TDA1170S TV VERTICAL DEFLECTION .. .. . SYNCHRONIZATION CIRCUIT OSCILLATOR AND RAMP GENERATOR HIGH POWER GAIN AMPLIFIER FLYBACK GENERATOR VOLTAGE REGULATOR FINDIP (Plastic Package) ORDER CODE : TDA1170S DESCRIPTION The TDA1170S is a monolithic integrated circuit in a 12-lead quad in-line plastic package. It is intended for use in black and white and colour TV receivers. PIN CONNECTIONS RAMP OUTPUT 1 12 RAMP GENERATOR SUPPLY VOLTAGE 2 11 COMPENSATION FLYBACK 3 10 AMP. INPUT GROUND GROUND POWER AMPLIFLIER OUTPUT 4 9 OSCILLATOR POWER AMPLIFLIER SUPPLY VOLTAGE 5 8 SYNC. INPUT 6 7 HEIGHT ADJUSTMENT 1170S-01.EPS REGULATED VOLTAGE December 1992 1/9 TDA1170S BLOCK DIAGRAM + VS C4 FREQ 6 2 3 DA 5 TDA1170S P1 9 C9 RH POWER AMPLIFLIER FLYBACK GENERATOR VOLTAGE REGULATOR OSCILLATOR 4 C1 RG YOKE C8 SYNC 8 SYNC CIRCUIT BUFFER STAGE RAMP GENERATOR PREAMPLIFLIER 11 C5 7 12 1 LINEARITY TABS C7 RE 10 RD C2 2/9 RA P3 C3 RB RC C6 RF 1170S-02.EPS P2 HEIGHT 1170S-03.EPS R1 Q2 Z1 Q1 6 9 Q7 Q3 R2 D Q4 D1 Q8 C Q5 Q9 Q6 E R4 A R3 Q10 R6 R5 B 8 Q14 Q13 Q11 Q12 Q15 7 12 Q16 Q17 Q19 Q18 1 10 Q20 D3 Q24 Q21 Q22 R7 Q25 11 Q23 R9 R8 Q26 Q27 Q32 Q30 D6 D5 D4 Q28 5 Q31 Q29 D7 Q33 R10 TDA1170S Q34 Q35 Q36 D8 Q37 4 3 2 TDA1170S SCHEMATIC DIAGRAM 3/9 TABS TDA1170S Symbol VS V4 , V5 V10 Io Io Io I3 I3 I8 Ptot Tstg, Tj Parameter Supply Voltage at Pin 2 Flyback Peak Voltage Power Amplifier Input Voltage Output Peak Current (non repetitive) at t = 2msec Output Peak Current at f = 50Hz t ≤ 10µsec Output Peak Current at f = 50Hz t > 10µsec Pin 3 DC Current at V4 2 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly ≤ 1.5msec Pin 8 Current Power Dissipation : at Ttab = 90 °C at Tamb = 80 ° C Storage and Junction Temperature Value 35 60 + 10 – 0.5 2 2.5 1.5 100 1.8 ± 20 5 1 – 40, + 150 Unit V V V V A A A mA A mA W W °C Value 12 70 Unit °C/W °C/W 1170S-01.TBL ABSOLUTE MAXIMUM RATINGS Symbol Rth j–tab R th j–amb Parameter Thermal Resistance Junction–tab Thermal Resistance Junction-ambient Max Max 1170S-02.TBL THERMAL DATA (°) Obtained with tabs soldered to printed circuit with minimized copper area. Symbol I2 I5 – I9 – I10 – I12 – I12 ∆I12 I12 Vs V1 V3 V4 Test Conditions I3 = 0 I4 = 0 V9 = 1V V10 = 1V V12 = 0 I7 = 20 µA, V12 = 0 Ramp Generator Non-linearity ∆V12 = 0 to 12V, I7 = 20µA Supply Voltage Range Pin 1 Saturation Voltage to Ground Pin 3 Saturation Voltage to Ground Quiescent Output Voltage V4L Output Saturation Voltage to Ground V4H Output Saturation Voltage to Supply V6 V7 ∆V6 ∆V7 , ∆VS ∆VS V10 R8 4/9 Parameter Pin 2 Quiescent Current Pin 5 Quiescent Current Oscillator Bias Current Amplifier Input Bias Current Ramp Generator Bias Current Ramp Generator Current Min. Typ. 7 8 0.1 0.1 0.02 20 Max. 14 15 1 1 0.3 24 Unit mA mA µA µA µA µA Fig. 1b 1b 1a 1b 1a 1b 0.2 1 % 1b 4.1 1 1.7 4.4 35 1.4 2.6 4.75 V V V V – – 1a 1a 8.3 8.8 9.45 V 1a 6.1 6.2 0.9 1.9 1.4 2.8 6.5 6.6 1.2 2.3 2.1 3.2 6.9 7 V V V V V V 1c 1c 1d 1d 1b 1b mV/V 1b V MΩ – 1a 19 10 I1 = 1 mA I3 = 10 mA VS = 10V R1 = 10kΩ , R2 = 10kΩ VS = 35V R1 = 30kΩ, R2 = 10kΩ – I4 = 0.1A – I4 = 0.8A I4 = 0.1A I4 = 0.8A Regulated Voltage at Pin 6 Regulated Voltage at Pin 7 I7 = 20µA Regulated Voltage Drift with Supply Voltage ∆VS = 10 to 35V Amplifier Input Reference Voltage Pin 8 Input Resistance V8 ≤ 0.4V 1 2.07 1 2.2 2.3 1170S-03.TBL ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25°C, unless otherwise specified) DC CHARACTERISTICS TDA1170S Figure 1 : DC Test Circuit Figure 