STMICROELECTRONICS TYN80012T

TN12, TS12 and TYNx12 Series
®
12A SCRS
SENSITIVE & STANDARD
Table 1: Main Features
A
Symbol
Value
Unit
IT(RMS)
12
A
VDRM/VRRM
600 to 1000
V
IGT
0.2 to 15
mA
DESCRIPTION
Available either in sensitive (TS12) or standard
(TN12 / TYN) gate triggering levels, the 12A SCR
series is suitable to fit all modes of control, found
in applications such as overvoltage crowbar
protection, motor control circuits in power tools
and kitchen aids, inrush current limiting circuits,
capacitive discharge ignition and voltage
regulation circuits...
G
K
A
A
K A
G
G
DPAK
(TN12-B / TS12-B)
D2PAK
(TN12-G)
A
A
K
Available in through-hole or surface-mount
packages, they provide an optimized performance
in a limited space area.
K A
A
K
G
IPAK
(TN12-H / TS12-H)
A
G
TO-220AB
(TYNx12RG)
Table 2: Order Codes
October 2005
Part Numbers
Marking
TN1215-x00B
TN1215x00
TN1215-x00B-TR
TN1215x00
TN1215-x00G
TN1215x00G
TN1215-x00G-TR
TN1215x00G
TN1215-x00H
TN1215x00
TS1220-x00B
TS1220x00
TS1220-x00B-TR
TS1220x00
TS1220-x00H
TS1220x00
TYNx12RG
TYNx12
TYNx12TRG
TYNx12T
REV. 5
1/11
TN12, TS12 and TYNx12 Series
Table 3: Absolute Ratings (limiting values)
Value
Symbol
Parameter
TN12-G
TYN12
TN12-B/H
TS12-B/H
IT(RMS)
RMS on-state current (180° conduction angle)
Tc = 105°C
12
IT(AV)
Average on-state current (180° conduction
angle)
Tc = 105°C
8
ITSM
Non repetitive surge peak onstate current
I ²t
tp = 8.3 ms
tp = 10 ms
tp = 10 ms
I²t Value for fusing
Tj = 25°C
Unit
A
A
145
115
140
110
A
98
60
A2S
Tj = 25°C
dI/dt
Critical rate of rise of on-state
current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz
Tj = 125°C
50
A/µs
IGM
Peak gate current
tp = 20 µs
Tj = 125°C
4
A
Tj = 125°C
1
W
- 40 to + 150
- 40 to + 125
°C
5
V
PG(AV)
Tstg
Tj
VRGM
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
Maximum peak reverse gate voltage (for TN12 & TYN12 only)
Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified)
■
SENSITIVE
Symbol
IGT
VGT
Test Conditions
RL = 140 Ω
VD = 12 V
RL = 3.3 kΩ
RGK = 1 kΩ
Unit
MAX.
200
µA
MAX.
0.8
V
MIN.
0.1
V
MIN.
8
V
VGD
VD = VDRM
VRG
IRG = 10 µA
IH
IT = 50 mA
RGK = 1 kΩ
MAX.
5
mA
IL
IG = 1 mA
RGK = 1 kΩ
MAX.
6
mA
Tj = 125°C
MIN.
5
V/µs
Tj = 25°C
MAX.
1.6
V
RGK = 220 Ω
Tj = 125°C
TS1220
dV/dt
VD = 65 % VDRM
VTM
ITM = 24 A
Vt0
Threshold voltage
Tj = 125°C
MAX.
0.85
V
Rd
Dynamic resistance
Tj = 125°C
MAX.
30
mΩ
5
µA
2
mA
IDRM
IRRM
2/11
tp = 380 µs
VDRM = VRRM
RGK = 220 Ω
Tj = 25°C
Tj = 125°C
MAX.
TN12, TS12 and TYNx12 Series
STANDARD
■
Symbol
IGT
TN1215
Test Conditions
B/H
RL = 33 Ω
VD = 12 V
VGT
VGD
VD = VDRM
RL = 3.3 kΩ
IH
IT = 500 mA
Gate open
IL
IG = 1.2 IGT
dV/dt
VD = 67 % VDRM
VTM
ITM = 24 A
Vt0
Rd
IDRM
IRRM
Tj = 125°C
Gate open Tj =125°C
tp = 380 µs
G
TYN
x12T
x12
MIN.
