MIG20J501L TOSHIBA INTELLIGENT POWER MODULE MIG20J501L FEATURES (1) Maximum Rating VCES = 600 V, IC = 20 A (2) Control IC (3) (4) · High voltage IC ´ 3 + low voltage IC ´ 1 · 5-V system CMOS/correspond to TTL · Single power supply driving bootstrap circuit Functions · Over current protection: only low-side arm · Short circuit protection: high and low-side arms · RTC: high and low-side arms · Over temperature protection: only low-side arm · Power supply under voltage protection: high and low-side arms · Fault signal output: In case of abnormal status of low-side arm Applications · Inverter air conditioners · PWM carrier frequency 3 kHz 1 2001-05-07 MIG20J501L Equivalent Circuit P Tr1 IN (U) VCC (U) VCC GND C (U) IC1 IN C VS U E Tr2 CE (U) IN (V) VCC (V) IC2 IN VCC GND C (V) C VS V E Tr3 IC3 IN VCC (W) VCC COM GND C (W) D2 VO CE (V) IN (W) D1 VO C D3 VO VS W E Tr4 CE (W) IC4 D4 VOX VSX VCC (L) VCC GND GND roc roc CCT CT VFO VFO IN (X) IN (X) IN (Y) IN (Y) IN (Z) IN (Z) N Tr5 D5 VOY VSY Tr6 D6 VOZ VSZ GND 2 2001-05-07 MIG20J501L Maximum Ratings (Unless otherwise specified, Tj = 25°C) Inverter Item Supply Voltage Supply Voltage (Surge) Collector Emitter Voltage Symbol Test Condition Rating Unit VCC P-N 450 V VCC (surge) P-N 500 V 600 V ¾ VCES Collector Current ±IC Tc = 25°C 20 A Collector Current (Peak) ±ICP Tc = 25°C 40 A Collector Power Dissipation PC Tc = 25°C 50 W Junction Temperature Tj ¾ 150 °C Symbol Test Condition Rating Unit Control (protection) Item Supply Voltage VD VCC (U), (V), (W) - COM, VCC (L) - GND 20 V Supply Voltage VDB C (U), (V), (W) - CE (U), (V), (W) 20 V Input Voltage VIN IN (U), (V), (W) - COM, IN (X), (Y), (Z) - GND -0.5 to VD + 0.5 V Fault Output Voltage VFO VFO - GND -0.5 to VD + 0.5 V Fault Output Current IFO Sink current rating of VFO 10 mA Overcurrent Protection Set-up Terminal Iroc roc - GND 3 mA Rating Unit 400 V General Item Power Supply Voltage Self-protection Range (Short) Operating Module Frame Temperature Symbol VCC (PROT) Test Condition VD = 13.5 V to 16.5 V Inverter: Tj = 125°C Non-Repetitive Tc ¾ -20 to +100 °C Storage Temperature Tstg ¾ -40 to +125 °C Isolation Voltage VISO 2500 Vrms Sine wave 60 Hz, AC 1 minute, Fin-terminal Thermal resistance Item Junction to Case Thermal Resistance Case to Fin Thermal Resistance Symbol Test Condition Min Typ. Max Rth (j-c) Inverter IGBT ¾ ¾ 2.5 Rth (j-c) Inverter FRD ¾ ¾ 4.5 Rth (c-f) Case-Fin (coating grease) ¾ ¾ 0.4 3 Unit °C/W 2001-05-07 MIG20J501L Electrical Characteristics (Unless otherwise specified, Tj = 25°C) Inverter Item Collector-Emitter Saturation Voltage Forward Voltage Symbol VCE (sat) VF Test Condition VD = VDB = 15 V Input = ON Min Typ. Max IC = 20 A, Tj = 25°C 1.4 1.8 2.3 IC = 20 A, Tj = 125°C 1.5 ¾ 3.0 ¾ 2.0 2.7 ¾ 4.5 5.5 IF = 20 A, Input = OFF ton (H) ton (L) trr Switching Time tc (on) toff (H) Collector Cut-off Current VCC = 300 V, VD = 15 V, IC = 20 A Inductance load (high and low-side arms) Input = ON (NOTE 1) Unit V ¾ 4.0 5.5 ¾ 0.1 ¾ ¾ 1.1 1.5 ¾ 3.2 4.5 V ms toff (L) ¾ 1.1 2.2 tc (off) ¾ 0.5 1.0 Tj = 25°C ¾ ¾ 1.0 Tj = 125°C ¾ ¾ 10 Min Typ. Max Unit 13.5 15.0 16.5 V VCC (L) - GND ¾ 14 ¾ mA C (U) - CE (U), C (V) - CE (V), C (W) - CE (W) ¾ 1.5 ¾ mA Rroc = 1.54 kW, VD = 15 V, FO = 10 kW 5 V pullup 4.9 ¾ ¾ V Rroc = 1.54 kW, IFO = 5 mA, VD = 10 V ¾ 1.2 1.8 V ICES VCE = 600 V mA Control (protection) Item Control Power Supply Voltage Circuit Current Symbol VD ID VFOH Fault Output Voltage