XILINX XC9572

0
XC9572XL High Performance
CPLD
DS057 (v1.1) August 28, 2000
0
5
Features
•
•
•
•
•
•
•
•
•
•
•
5 ns pin-to-pin logic delays
System frequency up to 178 MHz
72 macrocells with 1,600 usable gates
Available in small footprint packages
- 44-pin PLCC (34 user I/O pins)
- 44-pin VQFP (34 user I/O pins)
- 48-pin CSP (38 user I/O pins)
- 64-pin VQFP (52 user I/O pins)
- 100-pin TQFP (72 user I/O pins)
Optimized for high-performance 3.3V systems
- Low power operation
- 5V tolerant I/O pins accept 5 V, 3.3V, and 2.5V
signals
- 3.3V or 2.5V output capability
- Advanced 0.35 micron feature size CMOS
FastFLASH™ technology
Advanced system features
- In-system programmable
- Superior pin-locking and routability with
FastCONNECT II™ switch matrix
- Extra wide 54-input Function Blocks
- Up to 90 product-terms per macrocell with
individual product-term allocation
- Local clock inversion with three global and one
product-term clocks
- Individual output enable per output pin
- Input hysteresis on all user and boundary-scan pin
inputs
- Bus-hold circuitry on all user pin inputs
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
Fast concurrent programming
Slew rate control on individual outputs
Enhanced data security features
Excellent quality and reliability
- Endurance exceeding 10,000 program/erase
cycles
- 20 year data retention
- ESD protection exceeding 2,000V
Pin-compatible with 5V-core XC9572 device in the
44-pin PLCC package and the 100-pin TQFP package
Preliminary Product Specification
cations and computing systems. It is comprised of four
54V18 Function Blocks, providing 1,600 usable gates with
propagation delays of 5 ns. See Figure 2 for architecture
overview.
Power Estimation
Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output
loading. To help reduce power dissipation, each macrocell
in a XC9500XL device may be configured for low-power
mode (from the default high-performance mode). In addition, unused product-terms and macrocells are automatically deactivated by the software to further conserve power.
For a general estimate of ICC, the following equation may be
used:
ICC (mA) = MCHP(0.5) + MCLP(0.3) + MC(0.0045 mA/MHz) f
Where:
MCHP = Macrocells in high-performance (default) mode
MCLP = Macrocells in low-power mode
MC = Total number of macrocells used
f = Clock frequency (MHz)
This calculation is based on typical operating conditions
using a pattern of 16-bit up/down counters in each Function
Block with no output loading. The actual ICC value varies
with the design application and should be verified during
normal system operation.
Figure 1 shows the above estimation in a graphical form.
100
178 MHz
80
60
Typical ICC (mA)
R
gh
Hi
40
L
ow
Po
we
ma
nc
e
104 MHz
r
20
Description
0
The XC9572XL is a 3.3V CPLD targeted for high-performance, low-voltage applications in leading-edge communi-
Pe
r
rfo
100
50
150
Clock Frequency (MHz)
200
DS057_01_081500
Figure 1: Typical ICC vs. Frequency for XC9572XL
© 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS057 (v1.1) August 28, 2000
Preliminary Product Specification
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1
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XC9572XL High Performance CPLD
3
JTAG Port
1
JTAG
Controller
In-System Programming Controller
54
18
I/O
Function
Block 1
Macrocells
1 to 18
I/O
FastCONNECT II Switch Matrix
I/O
I/O
I/O
Blocks
I/O
I/O
I/O
54
18
Function
Block 2
Macrocells
1 to 18
54
18
Function
Block 3
Macrocells
1 to 18
I/O
3
I/O/GCK
54
1
18
I/O/GSR
I/O/GTS
2
Function
Block 4
Macrocells
1 to 18
DS057_02_082800
Figure 2: XC9572XL Architecture
Function Block outputs (indicated by the bold line) drive the I/O Blocks directly.