2
0.5
2
MAX.
15
5
15
Unit
mA
MAX.
1.3
V
MIN.
0.2
V
MAX.
40
30
15
30
mA
MAX.
80
60
30
60
mA
40
200
V/µs
MIN.
200
Tj = 25°C
MAX.
1.6
V
Threshold voltage
Tj = 125°C
MAX.
0.85
V
Dynamic resistance
Tj = 125°C
MAX.
30
mΩ
5
µA
2
mA
Tj = 25°C
VDRM = VRRM
MAX.
Tj = 125°C
Table 6: Thermal resistance
Symbol
Parameter
Rth(j-c)
Junction to case (DC)
Rth(j-a)
Junction to ambient (DC)
Value
Unit
1.3
°C/W
S = 0.5 cm²
DPAK
70
S = 1 cm²
D2PAK
45
IPAK
100
TO-220AB
60
°C/W
S = Copper surface under tab.
Figure 1: Maximum average power dissipation
versus average on-state current
Figure 2: Average and D.C. on-state current
versus case temperature
P(W)
IT(AV)(A)
12
14
11
D.C.
α = 180°
12
10
9
10
8
α = 180°
7
8
6
6
5
4
3
4
360°
2
2
1
IT(AV)(A)
0
0
1
2
3
4
Tcase(°C)
α
5
6
7
0
8
9
0
25
50
75
100
125
3/11
TN12, TS12 and TYNx12 Series
Figure 3: Average and D.C. on-state current
versus ambient temperature (device mounted
on FR4 with recommended pad layout) (DPAK)
Figure 4: Relative variation of thermal
impedance junction to case versus pulse
duration
IT(AV)(A)
K=[Zth(j-c)/Rth(j-c)]
3.0
1.0
2.5
D.C.
2.0
0.5
D2PAK
1.5
α = 180°
DPAK
1.0
0.2
0.5
tp(s)
Tamb(°C)
0.0
0
25
50
75
100
125
Figure 5: Relative variation of thermal
impedance junction to ambient versus pulse
duration (recommended pad layout, FR4 PC
board for DPAK)
0.1
1E-3
1E-2
1E-1
1E+0
Figure 6: Relative variation of gate trigger
current and holding current versus junction
temperature for TS8 series
K=[Zth(j-a)/Rth(j-a)]
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
1.00
2.0
1.8
1.6
IGT
DPAK
1.4
1.2
D2PAK
0.10
1.0
TO-220AB / IPAK
IH & IL
RGK = 1kΩ
0.8
0.6
0.4
0.2
tp(s)
1E-2
1E-1
Tj(°C)
0.0
0.01
1E+0
1E+1
1E+2
-40
5E+2
Figure 7: Relative variation of gate trigger
current and holding current versus junction
temperature for TN8 & TYN08 series
-20
0
20
40
60
80
100
120
140
Figure 8: Relative variation of holding current
versus gate-cathode resistance (typical
values) for TS8 series
IH[RGK] / IH[RGK=1kΩ]
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
5.0
2.4
Tj = 25°C
4.5
2.2
2.0
4.0
IGT
1.8
3.5
1.6
3.0
1.4
1.2
2.5
1.0
2.0
IH & IL
0.8
0.6
1.5
0.4
1.0
0.2
Tj(°C)
0.5
RGK(kΩ)
0.0
-40
4/11
-20
0
20
40
60
80
100
120
140
0.0
1E-2
1E-1
1E+0
1E+1
TN12, TS12 and TYNx12 Series
Figure 9: Relative variation of dV/dt immunity
versus gate-cathode resistance (typical
values) for TS8 series
Figure 10: Relative variation of dV/dt immunity
versus gate-cathode capacitance (typical
values) for TS8 series
dV/dt[CGK] / dV/dt[RGK=220Ω]
dV/dt[RGK] / dV/dt[RGK=220Ω]
4.0
10.0
Tj = 125°C
VD = 0.67 x VDRM
VD = 0.67 x VDRM
Tj = 125°C
RGK = 220Ω
3.5
3.0
2.5
2.0
1.0
1.5
1.0
0.5
RGK(kΩ)
0.1
CGK(nF)
0.0
0
200
400
600
800