VFOL (1) VFOL (2) High-and Low-Side Arm Dead Time tdead Over Current Protection Trip Level IOC UVDBH Control Power Supply Under Voltage Protection UVDBHhys UVDL Test Condition VCC (U), (V), (W) - COM, VCC (L) - GND VD = 15 V, Input = OFF VDB = 15 V, Input = OFF VD = 15 V, FO = 10 kW 5 V pullup ¾ 0.8 1.0 V Correspond to each arm input VD = 15 V -20 < = Tj < = 100°C 10 ¾ ¾ ms VD = 15 V, Rroc = 1.54 kW ± 0.5%, IOC = 1.86 k ´ current (rating) (20 A) /Rroc (Note 1) 20 24 28 A 10.0 10.5 11.3 V Tj < = 125°C Filtering time min 5 ms UVDLhys Over Temperature Protection (Tj) (Note 2) Fault Output Pulse Width Trip level Hysteresis 0.4 0.55 0.7 V Trip level 11.5 12.0 12.5 V Hysteresis 0.3 0.5 0.7 V OT Trip level VD = 15 V ¾ 150 ¾ °C OThys Hysteresis VD = 15 V ¾ 7.5 ¾ °C ms tFO Input ON-Threshold Voltage (H side) VIN (ON) Input OFF-Threshold Voltage (H side) VIN (OFF) Input ON-Threshold Voltage (L side) VIN (ON) Input OFF-Threshold Voltage (L side) VIN (OFF) VD = 15 V, CFO = 22 nF IN (U), (V), (W) - COM VD = 15 V IN (X), (Y), (Z) - GND VD = 15 V (Note 3) 2.6 4.4 ¾ 1.0 ¾ 2.0 2.0 ¾ 3.0 1.0 ¾ 2.0 2.0 ¾ 3.0 V V Note 1: Can set overcurrent protection only at low-side arm. Note 2: Tj specifies junction temperature for low-side control IC. Note 3: When low-side arm trips caused by over/short current protection or under voltage protection or over temperature protection, fault pulse outputs. Pulse width, tFO, can be derived from the following equation: tFO (ms) = 200 ´ external capacitance (mF) 4 2001-05-07 MIG20J501L Mechanical Test and Characteristics Item Screw Tightening Torque Pin Straining Strength Pin Bending Strength Symbol Test Condition ¾ Recommended Screws rating: 12 kg·cm M4 Recommended rating: 1.18 N·m ¾ ¾ Min Typ. Max Unit ¾ 10 ¾ 15 kg·cm ¾ 0.98 ¾ 1.47 N·m JIS C7021 30 ¾ ¾ s JIS C7021 2 ¾ ¾ cycles ¾ ¾ 52 ¾ g Load 4.5 kg/44.1 N (P, N, U, V, W pins) Load 1.0 kg/9.8 N (except P, N, U, V, W pins) Load 1.5 kg /bend 90° with 14.7 N (P, N, U, V, W pins) Load 0.5 kg /bend 90° with 4.9 N (except P, N, U, V, W pins) ¾ Weight Applicable Standard ¾ Recommended Usage Condition Item Power Supply Voltage Symbol VCC Test Condition Recommended Rating Min Typ. Max Unit P-N 200 300 400 V Control Power Supply Voltage VD VCC (U), (V), (W) - COM, VCC (L) - GND 13.5 15.0 16.5 V Control Power Supply Voltage VDB C (U), (V), (W) - CE (U), (V), (W) 13.5 15.0 16.5 V ¾ 3 ¾ kHz 10 ¾ ¾ ms PWM Carrier Frequency ¾ fc High and Low-side Arms Dead Time tdead Correspond to each arm input Minimum Input pulse width tmin Acceptable minimum Input pulse width 7 ms Input ON-Threshold Voltage VIN (ON) IN (U), (V), (W) - COM 0 to 0.65 V Input OFF-Threshold Voltage VIN (OFF) IN (X), (Y), (Z) - GND 4.0 to 5.5 V 5 2001-05-07 MIG20J501L NOTE 1 Switching Waveform H Input Voltage VIN (ON) VIN (OFF) L trr Irr Rating Current 90% VCE 10% IC 10% 10% 10% tc (on) tc (off) toff ton ton (H): high-side arms “ton” ton (L): low-side arms “ton” toff (H): high-side arms “toff” toff (L): low-side arms “toff” Switching Time Test Circuit of High Side Input Voltage 1 kW 1 mF 15 V 1.54 kW 1 kW 1 kW 1 kW 1 mF IN (Z) IN (Y) IN (X) roc 1 kW 1 mF 15 V PG 15 V 1 mF 1 mF GND VCC (L) COM IN (W) CE (W) C (W) VCC (W) IN (V) CE (V) C (V) VCC (V) IN (U) N W V U 15 V CE (U) C (U) VCC (U) P VCE IC Inductance load VCC 6 2001-05-07 MIG20J501L Switching Time Test Circuit of Low Side Input Voltage PG 1 kW 1 mF 15 V 1.54 kW 1 kW 1 kW 1 mF IN (Z) IN (Y) IN (X) roc 1 kW 15 