FAIRCHILD FDP4N60NZ

UniFET-IITM
FDP4N60NZ / FDPF4N60NZ
N-Channel MOSFET
600V, 3.8A, 2.5Ω
Features
• RDS(on) = 1.9Ω ( Typ.)@ VGS = 10V, ID = 1.9A
Description
• Low Gate Charge ( Typ. 8.3nC)
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
• Low Crss ( Typ. 3.7pF)
• Fast Switching
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficient switching mode power supplies and active power factor
correction.
• 100% Avalanche Tested
• Improved dv/dt Capability
• ESD Improved Capability
• RoHS Compliant
D
G
G D S
TO-220
FDP Series
TO-220F
FDPF Series
GD S
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*
Symbol
VDSS
Drain to Source Voltage
Parameter
VGSS
Gate to Source Voltage
ID
Drain Current
FDP4N60NZ FDPF4N60NZ
600
Units
V
±25
V
-Continuous (TC = 25oC)
3.8
3.8*
-Continuous (TC = 100oC)
2.3
2.3*
- Pulsed
(Note 1)
IDM
Drain Current
EAS
Single Pulsed Avalanche Energy
IAR
Avalanche Current
(Note 1)
3.8
A
EAR
Repetitive Avalanche Energy
(Note 1)
8.9
mJ
dv/dt
Peak Diode Recovery dv/dt
15*
(Note 2)
Power Dissipation
TJ, TSTG
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
- Derate above 25oC
A
223.8
(Note 3)
(TC = 25oC)
PD
TL
15
A
mJ
10
V/ns
89
28
W
0.71
0.22
W/oC
-55 to +150
o
C
300
o
C
*Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
Parameter
FDP4N60NZ FDPF4N60NZ
RθJC
Thermal Resistance, Junction to Case
1.4
RθCS
Thermal Resistance, Case to Sink Typ
0.5
RθJA
Thermal Resistance, Junction to Ambient
62.5
©2011 Fairchild Semiconductor Corporation
FDP4N60NZ / FDPF4N60NZ Rev.C0
1
Units
4.5
oC/W
62.5
www.fairchildsemi.com
FDP4N60NZ / FDPF4N60NZ N-Channel MOSFET
December 2011
Device Marking
FDP4N60NZ
Device
FDP4N60NZ
Package
TO-220
FDPF4N60NZ
FDPF4N60NZ
TO-220F
Reel Size
Tape Width
Quantity
50
50
Electrical Characteristics TC = 25oC unless otherwise noted
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
600
-
-
V
-
0.6
-
V/oC
μA
Off Characteristics
BVDSS
ΔBVDSS
ΔTJ
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
ID = 250μA, VGS = 0V, TC = 25oC
IDSS
Zero Gate Voltage Drain Current
VDS = 600V, VGS = 0V
-
-
1
VDS = 480V, VGS = 0V, TC = 125oC
-
-
10
IGSS
Gate to Body Leakage Current
VGS = ±25V, VDS = 0V
-
-
±10
3.0
-
5.0
V
-
1.9
2.5
Ω
-
3.3
-
S
ID = 250μA, Referenced to
25oC
μA
On Characteristics
VGS(th)
RDS(on)
Gate Threshold Voltage
VGS = VDS, ID = 250μA
Static Drain to Source On Resistance
gFS
Forward Transconductance
VGS = 10V, ID = 1.9A
VDS = 20V, ID = 1.9A
(Note 4)
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Qg(tot)
Total Gate Charge at 10V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
VDS = 25V, VGS = 0V
f = 1MHz
VDS = 480V ID = 3.8A
VGS = 10V
(Note 4, 5)
-
385
510
pF
-
40
60
pF
-
3.7
5
pF
-
8.3
10.8
nC
-
2.1
-
nC
-
3.3
-
nC
-
12.7
35.4
ns
-
15.1
40.2
ns
-
30.2
70.4
ns
-
12.8
35.6
ns
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
VDD = 300V, ID = 3.8A
RG = 25Ω
(Note 4, 5)
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
3.8
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
15
A
VSD
Drain to Source Diode Forward Voltage
VGS = 0V, ISD = 3.8A
-
-
1.4
V
trr
Reverse Recovery Time
-
168
-
ns
Qrr
Reverse Recovery Charge
VGS = 0V, ISD = 3.8A
dIF/dt = 100A/μs
-
0.7
-
μC
(Note 4)
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 31mH, IAS = 3.8A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 3.8A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test: Pulse width ≤ 300μs, Dual Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
FDP4N60NZ / FDPF4N60NZ Rev.C0
2
www.fairchildsemi.com
FDP4N60NZ / FDPF4N60NZ N-Channel MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
20
VGS = 10.0V
8.0V
7.0V
6.5V
6.0V
5.5V
*Notes:
1. VDS = 20V
2. 250μs Pulse Test
ID, Drain Current[A]
ID, Drain Current[A]
10
10
1
o
150 C
1
o
25 C
o
-55 C
0.1
