® VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 “OMNIFET II”: FULLY AUTOPROTECTED POWER MOSFET TYPE VNB14NV04 RDS(on) Ilim Vclamp 3 VND14NV04 VND14NV04-1 1 35 mΩ 12 A TO-252 (DPAK) 40 V SO-8 VNP14NV04 VNS14NV04 3 2 3 LINEAR CURRENT LIMITATION ■ THERMAL SHUT DOWN ■ SHORT CIRCUIT PROTECTION ■ INTEGRATED CLAMP ■ LOW CURRENT DRAWN FROM INPUT PIN ■ DIAGNOSTIC FEEDBACK THROUGH INPUT PIN ■ ESD PROTECTION ■ DIRECT ACCESS TO THE GATE OF THE POWER MOSFET (ANALOG DRIVING) ■ COMPATIBLE WITH STANDARD POWER MOSFET ■ DESCRIPTION The VNB14NV04, VND14NV04, VND14NV04-1, VNP14NV04, VNS14NV04, are monolithic devices designed in STMicroelectronics VIPower M0-3 Technology, intended for replacement of standard Power MOSFETS from DC up to 50KHz BLOCK DIAGRAM 1 1 2 TO-220 TO-251 (IPAK) D2PAK 3 1 ORDER CODES PACKAGE TUBE T&R VNB14NV04 VNB14NV0413TR D2PAK TO-252 (DPAK) VND14NV04 VND14NV0413TR TO-251 (IPAK) VND14NV04-1 TO-220 VNP14NV04 SO-8 VNS14NV04 - applications. Built in thermal shutdown, linear current limitation |and overvoltage clamp protect the chip in harsh environments. Fault feedback can be detected by monitoring the voltage at the input pin. DRAIN 2 Overvoltage Clamp INPUT 1 Gate Control Over Temperature Linear Current Limiter 3 SOURCE July 2003 1/29 1 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 ABSOLUTE MAXIMUM RATING Symbol Parameter VDS VIN IIN RIN MIN ID IR VESD1 Drain-source Voltage (VIN=0V) Input Voltage Input Current Minimum Input Series Impedance Drain Current Reverse DC Output Current Electrostatic Discharge (R=1.5KΩ, C=100pF) Electrostatic Discharge on output pin only (R=330Ω, C=150pF) Total Dissipation at Tc=25°C Maximum Switching Energy (L=0.4mH; RL=0Ω; Vbat=13.5V; Tjstart=150ºC; IL=18A) Operating Junction Temperature Case Operating Temperature Storage Temperature VESD2 Ptot EMAX Tj Tc Tstg Value DPAK TO-220 IPAK Internally Clamped Internally Clamped +/-20 10 Internally Limited -15 4000 SO-8 D2PAK V V mA Ω A A V 16500 4.6 74 74 93 V 74 74 W 93 mJ Internally limited Internally limited -55 to 150 °C °C °C CONNECTION DIAGRAM (TOP VIEW) SO-8 Package (*) SOURCE 1 8 DRAIN SOURCE 4 INPUT DRAIN DRAIN SOURCE 5 DRAIN (*) For the pins configuration related to DPAK, D2 PAK, IPAK, TO-220 see outlines at page 1. CURRENT AND VOLTAGE CONVENTIONS ID VDS DRAIN IIN RIN INPUT SOURCE VIN 2/29 1 Unit VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 THERMAL DATA Symbol Rthj-case Rthj-lead Rthj-amb Parameter SO-8 Thermal Resistance Junction-case MAX Thermal Resistance Junction-lead MAX Thermal Resistance Junction-ambient MAX 27 90 (*) DPAK 1.7 Value TO-220 1.7 IPAK 1.7 D2PAK 1.7 65 (*) 62 102 52 (*) Unit °C/W °C/W °C/W mounted on a standard single-sided FR4 board with 0.5cm2 of Cu (at least 35 µm thick) connected to all DRAIN pins. Horizontal mounting and no artificial air flow. (*) When ELECTRICAL CHARACTERISTICS (-40°C < Tj < 150°C, unless otherwise specified) OFF Symbol VCLAMP VCLTH VINTH IISS VINCL IDSS Parameter Drain-source Clamp Voltage Drain-source Clamp Threshold Voltage Input Threshold Voltage Supply Current from Input Pin Input-Source Clamp Voltage Zero Input Voltage Drain Current (VIN=0V) Test Conditions Min Typ Max Unit VIN=0V; ID=7A 40 45 55 V VIN=0V; ID=2mA 36 VDS=VIN; ID=1mA 0.5 VDS=0V; VIN=5V IIN=1mA IIN=-1mA VDS=13V; VIN=0V; Tj=25°C 6 V 2.5 V 100 150 µA 6.8 8 -1.0 -0.3 30 VDS=25V; VIN=0V 75 V µA ON Symbol RDS(on) Parameter Static Drain-source On Resistance Test Conditions VIN=5V; ID=7A; Tj=25°C VIN=5V; ID=7A Min Typ Max 35 70 Unit mΩ 3/29 1 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 ELECTRICAL CHARACTERISTICS (continued) (Tj=25°C, unless otherwise specified) DYNAMIC Symbol gfs (*) COSS Parameter Forward Transconductance Output Capacitance Test Conditions Min Typ Max Unit VDD=13V; ID=7A 