Freescale Semiconductor Product Preview Document Number: MC34844 Rev 2.0, 9/2008 10 Channel LED Backlight Driver with Integrated Power Supply 34844 The 34844 is a high efficiency, LED driver for use in backlighting LCD displays from 10" to 20"+. Operating from supplies of 7V to 28V, the 34844 is capable of driving up to 160 LEDs in 10 parallel strings. Current in the 10 strings is matched to within ±2%, and can be programmed via the I2C/SM-Bus interface. The 34844 also includes a Pulse Width Monitor (PWM) generator for LED dimming. The LEDs can be dimmed to one of 256 levels, programmed through the I2C/SM-Bus interface. Up to 65,000:1 (256:1 PWM, 256:1 Current DAC) dimming ratio. The integrated boost converter generates the minimum output voltage required to keep all LEDs illuminated with the selected current, providing the highest efficiency possible. The integrated boost selfclocks at a default frequency of 600kHz, but may be programmed via I2C to 150/300/600/1200 kHz. The PWM frequency can be set from 100Hz to 25kHz, or can be synchronized to an external input. If not synchronized to another source, the internal PWM rate outputs on the CK pin. This enables multiple devices to be synchronized together. The 34844 also supports optical/temperature closed loop operation and also features LED over-temperature protection, LED short protection, and LED open circuit protection. The IC also includes overvoltage protection, over-current protection, and under-voltage lockout. LED DRIVER EP SUFFIX (PB-FREE) 98ASA10800D 32-PIN QFN-EP ORDERING INFORMATION Device Temperature Range (TA) Package PC34844EP/R2 -40°C to 105°C 32 QFN-EP Features • • • • • • • • Input voltage of 7.0 to 28V Boost output voltage up to 60V, with auto VOUT selection. 3.0A integrated boost FET Up to 50mA LED current per channel 90% efficiency (DC:DC) 10-channel current mirror with ±2% current matching I2C/SM-Bus interface PWM frequency programmable or synchronizable from 100Hz to 25,000Hz • Pb-free packaging designated by suffix code EP Applications • • • • Monitors - up to 27 inch Personal Computer Notebooks GPS Screens Small screen Televisions 34844 7.0 to 28V VIN VDC1 SWA SWB VDC2 VOUT VDC3 PGNDA COMP PGNDB SLOPE Control Unit VDC1 VDC1 FAIL SCK SDA PWM A0/SEN CK M/~S EN VDC1 ISET PIN NIN GND VCC ~ ~ ~ ~ ~ ~ ~ I0 I1 I2 I3 I4 I5 I6 I7 I8 I9 Figure 1. Simplified Application Diagram (SM-Bus Mode) * This document contains certain information on a product under development. Freescale reserves the right to change or discontinue this product without notice © Freescale Semiconductor, Inc., 2008. All rights reserved. ~ ~ ~ INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM SWA VIN VDC1 VDC2 SWB LDO A0/SEN OVP VDC3 PGNDA COMP SLOPE BOOST CONTROLLER PGNDB VOUT CK EN CLOCK/PLL V SENSE FAIL M/~S PWM I0 PWM GENERATOR I1 I2 SCK SDA I2C INTERFACE I3 10 CHANNEL 50mA CURRENT MIRROR I4 I5 I6 I7 I8 ISET CURRENT DAC PIN TEMP/OPTO LOOP CONTROL NIN I9 GND OCP/OTP/UVLO Figure 2. 34844 Simplified Internal Block Diagram 34844 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS VOUT VDC2 M/~S COMP VDC1 SCK SDA PWM PIN CONNECTIONS 32 31 30 29 28 27 26 25 VIN 1 24 CK PGNDB 2 23 VDC3 TRANSPARENT TOP VIEW SWB 3 SWA 4 22 SLOPE 21 NIN QFN - EP 5MM X 5MM 32 LEAD PGNDA 5 20 PIN EP GND A0/SEN 6 19 ISET EN 7 18 FAIL IO 8 EP = Exposed Pad 17 I9 9 10 11 12 13 14 15 16 I1 I2 I3 I4 I5 I6 I7 I8 Figure 3. 34844 Pin Connections Table 1. 34844 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 12. Pin Number Pin Name Pin Function Formal Name Definition 1 VIN Power Input voltage 2 PGNDB Power Power Ground Power ground 3 SWB Input Switch node B Boost switch connection B 4 SWA Input Switch node A Boost switch connection A 5 PGNDA Power Power Ground Power ground 6 A0/SEN Input Device Select Address select, device select pin or OVP HW control 7 EN Input Enable 8 - 17 I0-I9 Input LED Channel 18 FAIL Open Drain Fault detection 19 ISET Passive Current set 20 PIN Input Positive current scale 21 NIN Input Negative current scale Negative input analog current control 22 SLOPE Passive Boost Slope 23 VDC3 Output Internal Regulator 3 24 CK Input/Output Clock signal 25 PWM Input External PWM Input supply Enable pin (active high, internal pull-up) LED string connections Fault detected pin (open drain): No Failure = Low impedance Failure = High Impedance LED current setting resistor Positive input analog current control Boost slope compensation Setting resistor Decoupling capacitor for internal phase locked loop power Clock synchronization pin (input for M/~S = low - internal pull-up, output for M/~S = high) External PWM input (internal pull-down) 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 3 PIN CONNECTIONS Table 1. 34844 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 12. Pin Number Pin Name Pin Function Formal Name Definition 26 SDA Bidirectional I2C data I2C data Line 27 SCK Bidirectional I2C clock I2C clock line 28 VDC1 Output Internal Regulator 1 29 COMP Passive Compensation pin 30 M/~S Input Master/Slave selector Selects Master Mode (1) or Slave Mode (0) 31 VDC2 Output Internal Regulator 2 Decoupling capacitor for internal regulator 32 VOUT Input Voltage Output EP GND - Ground Decoupling capacitor for internal logic rail Boost converter Type compensation pin Boost Output voltage sense pin Ground Reference for all internal circuits other than Boost FET 34844 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Maximum Pin Voltages VMAX V A0/SEN 7.0 I0, I1, I2, I3, I4, I5, I6, I7, I8, I9,EN(4) 45 VIN 30 SWA, SWB, VOUT 65 FAIL, PIN, NIN, ISET, M/~S, CK 6.0 Maximum LED Current ESD IMAX Voltage(1) 55 VESD mA V Human Body Model (HBM) +2000 Machine Model (MM) +200 THERMAL RATINGS Ambient Temperature Range Junction to Ambient Junction to Case Temperature(2) Temperature(2) Maximum junction temperature Storage temperature range Peak Package Reflow Temperature During Reflow(3) TA -40 to 105 °C TθJA 32 °C/W TθJC 3.5 °C/W TJ 150 °C TSTO -40 to 150 °C TPPRT 260 °C Power Dissipation W TA = 25°C 3.9 TA = 70°C 2.5 TA = 85°C 2.0 TA = 105°C 1.4 Notes 1. ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2), and the Machine Model (MM) (AEC-Q100003), RZAP = 0Ω 2. 3. 4. Per JEDEC51 Standard for Multilayer PCB Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 45V is the Maximum allowable voltage on all LED channels in off-state. 