1000
1200
Figure 11: Surge peak on-state current versus
number of cycles
0
25
75
100
125
150
Figure 12: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10 ms, and corresponding values of I²t
ITSM(A)
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
50
ITSM(A), I2t (A2s)
2000
Tj initial = 25°C
ITSM
1000
tp=10ms
TN12 / TYN12
TN12 / TYN12
One cycle
Non repetitive
Tj initial=25°C
TS12
dI/dt limitation
TS12
TN12 / TYN12
100
I2t
TS12
Repetitive
TC=105°C
Number of cycles
tp(ms)
10
1
10
100
1000
Figure 13: On-state characteristics (maximum
values)
0.10
1.00
10.00
Figure 14: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy printed circuit board FR4, copper
thickness: 35µm) (DPAK and D2PAK)
Rth(j-a)(°C/W)
ITM(A)
100
200
Tj max.:
Vt0=0.85V
Rd=30mΩ
100
0.01
80
60
Tj=max
DPAK
10
40
Tj=25°C
D2PAK
20
S(cm²)
VTM(V)
1
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
2
4
6
8
10
12
14
16
18
20
5/11
TN12, TS12 and TYNx12 Series
Figure 15: Ordering Information Scheme (TN8 series)
TN 12 15 - 600 B (-TR)
Standard SCR series
Current
12 = 12A
Sensitivity
15 = 15mA
Voltage
600 = 600V
800 = 800V
1000 = 1000V
Package
B = DPAK
G = D2PAK
H = IPAK
Packing mode
Blanck = Tube
-TR = Tape & Reel (DPAK and D2PAK)
Figure 16: Ordering Information Scheme (TS8 series)
TS 12 20 - 600 B (-TR)
Sensitive SCR series
Current
12 = 12A
Sensitivity
20 = 200µA
Voltage
600 = 600V
700 = 700V
Package
B = DPAK
H = IPAK
Packing mode
Blanck = Tube
-TR = Tape & Reel
Figure 17: Ordering Information Scheme (TYN08 series)
TYN
Standard SCR series
Voltage
6 = 600V
8 = 800V
10 = 100V
Current
12 = 12A
Sensitivity
Blanck = 30mA
T = 15mA
Packing mode
RG = Tube
6/11
6
12
T
RG
TN12, TS12 and TYNx12 Series
Table 7: Product Selector
Voltage (xxx)
Part Numbers
600 V
700 V
800 V
1000 V
Sensitivity
Package
15 mA
DPAK
15 mA
D2PAK
15 mA
IPAK
TN1215-xxxB
X
X
TN1215-xxxG
X
X
TN1215-xxxH
X
X
TS1220-xxxB
X
X
0.2 mA
DPAK
TS1220-xxxH
X
X
0.2 mA
IPAK
TYNx12
X
X
X
15 mA
TO-220AB
TYNx12T
X
X
X
5 mA
TO-220AB
X
Figure 18: DPAK Package Mechanical Data
REF.
E
A
B2
C2
L2
D
R
H
L4
A1
B
R
G
C
A2
0.60 MIN.
V2
A
A1
A2
B
B2
C
C2
D
E
G
H
L2
L4
V2
DIMENSIONS
Millimeters
Inches
Min.
Max
Min.
Max.
2.20
2.40
0.086
0.094
0.90
1.10
0.035
0.043
0.03
0.23
0.001
0.009
0.64
0.90
0.025
0.035
5.20
5.40
0.204
0.212
0.45
0.60
0.017
0.023
0.48
0.60
0.018
0.023
6.00
6.20
0.236
0.244
6.40
6.60
0.251
0.259
4.40
4.60
0.173
0.181
9.35
10.10
0.368
0.397
0.80 typ.
0.031 typ.
0.60
1.00
0.023
0.039
0°
8°
0°
8°
Figure 19: DPAK Foot Print Dimensions
(in millimeters)
6.7
3
3
1.6
2.3
6.7
2.3
1.6
7/11
TN12, TS12 and TYNx12 Series
Figure 20: D2PAK Package Mechanical Data
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
2mm min.
