MMBZ5221BW - MMBZ5259BW 200mW SURFACE MOUNT ZENER DIODE Please click here to visit our online spice models database. Features Mechanical Data • • • • • • • • • Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally Suited for Automated Assembly Processes Lead Free/RoHS Compliant (Note 2) Qualified to AEC-Q101 Standards for High Reliability "Green" Device (Notes 3 and 4) • • • • • • Case: SOT-323 Case Material: Molded Plastic, "Green" Molding Compound (Note 4). UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Marking Information: See Page 3 Ordering Information: See Page 3 Weight: 0.006 grams (approximate) Top View Maximum Ratings Device Schematic @TA = 25°C unless otherwise specified Characteristic Forward Voltage @ IF = 10mA Symbol VF Value 0.9 Unit V Symbol PD RθJA TJ, TSTG Value 200 625 -65 to +150 Unit mW °C/W °C Thermal Characteristics Characteristic Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient Air (Note 1) Operating and Storage Temperature Range Notes: 1. 2. 3. 4. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. No purposefully added lead. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. MMBZ5221BW - MMBZ5259BW Document number: DS31037 Rev. 13 - 2 1 of 5 www.diodes.com April 2009 © Diodes Incorporated MMBZ5221BW - MMBZ5259BW Electrical Characteristics Type Number Marking Code MMBZ5221BW MMBZ5223BW MMBZ5225BW MMBZ5226BW MMBZ5227BW MMBZ5228BW MMBZ5229BW MMBZ5230BW MMBZ5231BW MMBZ5232BW MMBZ5233BW MMBZ5234BW MMBZ5235BW MMBZ5236BW MMBZ5237BW MMBZ5239BW MMBZ5240BW MMBZ5241BW MMBZ5242BW MMBZ5243BW MMBZ5245BW MMBZ5246BW MMBZ5248BW MMBZ5250BW MMBZ5251BW MMBZ5252BW MMBZ5254BW MMBZ5255BW MMBZ5256BW MMBZ5257BW MMBZ5258BW MMBZ5259BW KC1 KC3 KC5 KG1 KG2 KG3 KG4 KG5 KE1 KE2 KE3 KE4 KE5 KF1 KF2 KF4 KF5 KH1 KH2 KH3 KH5 KJ1 KJ3 KJ5 KK1 KK2 KK4 KK5 KM1 KM2 KM3 KM4 Notes: @TA = 25°C unless otherwise specified Test Current VZ @ IZT IZT ZZT @ IZT mA 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 9.5 8.5 7.8 7.0 6.2 5.6 5.2 5.0 4.5 4.2 3.8 3.4 3.2 30 30 30 28 24 23 22 19 17 11 7.0 7.0 5.0 6.0 8.0 10 17 22 30 13 16 17 21 25 29 33 41 44 49 58 70 80 Nom (V) 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 28 30 33 36 39 Min (V) 2.28 2.57 2.85 3.14 3.42 3.71 4.09 4.47 4.85 5.32 5.70 5.89 6.46 7.13 7.79 8.65 9.50 10.45 11.40 12.35 14.25 15.20 17.10 19.00 20.90 22.80 25.65 26.60 28.50 31.35 34.20 37.05 Max (V) 2.52 2.84 3.15 3.47 3.78 4.10 4.52 4.94 5.36 5.88 6.30 6.51 7.14 7.88 8.61 9.56 10.50 11.55 12.60 13.65 15.75 16.80 18.90 21.00 23.10 25.20 28.35 29.40 31.50 34.65 37.80 40.95 ZZK @ IZK = 0.25mA Ω 1200 1300 1600 1600 1700 1900 2000 1900 1600 1600 1600 1000 750 500 500 600 600 600 600 600 600 600 600 600 600 600 600 600 600 700 700 800 Maximum Reverse Leakage Current (Note 5) IR @ VR μA 100 75 50 25 15 10 5.0 5.0 5.0 5.0 5.0 5.0 3.0 3.0 3.0 3.0 3.0 2.0 1.0 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 3.5 4.0 5.0 6.0 6.5 7.0 8.0 8.4 9.1 9.9 11 12 14 15 17 18 21 21 23 25 27 30 5. Short duration pulse test used to minimize self-heating effect. 