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions VIN = 12V, VOUT = 42V, ILED = 50mA, PWM = VDC1, M/~S = VDC1, PIN & NIN = VDC1, - 40°C ≤ TA ≤ 105°C, PGND = 0V, unless otherwise noted. Characteristic Symbol Min Typ Max Unit VIN 7.0 12 28 V Manual & SM-Bus: EN = Low, SCK & SDA=Low, PWM = Low - 2.0 - I2C: EN = Low, SETI2C bit = 1, CLRI2C bit = 0, PWM = Low μA - 17 - ISLEEP - 3.0 - mA IOPERATIONAL - 10.0 - mA UVLO 5.4 6.0 6.4 V UVLOHYST 150 200 250 mV VDC1 2.4 2.5 2.6 V VDC2 5.5 6.0 6.5 V VDC3 2.4 2.5 2.6 V VIN = 7.0V VOUT1 8.0 - 43 V VIN = 28V VOUT2 31 - 60 IFET 2.6 2.8 3.0 A RDSON - 250 500 mΩ IBOOST_LEAK - - 10 μA EFFBOOST - 90 - % SUPPLY Supply Voltage Supply Current when Shutdown Mode Supply Current when Sleep Mode ISHUTDOWN SM-Bus: EN = low, SCK & SDA= Active, SETI2C bit = 0, PWM=Low, EN bit = 0 I2C: EN = High, SETI2C bit = 1, CLRI2C bit = 0, EN bit = 0, PWM=Low Supply Current when Operational Mode Boost=Pulse Skipping, Channels = 0% of Duty Cycle Manual: EN= High, SCK & SDA=Low, PWM=Low SM-Bus: EN= Low, SCK & SDA=Active, EN bit= 1, PWM=Low I2C: EN = High, SETI2C bit = 1, CLRI2C bit = 0, EN bit = 1, PWM=Low Under-voltage Lockout VIN Rising Under-voltage Hysteresis VIN Falling VDC1 Voltage(5) CVDC1 = 2.2μF VDC2 Voltage(5) CVDC2 = 2.2μF VDC3 Voltage(5) CVDC3 = 2.2μF BOOST Output Voltage Range(6) Boost Switch Current Limit RDSON of Internal FET IDRAIN= 1.0A Boost Switch Off-state Leakage Current VSWA,SWB = 65V Peak Boost Efficiency(7) Notes 5. This output is for internal use only and not to be used for other purposes 6. Minimum and Maximum output voltages are dependent on Min/Max duty cycle condition. 7. Guaranteed by design 34844 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions VIN = 12V, VOUT = 42V, ILED = 50mA, PWM = VDC1, M/~S = VDC1, PIN & NIN = VDC1, - 40°C ≤ TA ≤ 105°C, PGND = 0V, unless otherwise noted. Characteristic Symbol Min Typ Max Unit IOUT/VIN -0.2 - 0.2 %/V IOUT/VLED -0.2 - 0.2 %/V VSLOPE - 0.49 - V/μs ACSA - 9.0 - Current Sense Resistor RSENSE - 22 - mΩ OTA Transconductance GM - 200 - μS Transconductance Sink and Source Current Capability ISS - 100 - μA VHOLD 0.45 0.5 0.55 V IFAIL_LEAK - - 5 μA VOL - - 0.4 V Line Regulation (7) VIN=7.0V to 28V Load Regulation (7) VLED = 8.0V to 65V (all Channels) Slope compensation voltage ramp RSLOPE = 68KΩ Current Sense Amplifier Gain Output Voltage Precharge FAIL PIN Off-state Leakage Current VFAIL = 5.5V On-state Voltage Drop ISINK = 4.0mA Notes 5. This output is for internal use only and not to be used for other purposes 6. Minimum and Maximum output voltages are dependent on Min/Max duty cycle condition. 7. Guaranteed by design 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions VIN = 12V, VOUT = 42V, ILED = 50mA, PWM = VDC1, M/~S = VDC1, PIN & NIN = VDC1, - 40°C ≤ TA ≤ 105°C, PGND = 0V, unless otherwise noted. Characteristic Symbol Min Typ Max Unit ISINK 49 50 51 mA VMIN 675 750 825 mV IMATCH -2.0 - 2.0 % VSET 2.017 2.048 2.079 V ILEDRES - 1.5 - % ICH_LEAK - - 10 μA VPIN_DIS 2.2 - - V IPIN -2.0 - 2.0 μA PIN = VSET/2 23.75 25 26.25 mA PIN = VSET 47.50 50 52.50 VNIN_DIS 2.2 - - V ININ -2.0 - 2.0 μA NIN = VSET/2 23.75 25 26.25 mA NIN = 0V 47.50 50 52.50 150 165 175 - 25 - LED CHANNELS Sink Current ICHx Register = 255, RISET=5.1kΩ 0.1%, PIN&NIN = Disabled, TA=25°C Regulated minimum voltage across drivers Current Matching Accuracy ISET Pin Voltage RISET=5.1kΩ 0.1% LED Current Amplitude Resolution 1.0mA < ILED < 50mA Off-state Leakage Current, All channels (VCH = 45V) PIN INPUT Voltage to Disable PIN mode PIN Bias Current PIN = VSET Analog Dimming Current IDIM_PIN ICHx Register = 255, RISET=5.1kΩ 0.1% NIN INPUT Voltage to Disable NIN mode NIN Bias Current NIN = VSET Analog Dimming Current IDIM_NIN ICHx Register = 255, RISET=5.1kΩ 0.1% OVER-TEMPERATURE PROTECTION Over-temperature Threshold(7) OTT Rising Hysteresis °C I2C/SM-BUS PHYSICAL LAYER [SCK, SDA] I2C Address ADRI2C - 1110110 - Binary SM-Bus Address ADRSMB - 1110110 - Binary Input Low Voltage VILI -0.3 - 0.8 V Notes 5. This output is for internal use only and not to be used for other purposes 6. Minimum and Maximum output voltages are dependent on Min/Max duty cycle condition. 7. Guaranteed by design 34844 8 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions VIN = 12V, VOUT = 42V, ILED = 50mA, PWM = VDC1, M/~S = VDC1, PIN & NIN = VDC1, - 40°C ≤ TA ≤ 105°C, PGND = 0V, unless otherwise noted. Characteristic Symbol Min Typ Max Unit VIHI 2.1 - 5.5 V Input Hysteresis VHYSI 0.3 - - V Output Low Voltage Sink Current < 4.0mA VOLI - - 0.4 V IINI -5.0 - 5.0 μA CINI - - 10 ρF Input Low Voltage VILL -0.3 - 0.5 V Input High Voltage VIHL 1.5 - 5.5 V VHYSL - 0.1 - V IIIL -5.0 - 5.0 μA VOLL - - 0.2 V VOHL 2.2 - 5.5 V CINI - - 5.0 ρF OVP = Fh OVPFH 60 62 65 V OVP = Eh OVPEH 56 59 62 V OVP = Dh OVPDH 52 55 58 V OVP = Ch OVPCH 48 51 54 V OVP = Bh OVPBH 45 47 49 V OVP = Ah OVPAH 41 43 45 V OVP = 9h OVP9H 37 39 41 V OVP = 8h OVP8H 33 35 37 V OVP = 7h OVP7H 29 31 33 V OVP = 6h OVP6H 26 27 28 V OVP = 5h OVP5H 22 23 24 V OVP = 4h OVP4H 18 19 20 V OVP = 3h OVP3H 14 15 16 V OVP = 2h OVP2H 10 11 12 V Over-voltage threshold, OVPHW 6.15 6.5 6.85 V Input High Voltage Input Current Input Capacitance(7) LOGIC INPUTS / OUTPUTS (CK, M/~S, PWM, A0/SEN) Input Hysteresis Input Current Output Low Voltage (CK) ISINK < 2.0mA Output High Voltage (CK) ISOURCE < 2.0mA Input Capacitance(7) OVER VOLTAGE PROTECTION Over-voltage Clamp - OVP Register Table: Set by Hardware, Voltage at A0/SEN Notes 5. This output is for internal use only and not to be used for other purposes 6. Minimum and Maximum output voltages are dependent on Min/Max duty cycle condition. 7. Guaranteed by design 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 9 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions VIN = 12V, VOUT = 42V, ILED = 50mA, PWM = VDC1, M/~S = VDC1, PIN & NIN = VDC1, - 40°C ≤ TA ≤ 105°C, PGND = 0V, unless otherwise noted. Characteristic Symbol Min Typ Max Unit Switching Frequency (BST [1:0]=0) fSW0 0.14 0.15 0.17 MHz Switching Frequency (BST [1:0]=1) fSW1 0.27 0.30 0.33 MHz Switching Frequency (BST [1:0]=2) fSW2 0.54 0.60 0.66 MHz Switching Frequency (BST [1:0]=3) fSW3 1.08 1.2 1.32 MHz Minimum Duty Cycle DMIN - 10 15 % Maximum Duty Cycle BOOST DMAX 80 85 - % Soft Start Period tSS - 6.5 - ms Boost Switch Rise Time(9) tTR - 15 - ns Boost Switch Fall Time(9) tF - 25 - ns fPWMS 100 - 25000 Hz 22500 25000 27500 Hz 90 100 110 tfPWM - 0.39 - % tPWM_IN 150 - - ns fCKS 100 - 25000 Hz fCKS_JITTER - - 0.1 % FPWMS=25KHz - - 50 ms FPWMS=100Hz - 2000 - ms 22500 25000 27500 Hz 90 100 110 PWM GENERATOR Input PWM Frequency Range (9) M/~S = Low (Slave Mode) PWM Frequency fPWMM M/~S = High (Master Mode) FPWM Register = 768 FPWM Register = 192,000 PWM dimming resolution PWM PIN CHANNEL DRIVER Input PWM Pin Minimum Pulse(9) PHASE LOCK LOOP CK Slave Mode Frequency Lock Range(8) M/~S = Low (Slave Mode) CK Slave Mode Input Jitter(9) M/~S = Low (Slave Mode) Slave Mode Acquisition Time TS_ACQ M/~S = Low (Slave Mode) CK Frequency (Master Mode) FPWM Register = 768 FPWM Register = 192,000 fCKMASTER I2C/SM-BUS PHYSICAL LAYER [SCK, SDA] Notes 8. Special considerations should be made for frequencies between 100Hz to 1KHz. Please refer to Functional Device Operation for further details. 