ACTEL BPW180-0828

Ball / Land Grid Array Sockets
Twist Lock Type
E-tec is now the leading BGA socket manufacturer.
EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries.
Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed
and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional
board space. The 1.27mm pitch screw lock socket extends ≈ 6,00 mm beyond the outer ball row with
no fixing holes.
We aim to solve your requirements - many different terminals and configurations are available.
Your custom sets our standards!
Please note, we will always request the chip data to ensure we offer a compatible socket.
You may request any specific socket dimension from
[email protected]
Important Note:
Please check the ball diameters & heights of your chip prior to
ordering the standard E-tec BGA (BPW, BCW) sockets. Any deviation
has to be communicated to E-tec in order to check compatibility with
the standard socket design and if necessary to obtain a special order
code adapted to your chip dimensions.
The standard solderball diameters & heights are the following:
ball diameters
ball height
0.25mm / 0.35mm
0.15mm / 0.30mm
0.25mm / 0.45mm
0.15mm / 0.30mm
0.25mm / 0.45mm
0.15mm / 0.40mm
0.40mm / 0.55mm
0.25mm / 0.45mm
0.50mm / 0.70mm
0.30mm / 0.50mm
1.27mm & 1.50mm
a) plastic chips (BPW)
0.60mm / 1.00mm
0.50mm / 0.70mm
b) ceramic chips (BCW)
0.60mm / 1.00mm
0.80mm / 1.00mm
For top view socket dimension
pls. ref. to separate catalog page
If the minimum ball diameter of a given chip falls below the above
indications, then a BUW socket will generally be proposed.
SMT Style
PCB Pad Layout
Ø 0,60mm/.024“ if pitch 1,27mm
Ø 0,50mm/.020“ if pitch 1,00mm
Ø 0,40mm/.016“ if pitch 0,80mm
Ø 0,35mm/.014“ if pitch 0,75mm
Ø 0,35mm/.014“ if pitch 0,65mm
Ø 0,30mm/.012“ if pitch 0,50mm
Soldertail Style
Ø 0,42mm/.016”
Ø 0,29mm/.011”
Ø 0,29mm/.011”
Ø 0,27mm/.010”
Ø 0,27mm/.010”
Ø 0,27mm/.010”
Mechanical data
Contact life
Retention System life
Individual contact force
Max. torque for retention screws
if pitch 1,27mm
if pitch 1,00mm
if pitch 0,80mm
if pitch 0,75mm
if pitch 0,65mm
if pitch 0,50mm
Insulator (RoHS compliant)
Terminal (RoHS compliant)
Contact (RoHS compliant)
PCB Hole Layout
10.000 cycles min.
1.000 cycles min.
exceeds MIL-STD-202 Method 208
40 grams max.
up to 800 pins = 7cNm or 10 oz-inch
as of 800 pins = 7cNm to 10cNm or 10 oz
to 14 oz-inch
High temp plastic or epoxy FR4
Electrical data
Contact resistance
< 100 mΩ
Current rating
500 mA max.
Insulation resistance at 500V DC 100 MΩ if 0.50 to 0.80mm pitch
500 MΩ 1.00mm pitch upwards
500V min.
Breakdown voltage at 60 Hz
< 1 pF
< 2 nH
PCB solder hole:
Ø 0,60mm/.024”
Ø 0,50mm/.020”
Ø 0,40mm/.016”
Ø 0,35mm/.014”
Ø 0,35mm/.014”
Ø 0,35mm/.014”
if pitch 1,27mm
if pitch 1,00mm
if pitch 0,80mm
if pitch 0,75mm
if pitch 0,65mm
if pitch 0,50mm
Operating temperature
Torque limiting screw driver
Solder paste
Solder profile
The pitch dimension depends on your Ball Grid Array
How to order
X X W x x x x - x x x x - x x X X 95
Device Type
B = Ball Grid
Device Material
C = std. socket for
L = Land Grid
C = Column Grid
ceramic device
= std. socket for
plastic device
= socket adapted to
small diameter solderballs
Nbr of contacts
depends on
ballcount of chip
−55°C to +125°C ; 260°C for 60 sec.