1a Figure 1b + Vs I2 V3 + Vs I3 I5 2 3 2 5 5 8 TDA1170S TDA1170S 9 4 10 9 7 1kΩ R1 TABS I8 12 - I9 TABS 10 6 1V 7 V4 - I12 V6 R2 1V 12 - I12 V7 - I10 8V 1V Figure 1c 1170S-05.EPS 1170S-04.EPS 100kΩ Figure 1d + Vs 2 + Vs 5 TDA1170S 4 5 TDA1170S 9 TABS V4H 4 TABS 10 10 V4L 1V I4 1170S-06.EPS 4V 1170S-07.EPS 9 2 I4 5/9 TDA1170S ELECTRICAL CHARACTERISTICS (refer to the test circuit, VS = 25V ; f = 50Hz ; Tamb = 25oC, unless otherwise specified) AC CHARACTERISTICS Parameter Is Supply Current I8 Sync. Input Current (positive or negative) V4 Flyback Voltage V9 Peak to Peak Oscillator Sawtooth Voltage tfly Flyback Time fo ∆f ∆f ∆VS ∆f ∆T tab Test Conditions Min. Iy = 1App Typ. 140 Unit mA µA 500 Iy = 1App Max. 51 V 2.4 V Iy = 1App 0.7 ms Free Running Frequency (P1 + R1) = 300kΩ, C2 = 0.1 µF (P1 + R1) = 260kΩ, C2 = 0.1 µF 42.2 48.5 Hz Hz Synchronization Range I8 = 0.5mA Frequency Drift with Supply Voltage VS = 10 to 35V 0.005 Hz/V Frequency Drift with Tab Temperature Ttab = 40 to 120°C 0.01 Hz/°C 14 Hz 1170S-04.TBL Symbol 1170S-08.EPS Figure 2 : AC Test Circuit 6/9 TDA1170S Figure 3 : Typical Application Circuit for Large Screen B/W TV SET (RY = 10Ω, LY = 20mH, IY = 1APP) VS = 22V C9 470µF 25V D1 1N4001 TABS 2 5 C3 100µF 25V 3 4 T D A 1 1 7 0 S C11 0.1µF SYNC. INPUT 8 R13 4.7kΩ 9 P1 100kΩ 6 7 R4 220kΩ C2 150kΩ 0.15 µF P2 100kΩ Height R2 180kΩ C8 33pF R9** 27kΩ 11 C12 1.5nF C7 1000µF/16V R8** 10 27kΩ R5** 47kΩ C6 22µF/16V 1 P3 47kΩ 12 R1 Hold C10 0.1µF R11 3.3Ω C4 0.1µF R3* 330kΩ R14 210Ω Linearity R6 39kΩ R7** 5.6k Ω C5 0.1µF YOKE Ry = 10Ω Ly = 20mH R10* 1Ω * ** 1170S-09.EPS C1 0.1µF Tolerance 5% Tolerance 2% TYPICAL PERFORMANCE Symbol Parameter Value Unit Operating Supply Voltage 22 V Is Supply Current 145 mA tfly Flyback Time 0.7 ms Ptot Power Dissipation 2.3 W Maximum Scanning Current (peak to peak) 1.2 A Iy 1170S-05.TBL VS For safe working up to Tamb = 60°C a heatsink of Rth = 14°C/W is required. 7/9 TDA1170S MOUNTING INSTRUCTION Figure 4 : Example of P.C Board Copper Are is Used as Heatsink Figure 5 : Example with External Heatsink Figure 6 : Maximum Power Dissipation and Junction-Ambient Thermal Resistance versus ”S” Figure 7 : Maximum Allowable Power Dissipation versus Ambient Temperature 1170S-13.EPS 1170S-12.EPS 8/9 1170S-11.EPS The diagram of fig. 6 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side ”s” of two equal square copper areas having a thickness of 35 µ (1.4 mil). 1170S-10.EPS The junction to ambient thermal resistance of the TDA 1170S can be reduced by soldering the tabs to a suitable copper area of the printed circuit board (fig. 4) or to an external heatsink (fig. 5). TDA1170S PACKAGE MECHANICAL DATA : 12 PINS - PLASTIC FINDIP G D I b1 M L a1 A e4 b c c1 e5 e E1 e6 E2 e3 E KD 7 1 6 PM-FDIP.EPS F 12 A a1 b b1 c c1 D E E1 E2 e e3 e4 e5 e6 F G I K L M Min. 3.8 1.5 0.55 0.3 Millimeters Typ. Max. 4.05 1.75 0.6 0.35 Min. 0.150 0.059 0.022 0.012 1.32 0.94 19.2 16.8 4.86 10.11 2.29 17.43 7.27 12.35 6.3 17.2 2.54 17.78 7.62 7.62 12.7 Max. 0.159 0.069 0.024 0.014 0.052 0.037 19.9 17.6 5.56 10.81 2.79 18.13 0.756 0.661 0.191 0.398 0.090 0.686 7.97 13.05 7.1 0.286 0.486 0.248 8.6 6.5 2.9 3.1 0.307 0.240 0.098 0.098 9.8 7.8 6.1 2.5 2.5 Inches Typ. 0.677 0.100 0.700 0.300 0.300 0.500 0.783 0.693 0.219 0.426 0.110 0.714 0.314 0.514 0.280 0.386 0.339 0.256 0.114 FINDIP.TBL Dimensions Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. 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