FLAT ZONE
V2
Figure 21: D2PAK Foot Print Dimensions
(in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
8/11
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ.
A
4.30
4.60 0.169
A1
2.49
2.69 0.098
A2
0.03
0.23 0.001
B
0.70
0.93 0.027
B2
1.25 1.40
0.048 0.055
C
0.45
0.60 0.017
C2
1.21
1.36 0.047
D
8.95
9.35 0.352
E
10.00
10.28 0.393
G
4.88
5.28 0.192
L
15.00
15.85 0.590
L2
1.27
1.40 0.050
L3
1.40
1.75 0.055
R
0.40
0.016
V2
0°
8°
0°
Max.
0.181
0.106
0.009
0.037
0.024
0.054
0.368
0.405
0.208
0.624
0.055
0.069
8°
TN12, TS12 and TYNx12 Series
Figure 22: IPAK Package Mechanical Data
REF.
A
E
C2
B2
L2
D
H
L
B3
L1
A1
B
V1
B5
e
C
A3
G
A
A1
A3
B
B2
B3
B5
C
C2
D
E
e
G
H
L
L1
L2
V1
DIMENSIONS
Millimeters
Inches
Min. Typ. Max. Min. Typ.
2.20
2.40 0.086
0.90
1.10 0.035
0.70
1.30 0.027
0.64
0.90 0.025
5.20
5.40 0.204
0.95
0.30
0.035
0.45
0.60 0.017
0.48
0.60 0.019
6
6.20 0.236
6.40
6.60 0.252
2.28
0.090
4.40
4.60 0.173
16.10
0.634
9
9.40 0.354
0.8
1.20 0.031
0.80
1
0.031
10°
10°
Max.
0.094
0.043
0.051
0.035
0.212
0.037
0.023
0.023
0.244
0.260
0.181
0.370
0.047
0.039
Figure 23: TO-220AB Package Mechanical Data
REF.
C
B
ØI
b2
L
F
A
I4
l3
c2
a1
l2
a2
M
b1
e
c1
A
a1
a2
B
b1
b2
C
c1
c2
e
F
ØI
I4
L
l2
l3
M
DIMENSIONS
Millimeters
Inches
Min. Typ. Max. Min. Typ.
15.20
15.90 0.598
3.75
0.147
13.00
14.00 0.511
10.00
10.40 0.393
0.61
0.88 0.024
1.23
1.32 0.048
4.40
4.60 0.173
0.49
0.70 0.019
2.40
2.72 0.094
2.40
2.70 0.094
6.20
6.60 0.244
3.75
3.85 0.147
15.80 16.40 16.80 0.622 0.646
2.65
2.95 0.104
1.14
1.70 0.044
1.14
1.70 0.044
2.60
0.102
Max.
0.625
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
0.661
0.116
0.066
0.066
9/11
TN12, TS12 and TYNx12 Series
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 8: Ordering Information
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
TN1215-x00B
TN1215x00
DPAK
0.3 g
75
Tube
TN1215-x00B-TR
TN1215x00
DPAK
0.3 g
2500
Tape & reel
TN1215-x00G
TN1215x00G
D2PAK
1.5 g
50
Tube
TN1215-x00G-TR
TN1215x00G
D2PAK
1.5 g
1000
Tape & reel
TN1215-x00H
TN1215x00
IPAK
0.3 g
75
Tube
TS1220-x00B
TS1220x00
DPAK
0.3 g
75
Tube
TS1220-x00B-TR
TS1220x00
DPAK
0.3 g
2500
Tape & reel
TS1220-x00H
TS1220x00
IPAK
0.3 g
75
Tube
TYNx12RG
TYNx12
TO-220AB
2.3 g
50
Tube
TYNx12TRG
TYNx12T
TO-220AB
2.3 g
50
Tube
Note: x = voltage
Table 9: Revision History
Date
Revision
Sep-2000
3
Last update.
25-Mar-2005
4
TO-220AB delivery mode changed from bulk to tube.
14-Oct-2005
5
Changed sensitivity values in Table 7 for TYNx12 (30 to
15 mA) and TYNx12T ( 15 to 5 mA). Added ECOPACK
statement
10/11
Description of Changes
TN12, TS12 and TYNx12 Series
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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11/11