2
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DS057 (v1.1) August 28, 2000
Preliminary Product Specification
R
XC9572XL High Performance CPLD
Absolute Maximum Ratings
Symbol
Description
Value
Units
VCC
Supply voltage relative to GND
–0.5 to 4.0
V
VIN
GND(1)
–0.5 to 5.5
V
Input voltage relative to
output(1)
VTS
Voltage applied to 3-state
TSTG
Storage temperature (ambient)
TSOL
TJ
–0.5 to 5.5
V
–65 to +150
oC
Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm)
+260
oC
Junction temperature
+150
oC
Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins may undershoot to –2.0 V or overshoot to +7.0V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
Recommended Operation Conditions
Symbol
VCCINT
VCCIO
Parameter
Supply voltage for internal logic
and input buffers
Commercial TA =
Industrial TA =
0oC
–40oC
to
70oC
to
+85oC
Min
Max
Units
3.0
3.6
V
3.0
3.6
V
Supply voltage for output drivers for 3.3V operation
3.0
3.6
V
Supply voltage for output drivers for 2.5V operation
2.3
2.7
V
VIL
Low-level input voltage
0
0.80
V
VIH
High-level input voltage
2.0
5.5
V
VO
Output voltage
0
VCCIO
V
Quality and Reliability Characteristics
Symbol
Parameter
Min
Max
Units
20
-
Years
TDR
Data Retention
NPE
Program/Erase Cycles (Endurance)
10,000
-
Cycles
VESD
Electrostatic Discharge (ESD)
2,000
-
Volts
DC Characteristic Over Recommended Operating Conditions
Symbol
Parameter
Test Conditions
Min
Max
Units
Output high voltage for 3.3V outputs
IOH = –4.0 mA
2.4
V
Output high voltage for 2.5V outputs
IOH = –500 µA
90% VCCIO
V
Output low voltage for 3.3V outputs
IOL = 8.0 mA
-
0.4
V
Output low voltage for 2.5V outputs
IOL = 500 µA
-
0.4
V
IIL
Input leakage current
VCC = Max
VIN = GND or VCC
-
±10
µA
IIH
I/O high-Z leakage current
VCC = Max
VIN = GND or VCC
-
±10
µA
CIN
I/O capacitance
VIN = GND
f = 1.0 MHz
-
10
pF
ICC
Operating supply current
(low power mode, active)
VI = GND, No load
f = 1.0 MHz
20 (Typical)
VOH
VOL
DS057 (v1.1) August 28, 2000
Preliminary Product Specification
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mA
3
R
XC9572XL High Performance CPLD
AC Characteristics
XC9572XL-5
Symbol
Parameter
XC9572XL-7
XC9572XL-10
Min(1)
Max(1)
Min
Max
Min
Max
Units
-
5.0
-
7.5
-
10.0
ns
TPD
I/O to output valid
TSU
I/O setup time before GCK
3.7
-
4.8
-
6.5
-
ns
TH
I/O hold time after GCK
0.0
-
0.0
-
0.0
-
ns
GCK to output valid
-
3.5
-
4.5
-
5.8
ns
fSYSTEM
Multiple FB internal operating frequency
-
178.6
-
125.0
-
100.0
MHz
TPSU
I/O setup time before p-term clock input
1.7
-
1.6
-
2.1
-
ns
TPH
I/O hold time after p-term clock input
2.0
-
3.2
-
4.4
-
ns
P-term clock output valid
-
5.5
-
7.7
-
10.2
ns
TOE
GTS to output valid
-
4.0
-
5.0
-
7.0
ns
TOD
GTS to output disable
-
4.0
-
5.0
-
7.0
ns
TPOE
Product term OE to output enabled
-
7.0
-
9.5
-
11.0
ns
TPOD
Product term OE to output disabled
-
7.0
-
9.5
-
11.0
ns
TAO
GSR to output valid
-
10.0
-
12.0
-
14.5
ns
TPAO
P-term S/R to output valid
-
10.5
-
12.6
-
15.3
ns
TWLH
GCK pulse width (High or Low)
2.8
-
4.0
-
4.5
-
ns
TPLH
P-term clock pulse width (High or Low)
5.0
-
6.5
-
7.0
-
ns
TCO
TPCO
Advance
Preliminary
Notes:
