FAIRCHILD FGD3N60UNDF

FGD3N60UNDF
600 V, 3 A
Short Circuit Rated IGBT
Applications
• Sewing Machine, CNC, Home Appliances, Motor Control
General Description
Features
Using advanced NPT IGBT technology, Fairchild®’s the NPT
IGBTs offer the optimum performance for low-power inverterdriven applications where low-losses and short-circuit ruggedness features are essential.
• Short Circuit Rated 10us
• High Current Capability
• High Input Impedance
• Fast Switching
• RoHS Compliant
Collector
Gate
C
G
JEDEC TO-252
D-Pak
E
Emitter
E
Absolute Maximum Ratings
Symbol
Description
Ratings
Unit
VCES
Collector to Emitter Voltage
600
V
VGES
Gate to Emitter Voltage
± 20
V
IC
ICM (1)
IF
PD
o
Collector Current
@ TC = 25 C
6
A
Collector Current
@ TC = 100oC
3
A
o
@ TC = 25 C
9
A
Diode Forward Current
@ TC =
25oC
3
A
Maximum Power Dissipation
@ TC = 25oC
60
W
Pulsed Collector Current
Maximum Power Dissipation
@ TC =
100oC
24
Operating Junction Temperature
TJ
Tstg
Storage Temperature Range
TL
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
W
-55 to +150
o
-55 to +150
o
C
C
oC
300
Notes:
1: Repetitive rating: Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol
Parameter
Typ.
Max.
Unit
oC/W
RθJC(IGBT)
Thermal Resistance, Junction to Case
2.08
RθJC(Diode)
Thermal Resistance, Junction to Case
5.0
o
150
o
RθJA
Thermal Resistance, Junction to Ambient (PCB Mount)(2)
C/W
C/W
Notes:
2: Mounted on 1” square PCB (FR4 or G-10 material)
©2012 Fairchild Semiconductor Corporation
FGD3N60UNDF Rev. C1
1
www.fairchildsemi.com
FGD3N60UNDF 600 V, 3 A Short Circuit Rated
April 2013
Device Marking
Device
Package
Rel Size
Tape Width
Quantity
FGD3N60UNDF
FGD3N60UNDF
TO252
330mm
16mm
2500 units
Electrical Characteristics of the IGBT
Symbol
Parameter
TC = 25°C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Unit
600
-
-
V
-
V/oC
Off Characteristics
BVCES
Collector to Emitter Breakdown Voltage
VGE = 0V, IC = 250µA
∆BVDSS
∆TJ
Breakdown Voltage Temperature
Coefficient
ID = 250µA, Referenced to 25oC
-
0.3
ICES
Collector Cut-Off Current
VCE = VCES, VGE = 0V
-
-
1
mA
IGES
G-E Leakage Current
VGE = VGES, VCE = 0V
-
-
±10
uA
On Characteristics
VGE(th)
VCE(sat)
G-E Threshold Voltage
Collector to Emitter Saturation Voltage
IC = 3mA, VCE = VGE
5.5
6.8
8.5
V
IC = 3A, VGE = 15V
-
2.0
2.52
V
IC = 3A, VGE = 15V,
TC = 125oC
-
2.4
-
V
-
165
pF
VCE = 30V, VGE = 0V,
f = 1MHz
-
28
pF
-
8.5
pF
ns
Dynamic Characteristics
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
Switching Characteristics
td(on)
Turn-On Delay Time
-
5.5
tr
Rise Time
-
1.8
ns
td(off)
Turn-Off Delay Time
-
22
ns
tf
Fall Time
-
91
ns
Eon
Turn-On Switching Loss
-
52
uJ
Eoff
Turn-Off Switching Loss
-
30
uJ
Ets
Total Switching Loss
-
82
uJ
td(on)
Turn-On Delay Time
-
4.8
ns
tr
Rise Time
-
2.6
ns
td(off)
Turn-Off Delay Time
-
24
ns
tf
Fall Time
-
122
ns
Eon
Turn-On Switching Loss
-
65
uJ
Eoff
Turn-Off Switching Loss
-
44
uJ
Ets
Total Switching Loss
-
109
uJ
Tsc
Short Circuit Withstand Time
©2012 Fairchild Semiconductor Corporation
FGD3N60UNDF Rev. C1
VCC = 400V, IC = 3A,
RG = 10Ω, VGE = 15V,
Inductive Load, TC = 25oC
VCC = 400V, IC = 3A,
RG = 10Ω, VGE = 15V,
Inductive Load, TC = 125oC
VCC = 350V,
RG = 100Ω, VGE = 15V,
TC = 150oC
2
10
us
www.fairchildsemi.com
FGD3N60UNDF 600 V, 3 A Short Circuit Rated
Package Marking and Ordering Information
Qg
Total Gate Charge
Qge
Gate to Emitter Charge
Qgc
Gate to Collector Charge
VCE = 400V, IC = 3A,
VGE = 15V
Electrical Characteristics of the Diode
Symbol
Parameter
VFM
Diode Forward Voltage
trr
Diode Reverse Recovery Time
TC = 25°C unless otherwise noted
Test Conditions
IF = 3A
Diode Reverse Recovery Charge
©2012 Fairchild Semiconductor Corporation
FGD3N60UNDF Rev. C1
1.6
-
nC
-
6.6
-
nC
-
11.3
-
nC
TC = 25°C unless otherwise noted
IF =3A, dIF/dt = 200A/µs
Qrr
-
Min.