V 1 mF 15 V 1 kW 15 V 1 mF 1 mF GND VCC (L) COM IN (W) CE (W) C (W) VCC (W) IN (V) CE (V) C (V) VCC (V) IN (U) CE (U) C (U) VCC (U) N W V U P VCE Inductance load IC VCC NOTE 2 Details in protection function against overcurrent (1) OC (overcurrent) protection Protection function against overcurrent during the normal operation This function is set to only a low-side circuit. Diagnosis is also output. (2) SC (short-circuit) protection Protection function against overcurrent during abnormal operation such as a twisted wiring on a circuit board This function is set to high-and low-side circuits. Diagnosis is also output. (3) RTC (real time control) protection SC protection circuit has mask time period for about 2 ms to protect malfunction against noise. RTC protection is designed to protect IGBT from overcurrent and limit current flow during this mask time period. OC and SC protection functions cut off their operations, but RTC function just control current peak. Diagnosis function is not applied to this protection. Protection OC Arm Set Up Level Error Signal Low Side 120% that of rating Q High Side Non ¾ Low Side 180% that of rating Q High Side 220% that of rating Non Low Side 400% that of rating Non High Side 400% that of rating Non SC RTC 7 Rroc = 1.54 kW 2001-05-07 MIG20J501L Enlarged part A (5 parts) Soldering fillet Soldering fillet Package Dimension/Pin Assignment Enlarged part B (21 parts) Pin Names 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. IN (U) VCC (U) C (U) CE (U) IN (V) VCC (V) C (V) CE (V) IN (W) VCC (W) COM C (W) CE (W) 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. VCC (L) GND roc CCT VFO IN (X) IN (Y) IN (Z) P U V W N 8 2001-05-07 MIG20J501L Timing Charts Timing Chart for Short Current Protection Sequence (SC) (1) Upon occasion of short current condition, at first step, VGE is step-down to one-half of nominal value in order to reduce IGBT saturation current and finally. VGE is completely interrupted after some certain time, toff (OC). (2) An error signal output (VFO) goes into ‘L’ level when the lower arm IGBT is subjected to short current condition. The timing of VFO output (‘L’ level) is provided at complete interruption of VGE and the ‘L’ level is maintained during some certain time duration (tFO). (3) The reset operation is provided on condition that error signal output return to ‘H’ level after certain time duration and over current condition is removed and input signal turns from operation “H” to “L”. Timing Chart H VIN L VGE 0 < toff (OC) Noise immunizing time 2 ms toff (OC) SC toff (OC) IC 0 VFO tFO tFO (Only low side) 0 If these IPMs are accidentally shorted to ground and a 3-kHz carrier frequency is applied to them for 50 ms or more, they may be destroyed as a result. If short-circuit protection is enabled for the upper-arm IPMs, no error signal will be output when shorting occurs. Thus, shorting to ground will continue unabated for as long as the signal is input to the upper-arm IPMs from the microcontroller. 