Refer to page “Tools” of this catalog
Please use a solder paste w/o any silver!
Please refer to our website
optional for locating pegs
Grid Code Config Code
10 = 1,00mm
12 = 1,27mm
15 = 1,50mm
others on
will be given by the factory
after receipt of the chip
95 = tin/gold
(tin leadfree)
Contact Type
standard SMT...( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm pitch, 0.60 if 0,80mm pitch; 0,40mm if <0.80mm pitch )
raised SMT..( „A“ = 5,00mm if 1,27mm pitch; 3,20mm if 1,00mm pitch; 2,80mm if 0,80mm pitch, 2.30mm if <0.80mm pitch )
special raised SMT - only for 1.00 & 0.80mm pitch…..... ( „A“ = 4,50mm )
standard solder tail……..…...….( „A“ = 3.30 if 1.27mm pitch, 2.80 if 1.00mm or 0.80mm pitch, 2,30mm if <0.80mm pitch )
Socket Mounting Recommendations and Reflow Profile
This document is meant to serve as a guide for mounting E-tec surface mount device (SMD)
sockets to the printed circuit board (PCB). The recommendations described here are guidelines
only, and modifications may be needed for your particular socket, PCB, and process.
The sockets this document applies to are as follows: Clam Shell, Knob Lock, Screw Lock, Twist
Lock, Quick Lock and Lever Lock in SMD style. These sockets utilize the E-tec patented springpin technology. This technology allows the pins to be soldered to the PCB while still providing
compliance to the device under test (DUT) via springs located at the other end of the pin. The
pins themselves do not have solder pre-forms as a BGA would with its solder balls. However, the
sockets are designed to mount to the same PCB footprint and pads as required by the BGA, or
any other IC package the socket was designed for (except if locating pegs are used; see ‘Locating
Pegs’ section of this document). When compared to mounting a BGA, an extra volume of solder
paste is required to mount the sockets to the PCB. To effect this, a properly dimensioned stencil
is required. Once the paste has been applied, a standard reflow process is then used to solder the
socket to the PCB. After the socket is verified to have proper electrical connection to the PCB,
the system is then ready to be used.
Locating Pegs
Although designed to mount to the same footprint as the IC, with just a small amount of
additional keep-out area, E-tec sockets can also be offered with locating pegs. The sockets are
typically mounted with two locating pegs, which require two thru-holes drilled into the PCB.
These pegs help to align the socket on the PCB, and hence align the socket’s pins to the PCB’s
pads, during the soldering process. Furthermore, plating the thru-holes allows the locating pegs
to be soldered to the PCB for better mechanical stability during everyday use and handling of the
socket. If the PCB design permits, E-tec recommends the use of these locating pegs. For finepitch, low pin-count sockets without locating pegs, the mechanical strength of the solder joints
may be insufficient. In these cases, it is recommended to epoxy the socket body to the PCB. 3M
Scotch-Weld 2216 B/A is a suitable epoxy. In any case, the proper volume of solder paste is
required to ensure mechanical and electrical integrity. Recommended stencil dimensions are
given in the next section of this document.
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland
Phone +41-21-781 08 10 · · [email protected]
E-tec Socket Mounting Recommendations
Socket Mounting Recommendations and Reflow Profile
Table 1 shows the recommended stencil dimensions. A laser-cut, electro-polished and Ni-plated
stainless steel stencil is recommended to give the most consistent paste release. The apertures
can be made round except for smaller pitches, where square apertures are recommended.
Remember to keep the stencil small enough to fit within the keep-out area of the socket, but yet
have provisions to remove it from the PCB once the paste has been applied.
Table 1: Recommended stencil dimensions.