18 S VDS=13V; f=1MHz; VIN=0V 400 pF SWITCHING Symbol td(on) tr td(off) tf td(on) tr td(off) tf Parameter Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time (di/dt)on Turn-on Current Slope Qi Total Input Charge Test Conditions Min VDD=15V; ID=7A Vgen=5V; Rgen=RIN MIN=10Ω (see figure 1) VDD=15V; ID=7A Vgen=5V; Rgen=2.2KΩ (see figure 1) VDD=15V; ID=7A Vgen=5V; Rgen=RIN MIN=10Ω VDD=12V; ID =7A; VIN=5V; Igen=2.13mA (see figure 5) Typ 80 350 450 150 1.5 9.7 9 10.2 Max 250 1000 1350 500 4.5 30.0 25.0 30.0 Unit ns ns ns ns µs µs µs µs 16 A/µs 36.8 nC SOURCE DRAIN DIODE Symbol VSD (*) trr Qrr IRRM Parameter Forward On Voltage Reverse Recovery Time Reverse Recovery Charge Test Conditions ISD =7A; VIN=0V ISD=7A; di/dt=40A/µs Min VDD=30V; L=200µH Reverse Recovery Current (see test circuit, figure 2) Typ 0.8 300 0.8 Max 5 Unit V ns µC A PROTECTIONS (-40°C < Tj < 150°C, unless otherwise specified) Symbol Ilim tdlim Tjsh Tjrs Igf Eas Parameter Drain Current Limit Step Response Current Limit Test Conditions VIN=5V; VDS=13V VIN=5V; VDS=13V Overtemperature Shutdown Overtemperature Reset Fault Sink Current Single Pulse Avalanche Energy VIN=5V; VDS=13V; Tj=Tjsh starting Tj=25°C; VDD =24V VIN= 5V; Rgen=RIN MIN=10Ω; L=24mH (see figures 3 & 4) (*) Pulsed: Pulse duration = 300µs, duty cycle 1.5% 4/29 2 Min 12 Typ 18 Max 24 Unit A µs 45 150 175 200 °C 135 10 15 20 °C mA 400 mJ VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 PROTECTION FEATURES During normal operation, the INPUT pin is electrically connected to the gate of the internal power MOSFET through a low impedance path. The device then behaves like a standard power MOSFET and can be used as a switch from DC up to 50KHz. The only difference from the user’s standpoint is that a small DC current IISS (typ. 100µA) flows into the INPUT pin in order to supply the internal circuitry. The device integrates: - OVERVOLTAGE CLAMP PROTECTION: internally set at 45V, along with the rugged avalanche characteristics of the Power MOSFET stage give this device unrivalled ruggedness and energy handling capability. This feature is mainly important when driving inductive loads. - LINEAR CURRENT LIMITER CIRCUIT: limits the drain current ID to Ilim whatever the INPUT pin voltages. When the current limiter is active, the device operates in the linear region, so power dissipation may exceed the capability of the heatsink. Both case and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the overtemperature threshold Tjsh. - OVERTEMPERATURE AND SHORT CIRCUIT PROTECTION: these are based on sensing the chip temperature and are not dependent on the input voltage. The location of the sensing element on the chip in the power stage area ensures fast, accurate detection of the junction temperature. Overtemperature cutout occurs in the range 150 to 190 °C, a typical value being 170 °C. The device is automatically restarted when the chip temperature falls of about 15°C below shut-down temperature. - STATUS FEEDBACK: in the case of an overtemperature fault condition (Tj > Tjsh), the device tries to sink a diagnostic current Igf through the INPUT pin in order to indicate fault condition. If driven from a low impedance source, this current may be used in order to warn the control circuit of a device shutdown. If the drive impedance is high enough so that the INPUT pin driver is not able to supply the current Igf, the INPUT pin will fall to 0V. This will not however affect the device operation: no requirement is put on the current capability of the INPUT pin driver except to be able to supply the normal operation drive current IISS. Additional features of this device are ESD protection according to the Human Body model and the ability to be driven from a TTL Logic circuit. 