H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler tm Features Description ■ High data rate, 1MHz typical (NRZ) The H11LXM series has a high speed integrated circuit detector optically coupled to a gallium-arsenide infrared emitting diode. The output incorporates a Schmitt trigger, which provides hysteresis for noise immunity and pulse shaping. The detector circuit is optimized for simplicity of operation and utilizes an open collector output for maximum application flexibility. ■ Free from latch up and oscilliation throughout voltage and temperature ranges. ■ Microprocessor compatible drive ■ Logic compatible output sinks 16mA at 0.4V ■ ■ ■ ■ maximum Guaranteed on/off threshold hysteresis Wide supply voltage capability, compatible with all popular logic systems Underwriters Laboratory (UL) recognized— file #E90700, Volume 2 VDE recognized – File#102497 – Add option V (e.g., H11LIVM) Applications ■ Logic to logic isolator ■ Programmable current level sensor ■ Line receiver—eliminate noise and transient problems ■ A.C. to TTL conversion—square wave shaping ■ Digital programming of power supplies ■ Interfaces computers with peripherals Packages Schematic 6 VCC ANODE 1 6 6 CATHODE 2 1 5 GND 1 4 VO 3 6 Truth Table 1 ©2005 Fairchild Semiconductor Corporation H11L1M, H11L2M, H11L3M Rev. 1.0.0 1 Input Output H L L H www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler December 2006 Symbol Parameters Value Units TOTAL DEVICE TSTG Storage Temperature -55 to +150 °C TOPR Operating Temperature -40 to +85 °C TSOL Lead Solder Temperature 260 for 10 sec °C 250 mW 2.94 mW/°C PD Total Device Power Dissipation @ 25°C Derate Above 25°C EMITTER IF Continuous Forward Current 60 mA VR Reverse Voltage 6 V Forward Current – Peak (1µs pulse, 300pps) 3.0 A LED Power Dissipation 25°C Ambient 120 mW 1.41 mW/°C 150 mW 2.0 mW/°C IF(pk) PD Derate Linearly From 25°C DETECTOR PD Detector Power Dissipation @ 25°C Derate Linearly from 25°C VO V45 Allowed Range 0 to 16 V VCC V65 Allowed Range 3 to 16 V 50 mA IO I4 Output Current 2 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Absolute Maximum Ratings (TA = 25°C Unless otherwise specified.) Individual Component Characteristics Symbol Parameters Test Conditions Device Min. Typ. Max. Units 1.2 1.5 V EMITTER VF Input Forward Voltage IF = 10mA All IF = 0.3mA 0.75 1.0 IR Reverse Current VR = 3V All 10 µA CJ Capacitance V = 0, f = 1.0MHz All 100 pF 15 V 5.0 mA 100 µA DETECTOR VCC ICC(off) IOH Operating Voltage Range All Supply Current IF = 0, VCC = 5V All Output Current, High IF = 0, VCC = VO = 15V All Test Conditions Device 3 1.6 Transfer Characteristics Symbol Parameter Min. Typ. Max. Units DC CHARACTERISTICS ICC(on) Supply Current IF = 10mA, VCC = 5V All 1.6 5.0 mA VOL Output Voltage, low RL= 270Ω,VCC = 5V, IF = IF(on) max. All 0.2 0.4 V IF(on) Turn-On Threshold Current(1) RL = 270Ω, VCC = 5V H11L1M 1.6 mA H11L2M 10.0 H11L3M 5.0 IF(off) RL = 270Ω, VCC = 5V All 0.3 1.0 RL = 270Ω, VCC = 5V All 0.50 0.75 0.90 Turn-On time RL = 270Ω, VCC = 5V, IF = IF(on), TA = 25°C All 1.0 4 Fall Time RL = 270Ω, VCC = 5V, IF = IF(on), TA= 25°C All 0.1 Turn-Off Time RL= 270Ω, VCC = 5V, IF = IF(on), TA= 25°C All 1.2 Rise time RL = 270Ω, VCC = 5V, IF = IF(on), TA = 25°C All 0.1 µs All 1.0 MHz Turn-Off Threshold Current IF(off)/IF(on) Hysteresis Ratio mA AC CHARACTERISTICS, Switching Speed ton tf toff tr Data Rate µs µs 4 µs Isolation Characteristics Symbol Parameter Test Conditions VISO Input-Output Isolation Voltage t =1 sec. CISO Isolation Capacitance VI-O = 0V, f = 1MHz RISO Isolation Resistance VI-O = ±500 VDC Min. Typ. Max. VPEAK 7500 0.4 1011 Units 0.6 pF Ω Note: 1. Maximum IF(ON) is the maximum current required to trigger the output. For example, a 1.6mA maximum trigger current would require the LED to be driven at a current greater than 1.6mA to guarantee the device will turn on. A 10% guard band is recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 60mA. 3 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Electrical Characteristics (TA = 25°C Unless otherwise specified.) Figure 1. Transfer Characteristics Figure 2. Threshold Current vs. Supply Voltage VCC= 5V RL = 270 Ω TA = 25°C V OH 5 O V - OUTPUT VOLTAGE (V) IF - THRESHOLD CURRENT (NORMALIZED) 6 4 I F(OFF) I F(ON) 3 2 1 V OL 0 0 1 2 1.6 IF NORMALIZED TO : IF(ON) AT VCC = 5V 1.4 TA = 25oC 1.2 TURN ON THRESHOLD 1.0 TURN OFF THRESHOLD 0.8 0.6 0.4 0 3 2 Figure 3. Threshold Current vs. Supply Temperature 8 10 12 14 16 Figure 4. Output Voltage, Low vs. Load Current 1.6 2 VOL - OUTPUT VOLTAGE, LOW (V) IF(On) , IF(Off) - THRESHOLD CURRENT (NORMALIZED) 6 VCC - SUPPLY VOLTAGE (V) IF - INPUT CURRENT (mA) 1.4 1.2 1.0 0.8 NORMALIZED TO : VCC = 5V TA = 25oC 0.6 0.4 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 IF = I F(ON) V CC = 5V R L = 270ΩΩ 0.2 -50 -25 0 25 50 75 0.1 100 1 TA - TEMPERATURE ( oC) 10 100 I O - LOAD CURRENT (mA) Figure 5. Supply Current vs. Supply Voltage Figure 6. LED Forward Voltage vs. Forward Current 1.7 6 VF - FORWARD VOLTAGE (V) TA = 0 °C 5 I C - SUPPLY CURRENT (mA) 4 I F = 5mA 25 °C 70 °C 4 3 2 TA = 0 °C 25 °C 70 °C 1 1.6 1.5 1.4 TA = 55°C 1.3 TA = 25°C 1.2 TA = 100°C IF = 0mA 1.1 0 0 2 4 6 8 10 12 14 16 1.0 VCC - SUPPLY VOLTAGE (V) 10 100 IF - LED FORWARD CURRENT (mA) 4 H11L1M, H11L2M, H11L3M Rev. 1.0.0 1 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Typical Performance Curves I6 RE VIN 5V 5V IF 50% 0 1 H11L1 6 RL 270Ω 4 VIN VO toff ton tr = tf = 0.01µS Z = 50Ω 2 5 10% VO 90% tf tr Figure 7. Switching Test Circuit and Waveforms 5 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler C Through Hole Surface Mount 0.350 (8.89) 0.320 (8.13) 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.012 (0.30) 0.008 (0.20) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 0.390 (9.90) 0.332 (8.43) 0.100 [2.54] 15° 0.035 (0.88) 0.012 (0.30) 0.020 (0.50) 0.016 (0.41) 0.012 (0.30) Recommend Pad Layout for Surface Mount Leadform 0.4” Lead Spacing 0.350 (8.89) 0.320 (8.13) 0.070 (1.78) 0.060 (1.52) 0.260 (6.60) 0.240 (6.10) 0.425 (10.79) 0.070 (1.77) 0.040 (1.02) 0.100 (2.54) 0.305 (7.75) 0.030 (0.76) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.012 (0.30) 0.008 (0.21) 0.100 [2.54] 0.425 (10.80) 0.400 (10.16) Note: All dimensions are in inches (millimeters). 6 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Package Dimensions H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Ordering Information Option/Order Entry Identifier Description S Surface Mount Lead Bend SR2 Surface Mount; Tape and reel T 0.4" Lead Spacing V VDE 0884 TV VDE 0884, 0.4" Lead Spacing SV VDE 0884, Surface Mount SR2V VDE 0884, Surface Mount, Tape & Reel Marking Information 1 V 3 H11L1 2 X YY Q 6 5 4 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 One digit year code, e.g., ‘3’ 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code *Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with date code ‘325’ or earlier are marked in portrait format. 7 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com 12.0 ± 0.1 4.5 ± 0.20 2.0 ± 0.05 Ø1.5 MIN 4.0 ± 0.1 0.30 ± 0.05 1.75 ± 0.10 11.5 ± 1.0 21.0 ± 0.1 9.1 ± 0.20 Ø1.5 ± 0.1/-0 10.1 ± 0.20 0.1 MAX 24.0 ± 0.3 User Direction of Feed Note: All dimensions are in millimeters. Reflow Profile 300 260°C 280 260 >245°C = 42 Sec 240 220 200 180 °C Time above 183°C = 90 Sec 160 140 120 1.822°C/Sec Ramp up rate 100 80 60 40 33 Sec 20 0 0 60 120 180 270 360 Time (s) 8 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Tape Dimensions FAIRCHILD SEMICONDUCTOR TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT® FAST® FASTr™ FPS™ FRFET™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic® TINYOPTO™ TruTranslation™ UHC® UniFET™ VCX™ Wire™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I22