1. Please contact Xilinx for up-to-date information on advance specifications.
VTEST
R1
Output Type
VCCIO
VTEST
R1
R2
CL
3.3V
3.3V
320 Ω
360 Ω
35 pF
2.5V
2.5V
250 Ω
660 Ω
35 pF
Device Output
R2
CL
DS058_03_081500
Figure 3: AC Load Circuit
4
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DS057 (v1.1) August 28, 2000
Preliminary Product Specification
R
XC9572XL High Performance CPLD
Internal Timing Parameters
XC9572XL-5
Symbol
Parameter
Min(1)
XC9572XL-7
XC9572XL-10
Max(1)
Min
Max
Min
Max
Units
Buffer Delays
TIN
Input buffer delay
-
1.5
-
2.3
-
3.5
ns
TGCK
GCK buffer delay
-
1.1
-
1.5
-
1.8
ns
TGSR
GSR buffer delay
-
2.0
-
3.1
-
4.5
ns
TGTS
GTS buffer delay
-
4.0
-
5.0
-
7.0
ns
TOUT
Output buffer delay
-
2.0
-
2.5
-
3.0
ns
TEN
Output buffer enable/disable
-
0.0
-
0.0
-
0.0
ns
-
1.6
-
2.4
-
2.7
ns
delay
Product Term Control Delays
TPTCK
Product term clock delay
TPTSR
Product term set/reset delay
-
1.0
-
1.4
-
1.8
ns
TPTTS
Product term 3-state delay
-
5.5
-
7.2
-
7.5
ns
-
0.5
-
1.3
-
1.7
ns
Internal Register and Combinatorial Delays
TPDI
Combinatorial logic propagation delay
TSUI
Register setup time
2.3
-
2.6
-
3.0
-
ns
THI
Register hold time
1.4
-
2.2
-
3.5
-
ns
TECSU
Register clock enable setup time
2.3
-
2.6
-
3.0
-
ns
TECHO
Register clock enable hold time
1.4
-
2.2
-
3.5
-
ns
TCOI
Register clock to output valid time
-
0.4
-
0.5
-
1.0
ns
TAOI
Register async. S/R to output delay
-
6.0
-
6.4
-
7.0
ns
TRAI
Register async. S/R recover before clock
TLOGI
Internal logic delay
-
1.0
-
1.4
-
1.8
ns
Internal low power logic delay
-
5.0
-
6.4
-
7.3
ns
-
1.9
-
3.5
-
4.2
ns
Incremental product term allocator delay
-
0.7
-
0.8
-
1.0
ns
Slew-rate limited delay
-
3.0
-
4.0
-
4.5
ns
TLOGILP
5.0
7.5
10.0
ns
Feedback Delays
TF
FastCONNECT II feedback delay
Time Adders
TPTA
TSLEW
Advance
Preliminary
Notes:
1. Please contact Xilinx for up-to-date information on advance specifications.
DS057 (v1.1) August 28, 2000
Preliminary Product Specification
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5
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XC9572XL High Performance CPLD
XC9572XL I/O Pins
Function
Block
Macrocell
1
1
-
-
-
-
16
1
2
1
39
D7
8
13
1
3
-
-
D4
12
1
4
-
-
-
1
5
2
40
D6
1
6
3
41
C7
10
15
198
3
6
-
1
7
-
-
-
-
25
195
3
7
-
1
8
4
42
C6
11
17
192
3
8
13
7
43(1)
B7(1)
15(1)
22(1)
PC44
VQ44
CS48
Func
-tion
Block
Macrocell
213
3
1
-
-
210
3
2
11
5
18
207
3
3
-
-
13
20
204
3
4
-
9
14
201
3
5
12
VQ64
BScan
TQ100 Order
PC44
VQ64
TQ100
BScan
Order
-
-
41
105
B5
22
32
102
C4
31
49
99
-
-
32
50
96
6
A4
24
35
93
-
-
34
53
90
-
-
-
54
87
B4
25
37
84
VQ44
CS48
1
9
5(1)
189
3
9
14
8
A3
27
42
81
1
10
-
-
-
18
28
186
3
10
-
-
D3
39
60
78
1
11
6(1)
44(1)
B6(1)
16(1)
23(1)
183
3
11
18
12
B2
33
52
75
1
12
-
-
-
23
33
180
3
12
-
-
-
40
61
72
1
13
-
-
-
-
36
177
3
13
-
-
-
-
63
69
1
14
7(1)
1(1)
A7(1)
17(1)
27(1)
174
3
14
19
13
B1
35
55
66
1
15
8
2
A6
19
29
171
3
15
20
14
C2
36
56
63
1
16
-
-
-
-
39
168
3
16
24
18
D2
42
64
60
1
17
9
3
C5
20
30
165
3
17
22
16