5/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 Figure 1: Switching Time Test Circuit for Resistive Load VD Rgen Vgen ID 90% tr tf 10% t td(on) td(off) Vgen t Figure 2: Test Circuit for Diode Recovery Times A A D I FAST DIODE OMNIFET S L=100uH B B 25 Ω D Rgen Vgen VDD I OMNIFET S 8.5 Ω 6/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 Figure 3: Unclamped Inductive Load Test Circuits Figure 4: Unclamped Inductive Waveforms RGEN VIN PW Figure 5: Input Charge Test Circuit VIN GEN ND8003 7/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 Source-Drain Diode Forward Characteristics Static Drain Source On Resistance Vsd (mV) Rds(on) (mohms) 1000 180 160 950 Tj=-40ºC Vin=2.5V Vin=0V 140 900 120 850 Tj=25ºC 100 800 80 Tj=150ºC 750 60 700 40 650 20 0 2 4 6 8 10 12 14 16 18 0.1 0.2 0.3 0.4 0.5 Id (A) 0.6 0.7 0.8 0.9 1 Id(A) Static Drain-Source On resistance Vs. Input Voltage Derating Curve Rds(on) (mohms) 80 70 Tj=150ºC 60 50 Id=12A Id=1A Tj=25ºC 40 30 Id=12A Id=1A Tj=-40ºC 20 Id=12A Id=1A 10 3 3.5 4 4.5 5 5.5 6 6.5 Vin(V) Static Drain-Source On resistance Vs. Input Voltage Transconductance Rds(on) (mohms) Gfs (S) 80 24 22 70 Id=7A Tj=25ºC Tj=-40ºC Vds=13V 20 18 60 Tj=150ºC 16 Tj=150ºC 50 14 12 40 10 8 30 6 Tj=25ºC 4 20 Tj= - 40ºC 2 0 10 3 3.5 4 4.5 Vin(V) 8/29 5 5.5 6 6.5 0 1 2 3 4 5 6 7 Id(A) 8 9 10 11 12 13 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 Static Drain-Source On Resistance Vs. Id Transfer Characteristics Rds(on) (mohms) Idon (A) 70 18 Tj=25ºC 16 60 Vds=13.5V Vin=5V Tj=-40ºC 14 Tj=150ºC 50 12 40 10 8 30 Tj=25ºC Tj=150ºC 6 20 4 Tj=-40ºC 2 10 0 0 2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 2.5 2.25 3 2.75 3.5 3.25 Id(A) 4 3.75 4.5 4.25 5 4.75 5.5 5.25 Vin (V) Turn On Current Slope Turn On Current Slope di/dt(A/us) di/dt(A/us) 20 6 5.5 17.5 Vin=3.5V Vdd=15V Id=7A 5 Vin=5V Vdd=15V Id=7A 15 4.5 4 12.5 3.5 10 3 2.5 7.5 2 5 1.5 1 2.5 0.5 0 0 0 250 500 750 1000 1250 1500 1750 2000 2250 0 250 500 750 1000 1250 1500 1750 2000 2250 Rg(ohm) Rg(ohm) Turn off drain source voltage slope Input Voltage Vs. Input Charge Vin (V) dv/dt(V/us) 8 300 275 7 6 Vin=5V Vdd=15V Id=7A 250 Vds=12V Id=7A 225 200 5 175 150 4 125 100 3 75 2 50 25 1 0 0 0 0 5 10 15 20 25 Qg (nC) 30 35 40 250 500 750 1000 1250 1500 1750 2000 2250 2500 45 Rg(ohm) 9/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 Turn Off Drain-Source Voltage Slope Capacitance Variations C(pF) dv/dt(v/us) 1000 300 275 900 Vin=3.5V Vdd=15V Id=7A 250 225 f=1MHz Vin=0V 800 200 700 175 600 150 125 500 100 75 400 50 300 25 0 200 250 0 750 500 1000 1250 1500 1750 2000 2250 0 5 10 15 20 25 30 35 Vds(V) Rg(ohm) Switching Time Resistive Load Switching Time Resistive Load t(ns) t(us) 1750 11 tf 10 Vdd=15V Id=7A Vin=5V 9 8 1500 tr td(off) Vdd=15V Id=7A Rg=10ohm 1250 7 1000 6 5 750 4 3 td(off) 500 2 td(on) tr 250 1 0 250 0 500 tf td(on) 0 750 1000 1250 1500 1750 2000 2250 2500 3 3.25 3.5 3.75 4.25 4.5 4.75 5 5.25 Vin(V) Rg(ohm) Normalized On Resistance Vs. Temperature Output Characteristics Rds(on) (mOhm) Id (A) 4 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Vin=5V 3.5 Vin=4V Vin=5V Id=7A 3 Vin=3V 2.5 2 1.5 1 0.5 Vin=2V 0 0.5 1 1.5 2 2.5 3 Vds (V) 10/29 4 3.5 4 0 4.5 5 5.5 6 -50 -25 0 25 50 75 Tc (ºC) 100 125 150 175 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 Normalized Input Temperature Threshold Voltage Vs. Current Limit Vs. Junction Temperature Ilim (A) Vinth (V) 2 40 1.75 35 Vds=Vin Id=1mA 1.5 Vin=5V Vds=13V 30 1.25 25 1 20 0.75 15 0.5 10 0.25 5 0 0 -50 -25 0 25 50 75 100 125 150 175 Tc (ºC) -50 -25 0 25 50 75 100 125 150 175 Tc (ºC) Step Response Current Limit Tdlim(us) 55 52.5 Vin=5V Rg=10ohm 50 47.5 45 42.5 40 37.5 35 32.5 30 7.5 10 12.5 15 17.5 20 22.5 25 27.5 30 32.5 Vdd(V) 11/29 1 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 