Typ.
Max
TC = 25oC
-
1.7
2.2
TC = 125oC
-
1.6
-
TC = 25oC
-
21
-
o
TC = 125 C
-
31
-
TC = 25oC
-
23
-
-
49
-
TC =
3
125oC
Unit
V
ns
nC
www.fairchildsemi.com
FGD3N60UNDF 600 V, 3 A Short Circuit Rated
Electrical Characteristics of the IGBT
Figure 1. Typical Output Characteristics
o
TC = 25 C
20V
Collector Current, IC [A]
25
15V
20
15
VGE = 12V
10
17V
15V
20
15
VGE = 12V
10
5
5
0
0
0
2
4
6
8
Collector-Emitter Voltage, VCE [V]
0
10
Figure 3. Typical Saturation Voltage
Characteristics
2
4
6
8
Collector-Emitter Voltage, VCE [V]
10
Figure 4. Transfer Characteristics
12
20
Common Emitter
VGE = 15V
Collector Current, IC [A]
TC = 25 C
15
Common Emitter
VCE = 20V
10
o
Collector Current, IC [A]
o
TC = 125 C
20V
17V
25
Collector Current, IC [A]
Figure 2. Typical Output Characteristics
30
30
o
TC = 125 C
10
5
o
TC = 25 C
o
TC = 125 C
8
6
4
2
0
0
0
1
2
3
4
5
6
7
Collector-Emitter Voltage, VCE [V]
5
8
Figure 5. Saturation Voltage vs. Case
Temperature at Variant Current Level
20
Common Emitter
VGE = 15V
3.0
6A
2.5
3A
2.0
IC = 1.5A
1.5
1.0
25
FGD3N60UNDF Rev. C1
12
4
Common Emitter
o
TC = 25 C
16
12
6A
3A
8
IC = 1.5A
4
0
50
75
100
125
o
Collector-EmitterCase Temperature, TC [ C]
©2012 Fairchild Semiconductor Corporation
7
8
9
10
11
Gate-Emitter Voltage,VGE [V]
Figure 6. Saturation Voltage vs. VGE
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
3.5
6
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
www.fairchildsemi.com
FGD3N60UNDF 600 V, 3 A Short Circuit Rated
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. VGE
500
20
Common Emitter
VGE = 0V, f = 1MHz
Common Emitter
o
TC = 125 C
Cies
o
TC = 25 C
16
12
Capacitance [pF]
Collector-Emitter Voltage, VCE [V]
Figure 8. Capacitance Characteristics
6A
3A
8
Coes
100
Cres
IC = 1.5A
4
10
0
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
1
Figure 9. Gate charge Characteristics
30
10
Collector-Emitter Voltage, VCE [V]
Figure 10. SOA Characteristics
10
15
10µs
Common Emitter
TC = 25 C
300V
VCC = 100V
12
100µs
Collector Current, Ic [A]
Gate-Emitter Voltage, VGE [V]
o
200V
9
6
1ms
1
10 ms
DC
0.1
*Notes:
o
1. TC = 25 C
3
o
2. TJ = 150 C
3. Single Pulse
0.01
0
0
2
4
6
8
Gate Charge, Qg [nC]
10
1
12
Figure 11. Turn-on Characteristics vs.
Gate Resistance
10
100
Collector-Emitter Voltage, VCE [V]
1000
Figure 12. Turn-off Characteristics vs.
Gate Resistance
1000
20
Common Emitter
VCC = 400V, VGE = 15V
IC = 3A
10
Switching Time [ns]
Switching Time [ns]
o
td(on)
tr
Common Emitter
VCC = 400V, VGE = 15V
IC = 3A
TC = 25 C
o
TC = 125 C
tf
100
td(off)
o
TC = 25 C
o
TC = 125 C
10
1
0
10
20
30
40
Gate Resistance, RG [Ω ]
©2012 Fairchild Semiconductor Corporation
FGD3N60UNDF Rev. C1
0
50
10
20
30
40
50
Gate Resistance, RG [Ω]
5
www.fairchildsemi.com
FGD3N60UNDF 600 V, 3 A Short Circuit Rated
Typical Performance Characteristics
Figure 13. Turn-on Characteristics vs.