C3
38
58
57
1
18
-
-
-
-
40
162
3
18
-
-
-
-
59
54
2
1
-
-
-
-
87
159
4
1
-
-
-
-
65
51
2
2
35
29
F4
60
94
156
4
2
25
19
E1
43
67
48
2
3
-
-
-
58
91
153
4
3
-
-
-
46
71
45
2
4
-
-
-
59
93
150
4
4
-
-
-
47
72
42
2
5
36
30
G5
61
95
147
4
5
26
20
E2
44
68
39
2
6
37
31
F5
62
96
144
4
6
-
-
E4
49
76
36
2
7
-
-
-
-
3(2)
141
4
7
-
-
-
-
77
33
2
8
38
32
G6
63
97
138
4
8
27
21
F1
45
70
30
2
9
39(1)
33(1)
G7(1)
64(1)
99(1)
135
4
9
-
-
-
-
66
27
2
10
-
-
-
1
1
132
4
10
-
-
-
51
81
24
2
11
40(1)
34(1)
F6(1)
2(1)
4(1)
129
4
11
28
22
G1
48
74
21
2
12
-
-
-
4
6
126
4
12
-
-
-
52
82
18
2
13
-
-
-
-
8
123
4
13
-
-
-
-
85
15
2
14
42(3)
36(3)
E6(3)
5(3)
9(3)
120
4
14
29
23
F2
50
78
12
2
15
43
37
E7
6
11
117
4
15
33
27
E3
56
89
9
2
16
-
-
-
-
10
114
4
16
-
-
-
-
86
6
2
17
44
38
E5
7
12
111
4
17
34
28
G4
57
90
3
2
18
-
-
-
-
92
108
4
18
-
-
-
-
79
0
Notes:
1. Global control pin.
2. GTS1 for TQ100.
3. GTS1 for PC44, VQ44, CS48, and VQ64.
6
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DS057 (v1.1) August 28, 2000
Preliminary Product Specification
R
XC9572XL High Performance CPLD
XC9572XL Global, JTAG and Power Pins
Pin Type
PC44
VQ44
CS48
VQ64
TQ100
I/O/GCK1
5
43
B7
15
22
I/O/GCK2
6
44
B6
16
23
I/O/GCK3
7
1
A7
17
27
I/O/GTS1
42
36
E6
5
3
I/O/GTS2
40
34
F6
2
4
I/O/GSR
39
33
G7
64
99
TCK
17
11
A1
30
48
TDI
15
9
B3
28
45
TDO
30
24
G2
53
83
TMS
16
10
A2
29
47
VCCINT 3.3V
21, 41
15, 35
C1, F7
3, 37
5, 57, 98
VCCIO 2.5V/3.3V
32
26
G3
26, 55
26, 38, 51, 88
GND
10, 23, 31
4, 17, 25
A5, D1, F3
14, 21, 41, 54
21, 31, 44, 62,
69, 75, 84, 100
No Connects
-
-
-
-
2, 7, 19, 24, 34,
43, 46, 73, 80
DS057 (v1.1) August 28, 2000
Preliminary Product Specification
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7
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XC9572XL High Performance CPLD
Ordering Information
Example:
XC9572XL -7 TQ 100 C
Device Type
Temperature Range
Number of Pins
Speed Grade
Package Type
Device Ordering Options
Speed
Package
Temperature
-10
10 ns pin-to-pin delay
PC44
44-pin Plastic Lead Chip Carrier (PLCC)
C = Commercial
TA = 0°C to + 70°C
-7
7.5 ns pin-to-pin delay
VQ44
44-pin Quad Flat Pack (VQFP)
I = Industrial
TA = –40°C to + 85°C
-5
5 ns pin-to-pin delay
CS48
48-pin Chip Scale Package
VQ64
64-pin Quad Flat Pack (VQFP)
TQ100
100-pin Thin Quad Flat Pack (TQFP)
Component Availability
Pins
Type
Code
XC9572XL
44
44
48
64
100
Plastic
Plastic
Plastic
Plastic
Plastic
PLCC
VQFP
CSP
VQFP
TQFP
PC44
VQ44
CS48
VQ64
TQ100
-10
C, I
C, I
-
C, I
C, I
-7
C, I
C, I
C
C, I
C, I
-5
(C)
(C)
-
(C)
(C)
Notes:
1. C = Commercial (TA = 0oC to +70oC); I = Industrial (TA = –40oC to +85oC)
2. ( ) Parenthesis indicate future products. Please contact Xilinx for up-to-date information.
Revision History
The following table shows the revision history for this document.
8
Date
Version
Revision
09/28/98
1.0
Initial Xilinx release.
08/28/00
1.1
Added VQ44 package.
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DS057 (v1.1) August 28, 2000
Preliminary Product Specification