DPAK Maximum turn off current versus load inductance ILMAX (A) 100 A 10 B C 1 0.01 0.1 1 10 L(mH ) A = Single Pulse at TJstart=150ºC B= Repetitive pulse at TJstart=100ºC C= Repetitive Pulse at TJstart=125ºC Conditions: VCC=13.5V Values are generated with RL=0Ω In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization t 12/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 D2PAK Maximum turn off current versus load inductance ILMAX (A) 100 A B C 10 1 0.01 0.1 1 L(mH) 10 100 A = Single Pulse at TJstart=150ºC B= Repetitive pulse at TJstart=100ºC C= Repetitive Pulse at TJstart=125ºC Conditions: VCC=13.5V Values are generated with RL=0Ω In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization t 13/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 DPAK THERMAL DATA DPAK PC Board Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm, Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8cm2). Rthj-amb Vs PCB copper area in open box free air condition RTH j_amb (ºC/W) 90 80 70 60 50 40 30 0 2 4 6 PCB CU heatsink area (cm^2) 14/29 8 10 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 SO-8 THERMAL DATA SO-8 PC Board Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35µm, Copper areas: 0.14cm2, 0.6cm2, 1.6cm2). Rthj-amb Vs PCB copper area in open box free air condition SO-8 at 4 pins connected to TAB RTHj_amb (ºC/W) 110 105 100 95 90 85 80 75 70 0 0.5 1 1.5 2 2.5 PCB CU heatsink area (cm^2) 15/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 D2PAK THERMAL DATA D2PAK PC Board Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm, Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8cm2). Rthj-amb Vs PCB copper area in open box free air condition RTHj_amb (°C/W) 55 Tj-Tamb=50°C 50 45 40 35 30 0 2 4 6 PCB Cu heatsink area (cm^2) 16/29 8 10 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 DPAK Thermal Impedance Junction Ambient Single Pulse ZT H (°C/W) 1000 100 Footprint 6 cm2 10 1 0.1 0.0001 0.001 0.01 0.1 1 T ime (s) Thermal fitting model of an OMNIFET II in DPAK 10 100 1000 Pulse calculation formula Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ ) where δ = tp ⁄ T Thermal Parameter Tj C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 Pd T_amb Area/island (cm2) R1 (°C/W) R2 (°C/W) R3 ( °C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Footprint 0.1 0.35 1.20 2 15 61 0.0006 0.0021 0.05 0.3 0.45 0.8 6 24 5 17/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 D2PAK Thermal Impedance Junction Ambient Single Pulse ZTH (°C/W) 1000 100 Footprint 6 cm2 10 1 0.1 0.0001 0.001 0.01 0.1 1 Time (s) Thermal fitting model of an OMNIFET II in D2PAK 10 100 1000 Pulse calculation formula Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ ) where δ = tp ⁄ T Thermal Parameter Tj C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 Pd T_amb 18/29 Area/island (cm2) R1 (°C/W) R2 (°C/W) R3 ( °C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Footprint 0.1 0.35 0.3 4 9 37 0.0006 2.10E-03 8.00E-02 0.45 2 3 6 22 5 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 TO-251 (IPAK) MECHANICAL DATA mm. DIM. MIN. inch MAX. MIN. A 2.2 TYP 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051 B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 TYP. MAX. 0.85 B5 0.033 0.3 0.012 B6 0.95 0.037 C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023 D 6 6.2 0.236 0.244 E 6.4 6.6 0.252 0.260 G 4.4 4.6 0.173 0.181 H 15.9 16.3 0.626 0.641 L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039 A1 C2 A3 A C H B B6 = 1 = 2 G = = = E B2 = 3 B5 L D B3 L2 L1 19/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 D2PAK MECHANICAL DATA DIM. mm. MIN. TYP MAX. A 4.4 4.6 A1 2.49 2.69 A2 0.03 0.23 B 0.7 0.93 B2 1.14 1.7 C 0.45 0.6 C2 1.23 1.36 D 8.95 D1 E 10 E1 G 9.35 8 10.4 8.5 4.88 5.28 L 15 15.85 L2 1.27 1.4 L3 1.4 1.75 M 2.4 3.2 R V2 0.4 0º 8º P011P6 20/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 TO-252 (DPAK) MECHANICAL DATA DIM. mm. MIN. TYP MAX. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 B 0.64 0.90 B2 5.20 5.40 C 0.45 0.60 C2 0.48 0.60 D 6.00 6.20 D1 E 5.1 6.40 6.60 E1 4.7 e 2.28 G 4.40 4.60 H 9.35 10.10 L2 L4 0.8 0.60 R V2 Package Weight 1.00 0.2 0° 8° Gr. 0.29 P032P 21/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 TO-220 MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067 G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409 L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 M DIA. 0.154 2.6 0.102 3.75 3.85 0.147 0.151 . ' # & % / . . . . . 8 * KC & ) ( 8 ( ( . 22/29 MAX. ) * VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 SO-8 MECHANICAL DATA mm. inch DIM. MIN. TYP A a1 MAX. MIN. TYP. 1.75 0.1 0.068 0.25 a2 MAX. 0.003 0.009 1.65 0.064 a3 0.65 0.85 0.025 0.033 b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.25 0.5 0.010 0.019 c1 45 (typ.) D 4.8 5.0 0.188 0.196 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 3.81 0.150 F 3.8 4.0 0.14 0.157 L 0.4 1.27 0.015 0.050 M F 0.6 0.023 8 (max.) 23/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 D2PAK FOOTPRINT TUBE SHIPMENT (no suffix) A 16.90 C 12.20 5.08 1.60 B 3.50 9.75 All dimensions are in millimeters Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) 50 500 532 6 21.3 0.6 All dimensions are in mm. TAPE AND REEL SHIPMENT (suffix “13TR”) REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 24.4 60 30.4 All dimensions are in mm. TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 (± 0.1) P D (± 0.1/-0) D1 (min) F (± 0.05) K (max) P1 (± 0.1) All dimensions are in mm. 24 4 16 1.5 1.5 11.5 6.5 2 End Start Top No components Components No components cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 24/29 500mm min VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 DPAK FOOTPRINT TUBE SHIPMENT (no suffix) A 6 .7 1 .8 3 .0 1 .6 C 2 .3 6 .7 2 .3 B Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) 75 3000 532 6 21.3 0.6 All dimensions are in mm. TAPE AND REEL SHIPMENT (suffix “13TR”) REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 16.4 60 22.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 (± 0.1) P D (± 0.1/-0) D1 (min) F (± 0.05) K (max) P1 (± 0.1) All dimensions are in mm. 16 4 8 1.5 1.5 7.5 6.5 2 End Start Top No components Components No components cover tape 500mm min Empty components pockets saled with cover tape. 500mm min User direction of feed 25/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 SO-8 TUBE SHIPMENT (no suffix) B Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) C A 100 2000 532 3.2 6 0.6 All dimensions are in mm. TAPE AND REEL SHIPMENT (suffix “13TR”) REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 12.4 60 18.4 All dimensions are in mm. TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 (± 0.1) P D (± 0.1/-0) D1 (min) F (± 0.05) K (max) P1 (± 0.1) All dimensions are in mm. 12 4 8 1.5 1.5 5.5 4.5 2 End Start Top No components Components No components cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 26/29 500mm min VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 TO-220 TUBE SHIPMENT (no suffix) A Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) B 50 1000 532 5.5 31.4 0.75 All dimensions are in mm. C 27/29 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 IPAK TUBE SHIPMENT (no suffix) A C B Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) All dimensions are in mm. MECHANICAL POLARIZATION 28/29 75 3000 532 6 21.3 0.6 VNB14NV04 / VND14NV04 / VND14NV04-1 / VNP14NV04 / VNS14NV04 Information furnished is believed to be accurate and reliable. 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