9. Guaranteed by design 34844 10 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions VIN = 12V, VOUT = 42V, ILED = 50mA, PWM = VDC1, M/~S = VDC1, PIN & NIN = VDC1, - 40°C ≤ TA ≤ 105°C, PGND = 0V, unless otherwise noted. Characteristic Symbol Min Typ Max Unit 400 kHz Interface Frequency Range fSCK SM-Bus Power-on-Reset Time tRST - - 100 ms tF 40 - 160 ns tR 20 - 80 ns tR/tF - - 25 ns tR/tF - 23 50 ns Output fall time 10ρF < CL < 400ρF Output rise time 10ρF<CL<400ρF LOGIC OUTPUT (CK) Output Rise and Fall time(9) CL<100ρF LED CHANNELS Channels Rise and Fall Time(9) Notes 8. Special considerations should be made for frequencies between 100Hz to 1KHz. Please refer to Functional Device Operation for further details. 9. Guaranteed by design 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 11 FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION LED backlighting has become very popular for small and medium LCDs, due to some advantages over other backlighting schemes, such as the widely used cold cathode fluorescent lamp (CCFL). The advantages of LED backlighting are low cost, long life, immunity to vibration, low operational voltage, and precise control over its intensity. However, there is an important drawback of this method. It requires more power than most of the other methods, and this is a major problem if the LCD size is large enough. To address the power consumption problem, solid state optoelectronics technologies are evolving to create brighter LEDs with lower power consumption. These new technologies together with highly efficient power management LED drivers are turning LEDs, a more suitable solution for backlighting almost any size of LCD panel, with really conservative power consumption. One of the most common schemes for backlighting with LED is the one known as “Array backlighting”. This creates a matrix of LEDs all over the LCD surface, using defraction and diffused layers to produce an homogenous and even light at the LCD surface. Each row or column is formed by a number of LEDs in series, forcing a single current to flow through all LEDs in each string. Using a current control driver, per row or column, helps the system to maintain a constant current flowing through each line, keeping a steady amount of light even with the presence of line or load variations. They can also be use as a light intensity control by increasing or decreasing the amount of current flowing through each LED string. To achieve enough voltage to drive a number of LEDs in series, a boost converter is implemented, to produce a higher voltage from a smaller one, which is typically used by the logical blocks to do their function. The 34844 implements a single channel boost converter together with 10 input channels, for driving up to 16 LEDs per string to create a matrix of more than 160 LEDs. Together with its 90% efficiency and I2C programmable or external current control, among other features, makes the 34844 a perfect solution for backlighting small and medium size LCD panels, on low power portable and high definition devices. FUNCTIONAL PIN DESCRIPTION INPUT VOLTAGE SUPPLY (VIN) IC ENABLE (EN) IC Power input supply voltage, is used internally to produce internal voltage regulation (VDC1, VDC3) for logic functioning, and also as an input voltage for the boost regulator. The active high enable terminal is internally pulled high through pull-up resistors. Applying 0V to this terminal would stop the IC from working. INTERNAL VOLTAGE REGULATOR 1 (VDC1) This pin is for internal use only, and not to be used for other purposes. A capacitor of 2.2μF should be connected between this pin and ground for decoupling purposes. INTERNAL VOLTAGE REGULATOR 2 (VDC2) INPUT/OUTPUT CLOCK SIGNAL (CK) This terminal can be used as an output clock signal (master mode), or input clock signal (slave mode), to synchronize more than one device. MASTER/SLAVE MODE SELECTION (M/~S) This pin is for internal use only, and not to be used for other purposes. A capacitor of 2.2μF should be connected between this pin and ground for decoupling purposes. Setting this pin High puts the device into Master mode, producing an output synchronization clock at the CK terminal. Setting this pin low, puts the device in Slave mode, using the CK pin as an input clock. INTERNAL VOLTAGE REGULATOR 3 (VDC3) EXTERNAL PWM INPUT (PWM) This pin is for internal use only, and not to be used for other purposes. A capacitor of 2.2μF should be connected between this pin and ground for decoupling purposes. This terminal is internally pulled down. An external PWM signal can be applied to modulate the LED channel directly in absence of an I2C interface. BOOST COMPENSATION PIN (COMP) CLOCK I2C SIGNAL (SCK) Passive terminal used to compensate the boost converter. Add a capacitor and a resistor in series to GND to stabilize the system. Clock line for I2C communication. ADDRESS I2C SIGNAL (SDA) Address line for I2C communication. 34844 12 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION A0/SEN Address select, device select pin, or Hardware Over voltage Protection (OVP) Control. CURRENT SET (ISET) Each LED string can drive up to 50mA. The maximum current can be set by using a resistor from this pin to GND. POSITIVE CURRENT SCALING (PIN) Positive current scaling factor for the external analog current control. Applying 0V to this pin, scales the current to 0%, and in the same way, applying 2.048V(Vset), the scale factor is 100%. By applying a voltage higher than 2.2V, the scaling factor is disabled, and the internal pull-ups are activated. If PIN pin and NIN pin are used at the same time then by applying 0V to the PIN pin and 2.048V to NIN pin, scales the current to 0%, and in the same way, applying 2.048V to the PIN pin and 0V to NIN pin, scales the current to 100%. By applying a voltage higher than 2.2V, the scaling factor is disabled and the internal pull-ups are activated in both pins. NEGATIVE CURRENT SCALING (NIN) Negative current scaling factor for the external analog current control. Setting 0V to this pin scales the current to 100%, in the same way, setting 2.048V (Vset) the scale factor is 0%. By applying a voltage higher than 2.2V, the scaling factor is disabled and the internal pull-ups are activated. If PIN pin and NIN pin are used at the same time then by applying 0V to the PIN pin and 2.048V to NIN pin, scales the current to 0%, and in the same way, applying 2.048V to the PIN pin and 0V to NIN pin, scales the current to 100%. By applying a voltage higher than 2.2V, the scaling factor is disabled and the internal pull-ups are activated in both pins. GROUND (GND) Ground Reference for all internal circuits other than the Boost FET. The Exposed Pad (EP) should be used for thermal heat dissipation. I0-I9 Current LED driver, each line has the capability of driving up to 50mA. FAULT DETECTION PIN (FAIL) When a fault situation is detected, this pin goes into high impedance. BOOST SLOPE COMPENSATION SETTING RESISTOR (SLOPE) Use an external resistor of about 68kΩ to configure the Boost compensation slope. POWER GROUND TERMINALS (PGNDA, PGNDB) Ground terminal for the internal Boost FET. OUTPUT VOLTAGE SENSE TERMINAL (VOUT) Input terminal to monitor the output voltage. It also supplies the input voltage for the internal regulator 2 (VDC2). SWITCHING NODE TERMINALS (SWA, SWB) Switching node of boost converter. 