Collector Current
Figure 14. Turn-off Characteristics vs.
Collector Current
10
1000
Common Emitter
VGE = 15V, RG = 10Ω
td(on)
o
TC = 25 C
Switching Time [ns]
Switching Time [ns]
o
TC = 125 C
tr
1
Common Emitter
VGE = 15V, RG = 10Ω
tf
100
td(off)
o
TC = 25 C
o
TC = 125 C
0.1
1
2
3
4
5
10
6
1
2
3
Collector Current, IC [A]
Figure 15. Switching Loss vs.
Gate Resistance
6
5
6
1000
Common Emitter
VCC = 400V, VGE = 15V
Common Emitter
VGE = 15V, RG = 10Ω
IC = 3A
TC = 25 C
o
o
Switching Loss [uJ]
TC = 25 C
o
TC = 125 C
100
Eon
o
TC = 125 C
Eon
100
Eoff
Eoff
10
5
Figure 16. Switching Loss vs
Collector Current
1000
Switching Loss [uJ]
4
Collector Current, IC [A]
10
0
10
20
30
40
Gate Resistance, RG [Ω]
1
50
Figure 17. Turn off Switching
SOA Characteristics
2
3
4
Collector Current, IC [A]
Figure 18. Forward Characteristics
12
10
Forward Current, IF [A]
Collector Current, IC [A]
80
20
10
o
TC = 75 C
o
TJ = 125 C
TC = 25 C
Safe Operating Area
o
VGE = 15V, TC = 125 C
10
o
100
1
1000
0
Collector-Emitter Voltage, VCE [V]
©2012 Fairchild Semiconductor Corporation
FGD3N60UNDF Rev. C1
o
TC = 75 C
TC = 125 C
1
1
o
TC = 25 C
o
6
1
2
3
Forward Voltage, VF [V]
4
www.fairchildsemi.com
FGD3N60UNDF 600 V, 3 A Short Circuit Rated
Typical Performance Characteristics
Figure 19. Reverse Recovery Current
Figure 20. Stored Charge
4
50
o
TC = 25 C
Stored Recovery Charge, Qrr [nC]
Reverse Recovery Current, Irr [A]
o
o
TC = 125 C
3
di/dt = 200A/uS
2
1
0
di/dt =100A/uS
0
1
2
3
4
o
TC = 125 C
40
35
30
didt =100A/uS
didt = 200A/uS
25
20
15
10
5
0
5
TC = 25 C
45
0
1
Forward Current, IF [A]
2
3
4
5
Forward Current, IF [A]
Figure 21. Reverse Recovery Time
50
Reverse Recovery Time, trr [ns]
45
40
35
didt =100A/uS
didt = 200A/uS
30
25
20
15
10
o
TC = 25 C
o
5
0
TC = 125 C
0
1
2
3
4
5
Forward Current, IF [A]
Figure 22. Transient Thermal Impedance of IGBT
Thermal Response [Zthjc]
3
0.5
1
0.2
0.1
0.1
0.05
0.02
0.01
single pulse
0.01
1E-5
PDM
t1
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-4
1E-3
0.01
0.1
Rectangular Pulse Duration [sec]
©2012 Fairchild Semiconductor Corporation
FGD3N60UNDF Rev. C1
7
www.fairchildsemi.com
FGD3N60UNDF 600 V, 3 A Short Circuit Rated
Typical Performance Characteristics
FGD3N60UNDF 600 V, 3 A Short Circuit Rated
Typical Performance Characteristics
Figure 23. Transient Thermal Impedance of FRD
Thermal Response [Zthjc]
5
0.5
0.2
1
0.1
0.05
PDM
0.02
0.01
0.1
t1
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
single pulse
1E-5
1E-4
1E-3
0.01
0.1
Rectangular Pulse Duration [sec]
©2012 Fairchild Semiconductor Corporation
FGD3N60UNDF Rev. C1
8
www.fairchildsemi.com
FGD3N60UNDF 600 V, 3 A Short Circuit Rated
Mechanical Dimensions
D-PAK
©2012 Fairchild Semiconductor Corporation
FGD3N60UNDF Rev. C1
9
www.fairchildsemi.com
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Definition
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I64
©2012 Fairchild Semiconductor Corporation
FGD3N60UNDF Rev. C1
10
www.fairchildsemi.com
FGD3N60UNDF 600 V, 3 A Short Circuit Rated
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