*Notes:
1. 250μs Pulse Test
o
2. TC = 25 C
0.02
0.1
1
10
VDS, Drain-Source Voltage[V]
0.1
30
2
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
40
IS, Reverse Drain Current [A]
4.0
3.5
3.0
VGS = 10V
2.5
VGS = 20V
2.0
10
o
150 C
o
25 C
1
*Notes:
1. VGS = 0V
o
*Note: TC = 25 C
1.5
0.0
1.5
3.0
4.5
6.0
ID, Drain Current [A]
7.5
0.1
0.0
9.0
Figure 5. Capacitance Characteristics
0.4
0.8
1.2
VSD, Body Diode Forward Voltage [V]
1.6
VGS, Gate-Source Voltage [V]
10
Ciss
Capacitances [pF]
2. 250μs Pulse Test
Figure 6. Gate Charge Characteristics
700
100
Coss
10
8
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
4.5
RDS(ON) [Ω],
Drain-Source On-Resistance
4
6
VGS, Gate-Source Voltage[V]
*Note:
1. VGS = 0V
2. f = 1MHz
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
1
0.1
1
10
VDS, Drain-Source Voltage [V]
FDP4N60NZ / FDPF4N60NZ Rev.C0
VDS = 120V
VDS = 300V
VDS = 480V
8
6
4
2
Crss
0
0.0
30
3
*Note: ID = 3.8A
1.5
3.0
4.5
6.0
7.5
Qg, Total Gate Charge [nC]
9.0
www.fairchildsemi.com
FDP4N60NZ / FDPF4N60NZ N-Channel MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
RDS(on), [Normalized]
Drain-Source On-Resistance
BVDSS, [Normalized]
Drain-Source Breakdown Voltage
1.2
1.1
1.0
0.9
*Notes:
1. VGS = 0V
2. ID = 250μA
0.8
-100
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
2.5
2.0
1.5
1.0
0.0
-100
200
*Notes:
1. VGS = 10V
2. ID = 1.9A
0.5
Figure 9. Maximum Safe Operating Area
vs. Case Temperature
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
Figure 10. Maximum Drain Current
30
4
10μs
VGS = 10V
10
ID, Drain Current [A]
100μs
ID, Drain Current [A]
200
1ms
1
10ms
Operation in This Area
is Limited by R DS(on)
0.1
DC
*Notes:
3
2
1
o
1. TC = 25 C
o
o
2. TJ = 150 C
3. Single Pulse
0.01
1
10
100
VDS, Drain-Source Voltage [V]
RθJC = 4.5 C/W
0
25
1000
50
75
100
125
o
TC, Case Temperature [ C]
150
Figure 11. Unclamped Inductive
Switching Capability
IAS, AVALANCHE CURRENT (A)
5
TJ = 25 oC
TJ = 125 oC
1
0.01
0.1
1
tAV, TIME IN AVALANCHE (ms)
FDP4N60NZ / FDPF4N60NZ Rev.C0
4
www.fairchildsemi.com
FDP4N60NZ / FDPF4N60NZ N-Channel MOSFET
Typical Performance Characteristics (Continued)
FDP4N60NZ / FDPF4N60NZ N-Channel MOSFET
Typical Performance Characteristics (Continued)
Figure 12. Transient Thermal Response Curve
5
Thermal Response [ZθJC]
0.5
1
0.2
0.1
PDM
0.05
0.1
t1
0.02
t2
0.01
*Notes:
o
Single pulse
0.01
-5
10
FDP4N60NZ / FDPF4N60NZ Rev.C0
1. ZθJC(t) = 4.5 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
-4
10
-3
-2
-1
10
10
10
1
Rectangular Pulse Duration [sec]
5
10
2
10
www.fairchildsemi.com
FDP4N60NZ / FDPF4N60NZ N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDP4N60NZ / FDPF4N60NZ Rev.C0
6
www.fairchildsemi.com
FDP4N60NZ / FDPF4N60NZ N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
+
VDS
_
I SD
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• ISD controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
I SD
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
VDD
VSD
Body Diode
Forward Voltage Drop
FDP4N60NZ / FDPF4N60NZ Rev.C0
7
www.fairchildsemi.com
FDP4N60NZ / FDPF4N60NZ N-Channel MOSFET
Package Dimensions
TO-220
Dimensions in Millimeters
FDP4N60NZ / FDPF4N60NZ Rev.C0
8
www.fairchildsemi.com
FDP4N60NZ / FDPF4N60NZ N-Channel MOSFET
Package Dimensions
TO-220F
* Front/Back Side Isolation Voltage : AC 2500V
Dimensions in Millimeters
FDP4N60NZ / FDPF4N60NZ Rev.C0
9
www.fairchildsemi.com
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Definition
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
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Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I60
FDP4N60NZ / FDPF4N60NZ Rev.C0
10
www.fairchildsemi.com
FDP4N60NZ / FDPF4N60NZ N-Channel MOSFET
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