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 13 FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION MC34844 - Functional Block Diagram Regulators / Power Down Boost 3 Internal Regulators Protection / Failure Detection Over-temperature Protection Over-current Protection Under-voltage Protection Over-voltage Protection LED Open Protection LED Channels Logic Control Optical and Temperature Control PWM Dimming Serial Interface Control Regulator / Power down Protection / Failure Detection LED Channels Logic Control Boost Figure 4. Functional Internal Block Diagram REGULATORS/ POWER DOWN The 34844 is designed to operate from input voltages in the 7.0 to 28V range. This is stepped down internally by LDOs to 2.5V (VDC1 and VDC3) and 6V (VDC3) for powering internal circuitry. If the input voltage falls below the UVLO threshold, the device automatically enters in power down mode. Operating Modes: The device can be operated by the EN pin and/or SDA/ SCK bus lines, resulting in three distinct operation modes: • Manual mode, there is no I2C capability, the bus line pins must be tied low, and the EN pin controls the ON/OFF operation. • SM-Bus mode, EN pin must be tied low and the device is turned ON by any activity on the bus lines. The part shuts down if the bus lines are held low for more than 27ms, the 27ms watchdog timer can be disabled by I2C (setting SETI2C bit high) or tying the EN pin high. In Sleep mode (EN bit=1) the device reduces the power consumption by leaving “alive” only the blocks required for I2C communication. • I2C mode, has to be configured by I2C communication (SETI2C bit = 1) right after the IC is turned ON, it prevents the part from being turned ON/OFF by the bus. Sleep mode is also present and it is intended to save power, but still keep the IC prepared to communicate by I2C. Turning the EN pin OFF, the chip enters into a low power mode. 34844 14 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION MODE Manual SM-Bus EN Pin SCK/SDA Pins I2C Bit Command Current Consumption Mode Low Low N/A Shutdown High Low N/A Operational Low Low (> 27ms) EN bit = X Shutdown Low Active EN bit = 0 Sleep Low Active EN bit = 1 Operational Low X CLRI2C bit = 0 SETI2C bit = 1 I2C Low Power (Shutdown) Comments Part Doesn’t Wake-up EN bit = X SETI2C bit = 1 I2 C High X CLRI2C bit = 0 Sleep EN bit = 0 SETI2C bit = 1 High X CLRI2C bit = 0 Operational EN bit = 1 Table 5. Operation Current Consumption Modes BOOST The integrated boost converter operates in nonsynchronous mode and integrates a 3A FET. An integrated sense circuit is used to sense the voltage at the LED current mirror inputs and automatically sets the boost output voltage to the minimum voltage needed to keep all LEDs biased with the required current. The boost converter also features internal Over-current Protection (OCP) and has a user programmable Overvoltage Protection (OVP). The OVP can be set from 11 to 62V, ~4V spaced, using the I2C interface (OVP Register). If I2C capability is not present, the OVP can be controlled by a resistor divider connected from VOUT to GND with its mid point tied to A0/ SEN pin (threshold = 6.5V). During an OVP condition, the output voltage will go to the OVP level which is programmed via the I2C interface or settled by a resistor divider on A0/SEN pin. Hardware OVP: ( OVP ⋅ R1 -) ---------------------------= 6.5V R1 + R2 The OVP value should be set to greater than the maximum LED voltage over the whole temperature range. A good practice is to set it 5V or so above the max LED voltage. The OCP operates on a cycle by cycle basis. However, if the OCP condition remains for more than 10ms then the device turns off the LED Drivers, the Boost goes to Sleep Mode and the output FAULT pin goes into high impedance. The device can only be restarted by recycling the enable or creating a Power On Reset (POR). The user can program the boost frequency by I2C (BST[1:0]) only after the IC is powered up and before the boost circuit is turned ON for the first time (PWM pin low to high). This sequence avoids boost frequency to be changed inadvertently during operation. The first I2C command has to wait for 5.0ms after the part is turned ON, in order to allow sufficient time for the device power up sequence to be completed. The boost controller has an integral track and hold amplifier with indefinite hold time capability, to enable immediate LED on cycles after extended off times. During extended off times, the external LEDs cool down from their normal quiescent operating temperature and thereby experience a forward voltage change, typically an increase in the forward voltage. This change can be significant for applications with a large number of series LEDs in a string operating at high current. If the boost controller did not track this increased change, the potential on the LED drivers would saturate for a few cycles once the LED channels are reenabled. Also the device has a precharge voltage that add 0.5 Volts to the Boost, cycle by cycle of the PWM. It helps the boost to respond faster every time the load turns back on again. 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 15 FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION CURRENT MIRROR The programmable current mirror matches the current in 10 LED strings to within 2%. The maximum current is set using a resistor to GND from the ISET pin. This can be scaled down using the I2C interface to 255 levels. Zero current is achieved by turning off the LED Driver by I2C (registers CHENx = 0h) for a Duty Cycle from 0% to 99% or by pulling PWM pin low regardless of the Duty Cycle. I2C capability allow the channels to be controlled individually or in parallel. Current on LED Channel (PIN and NIN mode disabled) Eqn. 1 ICH [ RegisterValue ] Current [ A ] = ----------------------------------------------------------RSET [ ohms ] In the off state, the LEDs current is set to 0 and the boost converter stops switching. This feature allows to drive more than 50mA of current by connecting the LED string to 2 or more LED channels in parallel. For example; if the application requires to drive 5 channels at 100mA, then the bottom of each LED string should be connected to two channels in order to duplicate the current capability (Example: CH0+CH1 = 100mA). PWM GENERATOR