TDA7299 SOUND 2W MONO AMPLIFIER ■ ■ ■ ■ ■ ■ ■ ■ CAN DELIVER 2W THD 10% 12V/8Ω INTERNAL FIXED GAIN 20dB NO BOUCHEROT CELL THERMAL PROTECTION AC SHORT CIRCUIT PROTECTION SVR CAPACITOR FOR BETTER RIPPLEREJECTION LOW TURN-ON/OFF POP STAND-BY MODE SO8 (4+4) ORDERING NUMBER: TDA7299 DESCRIPTION The device TDA7299 is a new technology Mono Audio Amplifier in SO package specially designed for 12V sound cards application. Thanks to the fully complementary output configura- tion the device delivers a rail voltage swing without need of boostrap capacitors. BLOCK DIAGRAM VS=12V VS 0.1µF IN IN 100µF 470µF + - OUT SVR 8Ω 47µF GND D94AU160A September 2002 1/7 TDA7299 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VS Operating Supply Voltage 18 V IO Output Put Peak Current 1.5 A 0 to 70 °C 150 °C -40 to 125 °C Value Unit Top Tj Tstg Operating Temperature Range Junction Temperature Storage Temperature Range PIN CONNECTION (Top view) VS 1 8 GND OUT 2 7 GND SVR 3 6 GND IN 4 5 GND D94AU162 THERMAL DATA Symbol Parameter Rth j-amb Thermal Resistance Junction to ambient (on PCB) 80 °C/W Rth j-case Thermal Resistance Junction to case 20 °C/W ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 12V; RL = 8Ω; f = 1KHz; unless otherwise specified.) Symbol Parameter Test Condition Typ. Max. Unit 18 V 30 mA 0.3 mA VS Supply Voltage Range IS Quiescent Current Isb Stand-By Current VO Quiescent Output Voltage 6 V AV Voltage Gain 20 dB RIN Input Impedance 50 100 KΩ PO Output Power 1.8 2 W 2 W 4.5 20 Pin 2 shorted to GND THD = 10% RL = 4Ω, VS = 8.5V, THD = 10% 2/7 Min. TDA7299 ELECTRICAL CHARACTERISTICS (continued) (Tamb = 25°C; VS = 12V; RL = 8Ω; f = 1KHz; unless otherwise specified.) Symbol Pot Parameter Test Condition Min. Typ. Transient Output Power *) Vi = 400mVp, THD < 2%, RL = 4Ω THD Distortion PO = 1W SVR Supply Voltage Rejection Vripple = 150mVrms; Fripple = 1KHz 50 EI Input Noise Voltage Rg = 10KΩ; BW = 20Hz to 20KHz 1.5 Vsb Stand-By Enable Voltage Max. 2 Unit W 1 % dB 5 µV 1 V *) Limited by the RTH of the package Figure 1. Application Circuit VS 0.1µF IN 470µF IN OUT SVR STAND-BY VS=12V 100µF 47µF 8Ω GND VS 0.1µF IN 470µF IN OUT SVR STAND-BY 47µF 8Ω GND D94AU161A APPLICATION HINTS: For 12V supply and 8Ω speaker application, its maximum power dissipation is about 1.8W. Assumming that max ambient temperature is 70°C. required thermal resistance of the device and heat dissipating means must be equal to (150 - 70)/1.8 = 45°C/W. Junction to pin thermal resistance of the package is about 20°C/W. That means external heat sink of about 25°C/W is required. Cu ground plane of PCB can be used as heat dissipating means. Stand-By switches must be able to discharge Csvr current. 3/7 TDA7299 Figure 2. On Board Copper Area copper area 2 x 1 cm Rth j-a = 60°C/W TDA7299 Vcc = 12V Rl = 4 ohm Pout = 2W Pd = 1.8W ∆Tj = 108°C ∆Tpin = 82°C copper area 3 x 3 cm Rth j-a = 53°C/W ∆Tj = 96°C ∆Tpin = °70C copper 35um Figure 3. Pout vs Supply Voltage (Rload = 8Ω) AUDIO PRECISION remote LEVEL(W) vs measured DMM(Vdc) 5 Pout(W) Power dissipation limited THD = 10% THD = 0.1% 1 Rload= 8 ohm f = 1KHz 0.1 4.500 6.000 7.500 9.000 10.50 12.00 13.50 15.00 16.50 18.00 Vs (V) Figure 4. Pout vs Supply Voltage (Rload = 4Ω) AUDIO PRECISION remote LEVEL(W) vs measured DMM(Vdc) 5 Pout(W) Power dissipation limitation THD = 10% THD = 0. 1% 1 Current Limiter Intervention Rload = 4 OHM f = 1KHz 0.1 4.500 6.000 7.500 9.000 10.50 12.00 13.50 15.00 16.50 18.00 Vs (V) 4/7 TDA7299 Figure 5. SVR vs Frequency AUDIO PRECISION remote S.V.R.(dB) XTALK(dB) vs measured FREQ(Hz) -30.00 -35.00 -40.00 -45.00 Vs = 4.5V -50.00 Vs = 12V Vs = 9V -55.00 -60.00 Vs = 18V -65.00 Rload = 4 OHM CSVR = 47uF Rs = 600OHM Vrip = 0.5 Vrms -70.00 -75.00 -80.00 20 100 1k 10k 20k Frequency (Hz) 5/7 TDA7299 mm DIM. MIN. TYP. A a1 inch MAX. MIN. TYP. 1.75 0.1 0.25 a2 MAX. 0.069 0.004 0.010 1.65 0.065 a3 0.65 0.85 0.026 0.033 b 0.35 0.48 0.014 0.019 b1 0.19 0.25 0.007 0.010 C 0.25 0.5 0.010 0.020 c1 45° (typ.) D (1) 4.8 5.0 0.189 0.197 E 5.8 6.2 0.228 0.244 e 1.27 e3 0.050 3.81 0.150 F (1) 3.8 4.0 0.15 0.157 L 0.4 1.27 0.016 0.050 M S 0.6 0.024 8 ° (max.) (1) D and F do not include mold flash or protrusions. Mold flash or potrusions shall not exceed 0.15mm (.006inch). 6/7 OUTLINE AND MECHANICAL DATA SO8 TDA7299 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2002 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 7/7