
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
REF.
Millimeters
Inches
Min.
Max
Min.
Max.
A
2.20
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.018
0.023
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.251
0.259
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.397
L2
0.80 typ.
0.031 typ.
L4
0.60
1.00
0.023
0.039
V2
0°
8°
0°
8°
FOOTPRINT
6.7
6.7
3
3
1.6
1.6
2.3
2.3
5/7
STTH5L06D/B/FP
PACKAGE MECHANICAL DATA
TO-220FPAC
REF.
DIMENSIONS
Millimeters
A
H
B
Dia
L6
L2
L7
L3
L5
D
F
Min.
Max.
Min.
Max.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.70
0.018
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L2
F1
L4
E
Inches
16 Typ.
0.63 Typ.
L3
28.6
30.6
1.126
1.205
L4
9.8
10.6
0.386
0.417
L5
2.9
3.6
0.114
0.142
L6
15.9
16.4
0.626
0.646
L7
9.00
9.30
0.354
0.366
Dia.
3.00
3.20
0.118
0.126
G1
G
6/7
STTH5L06D/B/FP
PACKAGE MECHANICAL DATA
TO-220AC
DIMENSIONS
REF.
A
H
B
Dia
L6
L2
L7
L3
L5
Millimeters
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
H2
10.00
10.40
0.393
0.409
L2
D
F1
L4
E
F
G1
16.40 typ.
13.00
14.00
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
2.6 typ.
Diam. I
■
■
■
0.645 typ.
L4
M
G
Inches
Min.
3.75
0.102 typ.
3.85
0.147
0.151
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
STTH5L06D
STTH5L06D
TO-220AC
1.9 g
50
Tube
STTH5L06B
STTH5L06B
DPAK
0.3 g
75
Tube
STTH5L06B-TR
STTH5L06B
DPAK
0.3 g
2500
Tape & reel
STTH5L06FP
STTH5L06FP
TO-220PFAC
1.7 g
50
Tube
Epoxy meets UL 94,V0
Recommended torque value (TO-220AC): 0.55 Nm
Maximum torque value (TO-220AC / TO-220FPAC): 0.7 Nm
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore
Spain - Sweden - Switzerland - United Kingdom - United States.
http://www.st.com
7/7