6. f = 1KHz. 50 0.4 40 IZ, ZENER CURRENT (mA) PD, POWER DISSIPATION (W) Maximum Zener Impedance (Note 6) Zener Voltage Range (Note 5) 0.3 0.2 0.1 30 20 10 0 0 0 100 125 25 50 75 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve MMBZ5221BW - MMBZ5259BW Document number: DS31037 Rev. 13 - 2 150 2 of 5 www.diodes.com 0 1 2 3 4 5 6 8 9 10 7 VZ, ZENER VOLTAGE (V) Fig. 2 Typical Zener Breakdown Characteristics April 2009 © Diodes Incorporated MMBZ5221BW - MMBZ5259BW 30 Tj = 25°C 1,000 10 Tj = 25 °C f = 1MHz Nominal Zener Voltage 15 20 Test current IZ CT, TOTAL CAPACITANCE (pF) IZ, ZENER CURRENT (mA) 12 18 22 10 27 33 36 39 VR = 1V VR = 2V 10 0 0 10 100 VZ, NOMINAL ZENER VOLTAGE (V) Fig. 4 Typical Total Capacitance vs. Nominal Zener Voltage 1 10 20 30 40 VZ, ZENER VOLTAGE (V) Fig. 3 Typical Zener Breakdown Characteristics 100 PPK, PEAK SURGE POWER (W) 1,000 ZZ, ZENER IMPEDANCE (Ω) 100 100 10 10 1 1 1 10 100 VZ, ZENER VOLTAGE (V) Fig. 5 Typical Zener Impedence Characteristics Ordering Information 1,000 10 100 PULSE WIDTH (ms) Fig. 6 Maximum Non-repetitive Surge Power 1 (Notes 4 & 7) Device (Type Number)-7-F* Packaging SOT-323 Shipping 3000/Tape & Reel * Add “-7-F” to the appropriate type number in Electrical Characteristics Table from Page 2. Example: 6.2V Zener = MMBZ5234BW-7-F. Notes: 7. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information Date Code Key Year Code Month Code 1998 J Jan 1 1999 K 2000 L Feb 2 MMBZ5221BW - MMBZ5259BW Document number: DS31037 Rev. 13 - 2 2001 M Mar 3 2002 N Apr 4 YM xxx xxx = Product Type Marking Code (See Electrical Characteristics Table) YM = Date Code Marking Y = Year (ex: N = 2002) M = Month (ex: 9 = September) 2003 P May 5 2004 R 2005 S Jun 6 3 of 5 www.diodes.com 2006 T Jul 7 2007 U Aug 8 2008 V Sep 9 2009 W Oct O 2010 X 2011 Y Nov N 2012 Z Dec D April 2009 © Diodes Incorporated MMBZ5221BW - MMBZ5259BW Package Outline Dimensions A SOT-323 Dim Min Max Typ A 0.25 0.40 0.30 B 1.15 1.35 1.30 C 2.00 2.20 2.10 D 0.65 G 1.20 1.40 1.30 H 1.80 2.20 2.15 J 0.0 0.10 0.05 K 0.90 1.00 1.00 L 0.25 0.40 0.30 M 0.10 0.18 0.11 0° 8° α All Dimensions in mm B C G H K M J L D Suggested Pad Layout Y Z Dimensions Value (in mm) Z 2.8 X 0.7 Y 0.9 C 1.9 E 1.0 C X MMBZ5221BW - MMBZ5259BW Document number: DS31037 Rev. 13 - 2 E 4 of 5 www.diodes.com April 2009 © Diodes Incorporated MMBZ5221BW - MMBZ5259BW IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 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