TDA4482-D Quasi-Parallel Sound Processor for TV Sets Technology: Bipolar Features D High signal sensitivity D Simple filter configuration and few external components D Processing of two carrier stereo signals D D D D Alignment-free intercarrier mixer Optimum tuning characteristics Improved linearity for NICAM applications AF output level matched to SIMAVELEC condition D ESD protected D Low intercarrier distortions Case: DIP18 Block Diagram Figure 1. TELEFUNKEN Semiconductors Rev. A1, 29-Aug-96 1 (7) TDA4482-D Pin Configuration Pin 1–2 3 4 5 6 7–8 9 Function Vision-IF-carrier input Intercarrier input 5.74 MHz AGC storage capacitor Intercarrier output 5.74 MHz AF output 1 FM demod circuit 5.74 MHz Ground Pin 10–11 12 13 14 15 16–17 18 Function FM-demode circuit 5.5 MHz AF output 2 Intercarrier output 5.5 MHz Supply voltage Intercarrier input 5.5 MHz Sound-IF-carrier input Not conneccted Circuit Description This circuit configuration permits high-quality processing of audio carriers for FM-sound standards, providing separate inputs for the video and audio carrier. The audio carrier signal is passed to two multiplying mixer arrangements via a 3-stage variable wideband amplifier with led level output signals. One mixer generates the gain-control signal. The second mixer operates as an intercarrier demodulator and supplies the intermediate AF carrier. The video carrier signal required from the intercarrier is decoupled in a prelimited and selected form from the demodulator tank of the intermediate video frequency circuit (TDA4453 or TDA4439) and led to the intercarrier mixer via a limiting amplifier. Depending on the system, the Nyquist range of the IF input filter in the video channel affects the attainable AF signal-to-noise ratio. The audio PM IF carrier reaches the quadrature demodulators via an inter-connected IF filter and subsequent limiting amplifier. The resulting AF signals are led via a low-pass amplifier with increased level to the buffered output stages. Switching can take place with TTLequivalent levels. Absolute Maximum Ratings Reference point Pin 9, 18, unless otherwise specified Parameters Supply voltage Pin 14 Supply current Pin 14 External voltages Pins 1, 2, 3, 4, 5, 7, 8, 10, 11, 12, 13, 15, 16 and 17 Power dissipation (in soldered position) Junction temperature Ambient temperature range Storage temperature range Symbol VS IS Vext Value 10 to 13.5 80 6 Unit V mA V Ptot Tj Tamb Tstg 1 125 –25 to +70 –25 to +125 W °C °C °C Symbol RthJA Maximum 60 Unit K/W Thermal Resistance Parameters Junction ambient 2 (7) TELEFUNKEN Semiconductors Rev. A1, 29-Aug-96 TDA4482-D Electrical Characteristics VS = 12 V, Tamb = 25°C, reference point Pin 9, fPC = 38.9 MHz, fSC1 = 33.43 MHz, fSC2 = 33.1578 MHz, SC1/SC2 = 7 dB, unless otherwise specified Parameters Supple voltage range Supply current Output dc voltage Picture carrier input voltage Min. sound carrier input voltage SC1 AGC range Audio output voltage Audio-voltage difference between both outputs Harmonic distortion 1) Limiting threshold AM rejection Test Conditions / Pin Pin 14 Pin 14 Pin 6, 12 Pin 1–2 (5.5 MHz-output signal –3 dB) Pin 16–17 Symbol VS IS V0 v v FM deviation = 27 kHz, Pin 6, 12 Pin 6, 12 v Min 10 55 10 60 fmod = 1 kHz, FM deviation = 30 kHz Pin 6, 12 (VAF–3 dB) fmod= 1 kHz, m = 30% 3) V3(15)=10 mV, f= 5.5 (5.74) MHz Typ 62 3.6 20 50 30 65 500 DvAF THD Max 13.5 80 dB mV 1 0.5 250 55 Unit V mA V mV mV dB % mV dB FM amplifier input R3,15 560 W resistance Min. output load Pin 6,12 R 3 kW Signal-to-noise ratio (standard B/G) according to CCIR 468-2 specifications v16–17: SC1 = 10 mV, SC2 = 4.5 V PC: v1–2 = 20 mV, prelimited demodulator picture carrier signal from TDA4453 Black burst 1. channel/ 2. channel 2,3) (S+N)/N 62/60 dB Pin 6,12 Grid test signal 1. channel/ 2. channel 2,3) (S+N)/N 50/48 dB Pin 6,12 1) 2) 3) FM tank circuits: operation quality factor = 22 Standard B/G IF-modulated FBAS signal Reference signal: fmod = 1 kHz, FM deviation = 30 kHz TELEFUNKEN Semiconductors Rev. A1, 29-Aug-96 3 (7) TDA4482-D Figure 5. Pin 5 (13): Intercarrier output Pin 5 = 5.74 MHz, Pin 13 = 5.5 MHz Figure 2. Pin 1, 2: IF input vision carrier Figure 3. Pin 3 (15): Intercarrier input Pin 3 = 5.74 MHz, Pin 15 = 5.5 MHz Figure 6. Pin 12: AF output 2 Figure 4. Pin 4: AGC storage capacitor 4 (7) TELEFUNKEN Semiconductors Rev. A1, 29-Aug-96 TDA4482-D Figure 7. Pin 6: AF output 1 Figure 8. Pin 7, 8 (10, 11) FM demodulator circuit Pin 7,8 = 5.74 MHz, Pin 10, 11 = 5.5 MHz Figure 9. Pin 16, 17: IF input sound carrier TELEFUNKEN Semiconductors Rev. A1, 29-Aug-96 5 (7) TDA4482-D Test Circuit Dimensions in mm Case: 18-Pin dual inline plastic 6 (7) TELEFUNKEN Semiconductors Rev. A1, 29-Aug-96 TDA4482-D Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 TELEFUNKEN Semiconductors Rev. A1, 29-Aug-96 7 (7)