9 2001-05-07 MIG20J501L Timing Chart for Over Current Protection Sequence (OC) ··· Only low side (1) Upon occasion of over current condition, at first step, VGE is step-down to one-half of nominal value in order to reduce IGBT saturation current and finally. VGE is completely interrupted after some certain time, toff (OC). (2) An error signal output (VFO) goes into ‘L’ level when the lower arm IGBT is subjected to over current condition. The timing of VFO output (‘L’ level) is provided at complete interruption of VGE and the ‘L’ level is maintained during some certain time duration (tFO). (3) The reset operation is provided on condition that error signal output return to ‘H’ level after certain time duration and over current condition is removed and input signal turns from operation “H” to “L”. Timing Chart H VIN L VGE 0 < toff (OC) Noise immunizing time 10 ms toff (OC) OC toff (OC) IC 0 VFO tFO tFO (Only low side) 0 10 2001-05-07 MIG20J501L Timing Chart for Control Power Supply Under Voltage Protection Sequence (UV) (1) Upon occasion of control power supply under voltage, gate voltage (VGE) is interrupted and IGBT moves into ‘off-stage’. (This condition continues between UV Trip Level and UV Reset Level as shown in the chart) (2) An error signal output (VFO) stays in ‘L’ level until the power supply voltage returns to the reset level after the voltage reaches to the trip level. (3) The reset operation is provided on condition that power supply voltage returns to the UV reset level and input signal turns from operation “H” to “L”. Timing Chart UV Reset Level UV Trip Level VD Noise immunizing time 10 ms 0 H VIN L VGE 0 IC 0 VFO tFO tFO tFO (Only low side) 0 11 2001-05-07 MIG20J501L Timing Chart for Over Temperature Protection Sequence (OT) (1) Using temperature dependent characteristics of diode on low side control IC, the junction temperature (Tc) is detected. Upon occasion of over temperature condition, VGE of the lower arm IGBT is interrupted. (This condition continues between OT Trip Level and OT Reset Level as shown in the chart) (2) An error signal output (VFO) stays in ‘L’ level until the case temperature goes below the reset level after the temperature reaches to the trip level. (Only low side arm faults are output) (3) The reset operation is provided on condition that case temperature goes below the OT reset level and input signal turns from operation “H” to “L”. Timing Chart OT Trip Level OT Reset Level Tc 0 H VIN L VGE 0 IC 0 VFO tFO tFO (Only low side) 0 12 2001-05-07 MIG20J501L Inverter System Converter Inverter U P MIG20J501L sunnuber V C1 R2 D1 D1 C3 C1 R2 D1 M W C2 C1 R2 N GND VCC (L) IN (X) IN (Y) IN (Z) VFO CCT roc CE (U) VCC (U) C (U) IN (U) CE (V) VCC (V) C (V) IN (V) CE (W) VCC (W) C (W) IN (W) COM AC C4 SW R1 5V R3 Reg. MPU Recommended Usage Parts C1: C2: C3: C4: R1: R2: R3: D1: 10 mF (Bootstrap capacitor necessary to connect current limiting resistance.) 1 mF + 0.01 mF (Power supply bybass capacitor) 0.068 mF (For pulse width of error signal. tFo = C3 (mF) ´ 200 ms) 1 mF + 0.01 mF (Noise filter for Fixed resistor of overcurrent protection.) 1.54 kW ± 0.5% (Fixed resistor of overcurrent protection. OC = Rating Current ´ (1860/R1) ) 51 W (Current limit resistance of bootstrap diode. Value depends upon system.) 3.3 kW (Pull-up resistor of fault output pin.) 600 V/1 A (High speed diode for bootstrap. Recommend: 1JU42.) Please optimize sunnuber circuit between PN junction according to your using system. 