Device Pitch
PCB Pad Diameter
(mm / in)
min. 0.60 / 0.023
min. 0.50 / 0.019
min. 0.40 / 0.016
min. 0.35 / 0.014
min. 0.35 / 0.014
min. 0.30 / 0.012
Stencil Thickness
0.15 / 0.006
0.15 / 0.006
0.13 / 0.005
0.13 / 0.005
0.13 / 0.005
0.13 / 0.005
Stencil Aperture
round 0.66 / 0.026
round 0.55 / 0.022
round 0.44 / 0.017
square 0.39 / 0.015
square 0.39 / 0.015
square 0.33 / 0.013
Solder Paste
E-tec recommends using solder paste without ( or <0.5%) silver (Ag) to reduce the solder’s
wetting ability and prevent the paste from running up the pins, thus maximizing the volume of
solder left on the pads. Brands such as Qualitek ( or Alpha Metals
( produce such solder paste on customer request. For Sn/Pb solder paste
we recommend Ecorel 803S offered by Avantec (
Reflow Profile
Both standard Sn-Pb eutectic and Pb-free reflow profiles are shown below.
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland
Phone +41-21-781 08 10 · · [email protected]
E-tec Socket Mounting Recommendations
Socket Mounting Recommendations and Reflow Profile
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland
Phone +41-21-781 08 10 · · [email protected]
E-tec Socket Mounting Recommendations
Socket Mounting Recommendations and Reflow Profile
Verifying the Assembly
After the socket has been reflowed to the PCB, open and short testing should be partaken to
ensure proper assembly. The assembly house typically performs x-ray inspection to verify nonshorting of pins. However, as this is only a visual inspection, we recommend using a continuity
tester or ohmmeter and simply sweeping random rows and columns of pins to ensure no shorting
of pins. No damage to the springs will occur if very slight pressure from the meter’s tips is
applied (just touch the probes to the springs). For fine pitch sockets, a microscope would be
helpful in placing the meter’s tips appropriately.
After verifying the absence of shorts, open testing should be performed. The most direct, yet
tedious, method is to use the continuity tester to directly probe each pin to a breakout or test
point on the board. Again no damage will occur if the probes are touched to the springs. If heavy
pressure is required to push the socket body towards the PCB to achieve continuity, this means a
poor solder joint. If no such test points exist, then the BGA’s via field on the backside of the
PCB should be kept solder-mask free to allow for such probing. If the via field is kept open, a
simpler open testing method can be performed. Simply use a wet sponge (or some other
conductive material) and hold it onto the via field. This shorts all the pins together on the PCB.
Insert one probe of the continuity tester into the sponge. Now sweep the pins of the socket with
the other probe and check for continuity.
If the above procedures show any shorts or opens, then it is advisable to have the assembly house
re-evaluate the assembly method used. An incorrect stencil can lead to too much or too little
solder paste, easily leading short or open conditions and a solder paste with Ag contents
(>=0.5%) may also result in solder joint failures. These are the primary reasons for socket
mounting failures.
Important Notes:
a) Screw/Twist Lock Socket
When tightening the lid of a Screw or Twist Lock socket, it is imperative to not over-tighten the
retention screws, otherwise irreparable damage may occur. Such damage is not covered by
warranty and will be solely the end user’s responsibility. The maximum allowed torque on these
retention screws is 7cN-m (10oz-in) for sockets up to 800 pins and for sockets as of 800 pins the
torque value needs to be increased but should not exceed a maximum of 10cN-m (14oz-in). E-tec
sells the torque screwdriver TOL-7CN-TORQUE which is preset to 7cN-m, but which can be
adjusted to higher torque values for the high pin count sockets.
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland
Phone +41-21-781 08 10 · · [email protected]
E-tec Socket Mounting Recommendations
Socket Mounting Recommendations and Reflow Profile
b) Knob Lock / Quick Lock / Clamshell Socket
It is recommended to remove the Knob Lock, Quick Lock and Clamshell retainer from the socket
base prior to soldering the sockets to the PCB. This will avoid socket displacement during the
soldering process due to the weight of these retainers. User instructions on how to remove and
reassemble the Clamshell retainer from the socket base can be obtained from E-tec.
c) Pick & Place Pads
Pick & place pad options can be obtained on request for all SMT sockets. If required, please
contact E-tec prior to placing a purchase order, since such pick & place pad options may require
special fixtures on the socket base which are not included in the standard socket design.
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland
Phone +41-21-781 08 10 · · [email protected]
E-tec Socket Mounting Recommendations