The PWM generator can operate in either master or slave modes, as set by the M/~S pin. In master mode, the internal PWM generator frequency is programmed through the I2C interface (registers FPWM). The default programmed value set the number of 25kHz clocks (40μs) in one PWM cycle. The 18-bit resolution allows minimum PWM frequencies of 100Hz to be programmed. The resulting frequency is output on the CK pin. PWM Frequency Eqn. 2 19.2Mhz PWMFrequency [ Hz ] = -------------------------------------------------------------------FPWM [ RegisterValue ] In slave mode, the CK pin acts as an input. The internal digital PLL uses this frequency as the PWM frequency. By setting one device as master, and connecting the CK output to the input on a number of slave configured devices, all PWM frequencies are synchronized together. The duty cycle of the PWM waveform in both master and slave modes is set using a second register on the I2C interface (register DPWM), and can be controlled from 100% duty cycle to 1/256 Tpwm = 0.39%. Zero percent of duty cycle is achieved by turning LED Drivers off (register CHENx = 0h) or pulling PWM pin low. An external PWM can also be used. The PWM input is 'AND'ed with the internal signal. By setting the serial interface to 100% duty cycle (default), the external pin has full control of the PWM duty cycle. This pin can also be used to modulate the LED at a lower frequency than the PWM dimming frequency (Minimum pulse width = 150ns). A pulsed mode can also be programmed using the I2C interface (STROBE bit = 1). In this mode, each rising edge of the PWM signal turns on the next channel, while turning off all other channels. The duration that the channel is illuminated is set by the duty cycle of the PWM input pin. This can be used to scan the output channels. FAIL PIN If an LED fails open, the voltage at the LED channel will be pulled to GND and the LED string open is detected. An error is registered for that channel, the fail output is set high, and that channel is turned off. The malfunction channel can be reenabled by I2C commands, first clearing the fail (CLRFAIL bit =1), removing the failure and then re-enabling the channel driver (Register CHEN). All fails are cleared when the device is powered up. If the fail pin cannot be cleared by software then it indicates that the failure is because of an over-current in the Boost. Since this is a critical failure the only way to clear it is by releasing the part from the over-current condition and then shutdown the part (refer to Table 5). If I2C communication is not present, FAIL condition should be reset by removing the failure and re-enabling the device through the EN pin. OPTICAL AND TEMPERATURE CONTROL LOOP The 34844 supports both optical and temperature loop control. For temperature loop control, the LED brightness can be adjusted depending on the temperature of the LEDs. For optical loop control, the 34844 supports both optical closed loop backlight control, where the brightness of the backlight is maintained at a required level by adjusting the light output, until the desired level is achieved, or with ambient light control, where the backlight brightness increases as ambient light increases. Both temperature and optical loops are supported through the PIN and NIN pins. Each pin supports a 0-2.048V input range which affects the current through the LEDs. The PIN pin increases current as the voltage rises from 0-2.048V. The NIN pin reduces current as the voltage rises from 0-2.048V. A 10.2k resistor or higher value must be used at the ISET pin if the part is configured to use PIN+NIN control loop functionality, the 50mA maximum current is achieved at the higher allowed level of PIN/NIN pins, ensuring the maximum current of the LED Drivers are not exceeded. 34844 16 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION The optical and temperature control loop can be disabled by I2C setting bits (PINEN & NINEN), or by tying PIN and NIN pins high (>2.2V) it is called Vset mode, and the LED Driver maximum current is set to 50mA by using a 5.1k resistor at the ISET pin. Current on LED Channel (PIN mode) Eqn. 3 ( VPIN [ Volts ] × ICH [ RegisterValue ] ) Current [ A ] = ---------------------------------------------------------------------------------------------------------RSET [ ohms ] Current on LED Channel (NIN mode) Eqn. 4 ( 2.048 – VNIN ) ( [ Volts ] x ICH [ RegisterValue ] ) Current [ A ] = ----------------------------------------------------------------------------------------------------------------------------------RSET [ ohms ] Current on LED Channel (PIN+NIN mode) Eqn. 5 ( 2.048 – VNIN + VPIN ) ( [ Volts ] x ICH [ RegisterValue ] ) Current [ A ] = --------------------------------------------------------------------------------------------------------------------------------------------------------RSET [ ohms ] LED FAILURE PROTECTION Open LED Protection If LED fails open in any of the LED strings, the voltage in that channel will be pulled close to zero, which will cause the channel to be disabled. As a result, the boost output voltage will go to the OVP level and then come down to the regulation level to continue powering the rest of the LED strings. Short LED Protection If an LED shorted in any of the LED strings, the device will continue to operate without interruption. However, if the shorted LED happens to be in the LED string with the highest forward voltage, the dynamic headroom control circuit will automatically regulate the output voltage with respect to the new highest LED voltage. If more LEDs are shorted in the same LED string, it may cause excessive power dissipation in the channel which may cause the OTT circuit to trip which will completely shutdown the device. OVER-TEMPERATURE PROTECTION The 34844 has an on-chip temperature sensor that measures die temperature. If the IC temperature exceeds the OTT threshold, the IC will turn off all power sources inside the IC (LED drivers, boost and internal regulators) until the temperature falls below the falling OTT threshold. Once it comes back on, it will operate with the default configuration (please refer to Table 7). SERIAL INTERFACE CONTROL The 34844 uses an I2C interface capable of operating in standard (100kHz) or fast (400kHz) modes. The A0/SEN pin can be used an address select pin to allow more than 2 devices in the system. The A0/SEN pin should be held low on all chips expect the one to be addressed, where it is taken HIGH. 