13 2001-05-07 MIG20J501L IF – VF IC – VCE 25 25 Tj = -20°C 25°C Typical value -20°C 20 15 15 (A) 20 IC IF (A) 100°C 10 5 0 0 VDB = 15 V VDB = 13 V VDB = 18 V Typical value 10 5 0.5 1 1.5 VF 2 2.5 0 0 3 0.5 1 1.5 VCE (V) IC – VCE 2 2.5 (V) IC – VCE 25 25 Tj = 25°C Tj = 100°C VDB = 15 V VDB = 18 V VDB = 13 V Typical value 20 Typical value VDB = 18 V 20 VDB = 15 V (A) IC IC (A) VDB = 13 V 15 10 5 0 0 15 10 5 0.5 1 1.5 VCE 2 0 0 2.5 0.5 1.5 VCE Switching time – IC 2 2.5 (V) Switching time – IC 10 1 Typical value VCC = 300 V, VD = 15 V, Ta = 25°C Typical value VCC = 300 V, VD = 15 V, Ta = 25°C ton (H) ton (L) toff (H) Switching time (ms) Irr (A) ´ 10 Switching time (ms) 1 (V) toff (L) 1 tc (on) tc (off) tf Irr 0.1 trr tr 0.1 1 10 IC 0.01 1 100 (A) 10 IC 14 100 (A) 2001-05-07 MIG20J501L OC – Tc 30 28 (A) 24 OC 26 22 20 18 16 -60 VD = 15 V, Low side Typical value -40 -20 0 20 40 60 80 100 120 140 Tc (°C) 15 2001-05-07 MIG20J501L IC internal circuit for IGBT driver 1. Input High-side arm VCC (U), (V), (W) 50 k 500 k Internal regulating voltage 1 (6 V) Internal regulating voltage 2 (3.8 V) Continued on next stage 108 k 2.1 k 50 k IN (U), (V), (W) COM Low-side arm VCC (L) 25.5 k Internal regulating voltage 1 (5 V) 10 k 16 k 7.5 k 24.4 k IN (X), (Y), (Z) Continued on next stage GND 16 2001-05-07 MIG20J501L 2. roc Internal regulating voltage 3 (1.2 V) VCC (L) Continued on next stage roc GND 3. CCT VCC (L) Internal regulating voltage 1 (5 V) Continued on next stage CCT Continued on next stage From previous stage 30 k Continued on next stage GND 4. VFO VCC (L) Internal regulating voltage 1 (5 V) VFO 10 k From previous stage GND 17 2001-05-07 MIG20J501L Recommended circuit example when using a photocoupler (1) IPM input pin (low-side 3-phase and high-side 3-phase) (2) Fault output pin 15 V 15 V VCC P 560 560 VCC TLP421 TLP421 P 1.5 k 5V IN Microcomputer 560 VFO 10 k RN1242 N N GND Microcomputer GND Marking ££¬Lot no. MIG20J501L JAPAN 18 2001-05-07 MIG20J501L Precautions on Electrostatic Electricity (1) Operators must wear anti-static clothing and conductive shoes (or a leg or heel strap). (2) Operators must wear a wrist strap grounded to earth via a resistor of about 1 MW. (3) Soldering irons must be grounded from iron tip to earth, and must be used only at low voltages. (4) If the tweezers you use are likely to touch the device terminals, use anti-static tweezers and in particular avoid metallic tweezers. If a charged device touches a low-resistance tool, rapid discharge can occur. When using vacuum tweezers, attach a conductive chucking pat to the tip, and connect it to a dedicated ground used especially for anti-static purposes (suggested resistance value: 104 to 108 W). (5) Do not place devices or their containers near sources of strong electrical fields (such as above a CRT). (6) When storing printed circuit boards which have devices mounted on them, use a board container or bag that is protected against static charge. To avoid the occurrence of static charge or discharge due to friction, keep the boards separate from one other and do not stack them directly on top of one another. (7) Ensure, if possible, that any articles (such as clipboards) which are brought to any location where the level of static electricity must be closely controlled are constructed of anti-static materials. (8) In cases where the human body comes into direct contact with a device, be sure to wear anti-static finger covers or gloves (suggested resistance value: 108 W or less). (9) (10) Equipment safety covers installed near devices should have resistance ratings of 109 W or less. If a wrist strap cannot be used for some reason, and there is a possibility of imparting friction to devices, use an ionizer. 19 2001-05-07 MIG20J501L RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 20 2001-05-07