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 17 FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES NORMAL MODE I 2C In normal operation the 34844 is programed via to drive up to 50mA of current through each one of the LED channels. The 34844 can be configured in master or slave mode as set by the M/~S pin. In Master mode, the internal PWM generator frequency is programmed through the I2C interface. The programmed value sets the number of 25kHz clocks (40μs) in one PWM cycle. The 18-bit resolution allows minimum PWM frequencies of 100Hz to be programmed. The resulting frequency is output on the CK pin. In slave mode, the CK pin acts as an input. The internal digital PLL uses this frequency as the PWM frequency. By setting one device as a master, and connecting the CK output to the input on a number of slave configured devices, all PWM frequencies are synchronized together. For this application A0/SEN pin indicates which device is enable for I2C control. In Slave mode, an internal phase lock loop will lock the internal PWM generator period to the period of the signal present at the CK pin. The PLL can lock to any frequency from 100Hz to 25KHz provided the jitter is below 1000ppm. At frequencies above 1KHz, the PLL will maintain lock regardless of the transient power conditions imposed by the user (i.e. going from 0% duty cycle to 100% at 20W LED display power). Below 1kHz, thermal time constants on the die are such that the PLL may momentarily lose lock if the die temperature changes substantially during a large load power step. As explained below, this anomaly can be avoided by controlling the rate of change in PWM duty cycle. To better understand this issue, consider that the on chip PLL uses a VCO that is subject to thermal drift on the order of 1000 ppm/C. Further consider that the thermal time constant of the chip is on the order of single digit milliseconds. Therefore, if a large power load step is imposed by the user (i.e. going from 0% duty cycle to 100% duty cycle with a load power of 20W), the die will experience a large temperature wave gradient that will propagate across the chip surface and thereby affect the instantaneous frequency of the VCO. As long as such changes are within the bandwidth of the PLL, the PLL will be able to track and maintain lock. Exceeding this rate of change may cause the PLL to lose lock and the backlight will momentarily be blanked until lock is reacquired. At 100Hz lock, the PLL has a bandwidth of approximately 10Hz. This means that temperature changes on the order of 100ms are tolerable without losing lock. But full load power changes on the order of 10ms (i.e. 100Hz PWM) are not tracked out and the PLL can momentarily lose lock. If this happens, as stated above, the LED drivers are momentarily disabled until lock is reacquired. This will be manifested as a perceivable short flash on the backlight immediately after the load change. To avoid this problem, one can simply limit large instantaneous changes in die temperature by invoking only small power steps when raising or lowering the display power at low PWM frequencies. For example, to maintain lock while transitioning from 0% to 100% duty cycle at 20W load power and a PWM frequency of 100Hz would entail stepping the power at a rate not to exceed 1% per 10ms. If a load of less than 20W is used, then the rate of rise can be increased. As the locked PWM frequency increases (i.e. use 600Hz instead of 100Hz), the step rate can be further increased to approximately 4% per 2ms. The exact step rate to avoid loss of PLL lock is a function of essentially three things: (a) the composite thermal resistance of the user's PCB assembly, (b) the load power, and (c) the PWM frequency. For all cases below 1KHz, simply using a rate of 1% duty cycle change per PWM period will be adequate. If this is too slow, the value can be optimized experimentally once the hardware design is complete. At PWM rates above 1KHz, it is not necessary to control the rate of change in PWM duty cycle. It is important to point out that when operating in the master mode, one does not need to concern themselves with loss of lock since the reference clock and the VCO clock are collocated on the die and therefore experience the same thermal shift. Hence, in master mode, once lock is initially acquired, it is not lost and no blanking of the display occurs. The duty cycle of the PWM in both master and slave mode is set using a second register on the I2C interface. An external PWM signal can also be applied in the PWM pin. This pin is AND’ed with the internal signal, giving the ability to control the duty cycle either via I2C or externally by setting any of the 2 signals to 100% duty cycle. STROBE MODE A strobe mode can be programmed via I2C. In this mode, each rising edge of the PWM signal turns on the next channel, while turning off all other channels. The duration that the channel is illuminated is set by the duty cycle of the PWM input pin. This mode can be also programmed by controlling the ON and OFF state of each LED channel via I2C. MANUAL MODE The 34844 can also be used in Manual mode without using the I2C interface. By setting the pin M/~S High, the LED dimming will be controlled by the external PWM signal. The over-voltage protection limit can be settled by a resistor divider on A0/SEN pin. During manual mode, all internal Registers are in Default Configuration, please refer Table 7, under this configuration 34844 18 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES the PIN and NIN pins are enabled to scale the current capability per string and may be disable by setting 2.2V in the corresponding terminal. Also in this mode, the device can be enabled as follows: + EN pin + PWM signal (Two Signals): In this configuration the PWM signal applied to PWM pin will be in charge of controlling the LED dimming and a second signal will enable or disable the chip through the EN pin. Figure 17 + PWM Signal tied to SDA pin (Just ONE signal): In this configuration the PWM pin should be tied to SDA pin. The PWM signal applied to PWM pin will be in charge of controlling LED dimming and enable the device every time the PWM is active. For this configuration EN pin should be LOW. POWER DOWN MODE If the input voltage falls below the UVLO threshold, the device enters automatically into power down mode. The device operates only when the EN pin is high, or the EN bit in Register 2 is set high. When in power down, the supply current is reduced below 2μA when there is no I2C activity, and it rises up when I2C interface is enabled. 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 19 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS LOGIC COMMANDS AND REGISTERS Table 6. Write Registers REG / DB D7 00 OVP3 D6 OVP2 D5 OVP1 D4 D3 OVP0 D2 NINEN 01 D1 D0 PINEN EN CLRI2C SETI2C 04 FPWM5 FPWM4 FPWM3 FPWM2 FPWM1 FPWM0 05 FPWM11 FPWM10 FPWM9 FPWM8 FPWM7 FPWM6 06 FPWM17 FPWM16 FPWM15 FPWM14 FPWM13 FPWM12 DPWM5 DPWM4 DPWM3 DPWM2 DPWM1 DPWM0 CHEN4 CHEN3 CHEN2 CHEN1 CHEN0 CHEN9 CHEN8 CHEN7 CHEN6 CHEN5 BST1 BST0 07 DPWM7 DPWM6 08 09 STRB CLRFAIL ALL_OFF 14 F0 ICH0_7 ICH0_6 ICH0_5 ICH0_4 ICH0_3 ICH0_2 ICH0_1 ICH0_0 F1 ICH1_7 ICH1_6 ICH1_5 ICH1_4 ICH1_3 ICH1_2 ICH1_1 ICH1_0 F2 ICH2_7 ICH2_6 ICH2_5 ICH2_4 ICH2_3 ICH2_2 ICH2_1 ICH2_0 F3 ICH3_7 ICH3_6 ICH3_5 ICH3_4 ICHG_3 ICH3_2 ICH3_1 ICH3_0 F4 ICH4_7 ICH4_6 ICH4_5 ICH4_4 ICH4_3 ICH4_2 ICH4_1 ICH4_0 F5 ICH5_7 ICH5_6 ICH5_5 ICH5_4 ICH5_3 ICH5_2 ICH5_1 ICH5_0 F6 ICH6_7 ICH6_6 ICH6_5 ICH6_4 ICH6_3 ICH6_2 ICH6_1 ICH6_0 F7 ICH7_7 ICH7_6 ICH7_5 ICH7_4 ICH7_3 ICH7_2 ICH7_1 ICH7_0 F8 ICH8_7 ICH8_6 ICH8_5 ICH8_4 ICH8_3 ICH8_2 ICH8_1 ICH8_0 F9 ICH9_7 ICH9_6 ICH9_5 ICH9_4 ICH9_3 ICH9_2 ICH9_1 ICH9_0 FA ICHG_7 ICHG_6 ICHG_5 ICHG_4 ICHG_3 ICHG_2 ICHG_1 ICHG_0 34844 20 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Table 7. Register Description REGISTER NAME DEFAULT VALUE DESCRIPTION (HEX) EN 1 Chip Enable by software. This signal is ‘OR’ed with external EN (0=off, 1 =on) PINEN 1 PIN pin enable (0=off, 1 =on) NINEN 1 NIN pin enable (0=off, 1 =on) OVP[3:0] F OVP voltage SETI2C 0 SET I2C communication (Disable SM-Bus Mode) CLRI2C 0 Clear set I2C FPWM[17:0] 300 PWM Frequency DPWM[7:0] FF PWM Duty Cycle (FFh =100%) CHEN[9:0] 3FF Channel Enable (0=off, 1=on) ALL_OFF 0 All 10 channels OFF at the same. In order to reactivate channels this bit should be clear. CLRFAIL 0 Clear fail if channels are re-enable. STRB 0 Strobe MODE (0=Parallel, 1=Strobe) BST[1:0] 2 Boost Frequency (150,300,600,1200 kHz) [0h=150Hz] ICH#[7:0] FF Channel Current Program (FFh = Maximum Current) ICHG[7:0] FF Global Current Program 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 21 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Table 8. Over Voltage Protection REGISTER (HEX) OVP VALUE (VOLTS) 2 11 3 15 4 19 5 23 6 27 7 31 8 35 9 39 A 43 B 47 C 51 D 55 E 59 F 62 34844 22 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL PERFORMANCE CURVES (TA=25°C) LOGIC COMMANDS AND REGISTERS TYPICAL PERFORMANCE CURVES (TA=25°C) 95% 94% 93% Efficiency (%) 92% 91% 90% Fs = 600KHz L=22uH, DCR=52mO Schottky V12P10-E3/86A COUT = 2x4.7µF, 2x2.2µF/100V FPWM=600Hz, 100% duty Load = 16 LEDs, 50mA/channel VLED = 48V, ±1V /channel 89% 88% 87% 86% 85% 10 12 14 16 18 20 22 24 26 28 30 Vin, volts Figure 5. Boost efficiency vs Input Voltage 50.50 ILED (highest VLED channel), mA 50.45 Fs = 600KHz L=22uH, DCR=52mO Schottky V12P10-E3/86A COUT = 2x4.7µF, 2x2.2µF/100V FPWM=600Hz, 100% duty Load = 16 LEDs, 50mA/channel V LED = 48V, ±1V /channel 50.40 50.35 50.30 50.25 50.20 50.15 50.10 50.05 50.00 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Vin, volts Figure 6. Line Regulation, Vin Changing 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 23 TYPICAL PERFORMANCE CURVES (TA=25°C) LOGIC COMMANDS AND REGISTERS 50.0 45.0 50.01 mA LED Current, mA 40.0 37.59 mA 35.0 30.0 25.0 25.03 mA 20.0 15.0 12.46 mA 10.0 FPWM=25KHz 5.0 0.0 0.4% 0.14 mA 25.0% 50.0% 75.0% 99.6% PWM Duty Cycle (%) Figure 7. PWM Dimming Linearity 10.10 10.08 10.06 Bias Current, mA 10.04 10.02 10.00 9.98 9.96 9.94 I2C Mode SM_Bus Mode Manual Mode 9.92 9.90 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Vin, volts Figure 8. Bias Current vs Input Voltage (Operational Mode) 34844 24 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL PERFORMANCE CURVES (TA=25°C) LOGIC COMMANDS AND REGISTERS 3.12 3.10 Bias Current, mA 3.08 3.06 3.04 3.02 I2C Mode 3.00 SM_Bus Mode 2.98 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Vin, volts Figure 9. Bias Current vs Input Voltage (Sleep Mode) COMP Vin=24V Load=16 LEDs, 50mA/channel VLED = 47V, ±1V VOUT INDUCTOR CURRENT Figure 10. Boost Soft Start 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 25 TYPICAL PERFORMANCE CURVES (TA=25°C) LOGIC COMMANDS AND REGISTERS ILED, CH1 ISET=40mA (all channels) FPWM=600Hz, 40% duty VCH1 VOUT (ac coupled) Precharge INDUCTOR CURRENT Figure 11. Typical Operation Waveforms for FPWM=600Hz, 40% Duty SWA SWB INDUCTOR CURRENT VOUT (ac coupled) ILED, CH1 ISET=50mA (all channels) FPWM=600Hz, 100% duty Figure 12. Typical Operation Waveforms for FPWM=600Hz, 100% Duty 34844 26 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL PERFORMANCE CURVES (TA=25°C) LOGIC COMMANDS AND REGISTERS VCh1 ISET = 20mA, FPWM=20KHz, Duty=0.78% (2LSB) ILED1 Figure 13. Low Duty Dimming Operation Waveforms (FPWM=20KHz, 2LSB) VCh1 ISET = 20mA, FPWM=20KHz, Duty=0.39% (1LSB) ILED1 Figure 14. Low Duty Dimming Operation Waveforms (FPWM=20KHz, 1LSB) 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 27 TYPICAL APPLICATIONS LOGIC COMMANDS AND REGISTERS TYPICAL APPLICATIONS MANUAL MODE (Single Wire Control) 22uH VIN = 24V 1 2 VOUT U1 1 47uF + 2.2uF 2.2uF 0 2.2uF 5.6K 56pF 309K 1.8nF 0 0 VDC1 0 CLK VOUT VDC1 VDC2 VDC3 29 22 COMP SLOPE Master CK Output 24 7 0 150K OVP = 55V 20K VDC1 5.1K VDC1 4 3 32 PGNDA PGNDB CK EN 25 PWM 27 26 SCK SDA 6 30 A0/SEN M/~S 19 ISET 20 21 PIN NIN 0 SWA SWB VOUT VIN 28 31 23 2 D1 1 LED MATRIX (16S10P) 13.8uF + 5 2 FAIL 18 I0 I1 I2 I3 I4 I5 I6 I7 I8 I9 8 9 10 11 12 13 14 15 16 17 GND 33 VCC 3.3K 0 34844 0 Figure 15. Manual Mode (Single Wire Control) MANUAL MODE (Two Wire Control) 22uH VIN = 24V 1 2 VOUT U2 1 47uF + 2.2uF 2.2uF 0 2.2uF 5.6K 56pF 0 Control 309K 1.8nF 0 0 EN PWM VOUT Unit VDC1 VDC2 VDC3 29 22 COMP SLOPE Master CK Output 24 7 150K 0 OVP = 55V 20K VDC1 5.1K VDC1 4 3 32 PGNDA PGNDB CK EN 25 PWM 27 26 SCK SDA 6 30 A0/SEN M/~S 19 ISET 20 21 PIN NIN 0 SWA SWB VOUT VIN 28 31 23 2 D5 1 LED MATRIX (16S10P) 13.8uF + 5 2 FAIL 18 I0 I1 I2 I3 I4 I5 I6 I7 I8 I9 8 9 10 11 12 13 14 15 16 17 GND 33 VCC 3.3K 0 34844 0 Figure 16. Manual Mode (Two Wire Control) 22uH VIN = 24V 1 2 VOUT U3 1 47uF + 2.2uF 0 2.2uF 2.2uF 56pF 0 5.6K 309K 1.8nF 0 0 Control Master CK 0 VDC1 SCK SDA Unit VDC1 5.1K VDC1 0 VIN 28 31 23 VDC1 VDC2 VDC3 29 22 COMP SLOPE 24 7 CK EN 25 PWM 27 26 SCK SDA 6 30 A0/SEN M/~S 19 ISET 20 21 PIN NIN SWA SWB 4 3 VOUT 32 PGNDA PGNDB 2 28 1 LED MATRIX (16S10P) 13.8uF + 5 2 FAIL 18 I0 I1 I2 I3 I4 I5 I6 I7 I8 I9 8 9 10 11 12 13 14 15 16 17 GND 33 VCC 3.3K 0 34844 34844 D8 0 Figure 17. SM-Bus Mode Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS LOGIC COMMANDS AND REGISTERS TYPICAL APPLICATIONS MASTER - SLAVE Connection 22uH VIN = 24V 1 2 VOUT U4 1 47uF 2.2uF 2.2uF 0 2.2uF 5.6K 56pF VDC1 VDC2 VDC3 29 22 COMP SLOPE 24 7 CK EN 25 PWM 27 26 SCK SDA VDC1 6 30 A0/SEN M/~S 5.1K 19 ISET 20 21 PIN NIN 309K 1.8nF 0 0 0 Master CK VDC1 VDC1 0 SWA SWB 4 3 VOUT 32 VIN 28 31 23 + PGNDA PGNDB 2 D1 1 LED MATRIX (16S10P) 13.8uF + 5 2 FAIL 18 I0 I1 I2 I3 I4 I5 I6 I7 I8 I9 8 9 10 11 12 13 14 15 16 17 GND 33 VCC 3.3K 0 34844 0 A0/SEN (Master) A0/SEN (Slave) SDA SCK MASTER Device Control Unit SLAVE Device VIN = 24V 1 22uH 2 VOUT U5 1 47uF 2.2uF 0 2.2uF 2.2uF 56pF 0 5.6K VDC1 VDC2 VDC3 29 22 COMP SLOPE Master CK 24 7 CK EN VDC1 25 PWM 27 26 SCK SDA 6 30 A0/SEN M/~S 19 ISET 20 21 PIN NIN 309K 1.8nF 0 0 Input 5.1K VDC1 0 VIN 28 31 23 + SWA SWB 4 3 VOUT 32 PGNDA PGNDB 34844 2 D2 1 LED MATRIX (16S10P) 13.8uF + 5 2 FAIL 18 I0 I1 I2 I3 I4 I5 I6 I7 I8 I9 8 9 10 11 12 13 14 15 16 17 GND 33 VCC 3.3K 0 0 Figure 18. Master - Slave Connection 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 29 TYPICAL APPLICATIONS COMPONENTS CALCULATION COMPONENTS CALCULATION The following formulas are intended for the calculation of all external components related with the Boost converter and Network compensation. In order to calculate a Duty Cycle, the internal losses of the MOSFET and Diode should be taken into consideration. Vout + V D – Vin D = --------------------------------------------Vout + V D – V SW The average input current depends directly to the output current when the internal switch is off. Iout Iin avg = ------------1–D Inductor For calculating the Inductor we should consider the losses of the internal switch and winding resistance of the inductor. ( Vin – V SW – ( Iin avg × rw ) ) × D L = ---------------------------------------------------------------------------------Iin avg × ΔIout × F SW It is important to look for an inductor rated at least for the maximum input current. Vin × ( Vout – Vin ) Iin max = Iin avg + ------------------------------------------------2 × L × F SW × Vout R Comp × 5 × G M × Iout × L Cout = -------------------------------------------------------------------( 1 – D ) × Vout × CSG The output voltage ripple (ΔVout) depends on the ESR of the Output capacitor, for a low output voltage ripple it is recommended to use Ceramic capacitors that usually have very low ESR. Since ceramic capacitor are expensive, Electrolytic or Tantalum capacitors can be mixed with ceramic capacitors to have a cheaper solution. Vout × ΔVout × F SW × L ESR Cout = --------------------------------------------------------------Vout × ( 1 – D ) The output capacitor should handle at least the following RMS current. D Irms Cout = Iout × -----------1–D Network Compensation Since this Boost converter is current controlled, Type II compensation is needed. I order to calculate the Network Compensation, first we need to calculate all Boost Converter components. For this type of compensations we need to push out the Right Half Plane Zero to higher frequencies where it can’t affect the overall loop significantly. 2 Vout × ( 1 – D ) f RHPZ = ---------------------------------------Iout × 2 × π × L Input Capacitor The input capacitor should handle at least the following RMS current. Vin × ( Vout – Vin ) Irms Cin = ⎛⎝ -------------------------------------------------⎞⎠ × 0.3 2 × L × F SW × Vout Output Capacitor For the output capacitor selection the internal current sense gain (CSG) and the Transconductance should be taken in consideration. The CSG is the internal RSense times the current sense amplifier gain (ACSA). CSG = A CSA × R Sense The Crossover frequency must be set much lower than the location of the Right half plane zero f RHPZ f Cross = --------------5 Since our system has a fixed Slope compensation set by RSLOPE, RComp should be fixed for all configurations. R Comp = 5.6Kohm CComp1 and CComp2 should be calculated as follows: 2 C Comp1 = -------------------------------------------------------f Cross × R Comp × π × 2 34844 30 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS COMPONENTS CALCULATION GM C Comp2 = --------------------------6.28 × F SW Slope Compensation Slope Compensation can be expressed either in terms of Ampers/Second or as Volts/Second, through the use of the transfer resistance. The following formula express the Slope Compensation in terms of V/μs: ( Vout – Vin ) × CSG V SLOPE = ---------------------------------------------------L×2 Where “L” is in μH In order to have this slope compensation, the following resistor should be set. 3 33 ×10 R SLOPE = -------------------V SLOPE Variable Definition D= Duty Cycle Vout= Output Voltage VD= Diode Voltage Vin= Input Voltage VSW= Internal Switch Volute ΔVout= Output Voltage Ripple Ratio Iinavg= Average Input Current Iout= Output Current Ripple Iinmax= Maximum input current ΔIout= Output Current Ripple Ratio IrmsCin= RMS current for Input Capacitor IrmsCout= RMS current for Output Capacitor L= Inductor rw= Inductor winding resistor FSW= Boost Switching Frequency CSG= Current Sense Gain = 0.2 V/A ACSA= Current Sense Amplifier Gain = 9 RSense= Current Sense Resistor = 22mohm Cout= Output Capacitor RComp= Compensation Resistor GM= OTA Transconductance ESRCout= ESR of Output Capacitor fRHPZ= Right Half Plane Zero Frequency fCross= Crossover Frequency CComp1= Compensation Capacitor CComp2= Shunt Compensation Capacitor VSLOPE= Slope Compensation (V/s) RSLOPE= External Resistor for Slope Compensation 34844 Analog Integrated Circuit Device Data Freescale Semiconductor 31 TYPICAL APPLICATIONS LAYOUT GUIDELINES LAYOUT GUIDELINES RECOMMENDED STACK-UP SWITCHING NODE (SWA & SWB) The following table shows the recommended layer stackup for the signals to have good shielding and Thermal Dissipation. Table 9. Layer Stacking Recommendations The components associated to this node must be placed as close as possible to each other to keep the switching loop small enough so that it does not contaminate other signals. However, care must be taken to ensure the copper traces used to connect these components together on this node are capable to handle the necessary current and voltage. As a reference, a 10mils trace with a thickness of 1 oz of copper is capable of handling one ampere. Traces for connecting the inductor, input and output caps should be as wide and short as possible to avoid adding inductance or resistance to the loop. The placement of these components should be selected far away from sensitive signals like compensation, feedback and internal regulators to avoid power noise coupling. Stack-Up Layer 1 (Top) Signal Layer 2 (Inner 1) Ground Layer 3(Inner 2) Signal Layer 4 (Bottom) Ground DECOUPLING CAPS It is recommended to place decoupling caps of 100pf at the beginning and at the end of any power signal traces to filter high frequency noise. Decoupling caps of 100pf should be also placed at the end of any long trace to cancel antenna effects on it. These caps should be located as closed as possible to the point to be decoupled and the connection to GND should be as short as possible. SM_BUS/I2C COMMUNICATION AND CLOCK SIGNALS (SDA, SCK AND CK) To avoid contamination of these signals by nearby high power or high frequency signals, it is a good practice to shield them with ground planes placed on adjacent layers. Make sure the ground plane is uniform through the whole signal trace length. COMPENSATION COMPONENTS Components related with COMP pin need to be placed as close as possibThe trace of the feedback signal (VOUT) should be routed perpendicularly or at 45° on a different layer to avoid coupling noise, preferably between ground or power planes. FEEDBACK SIGNAL The trace of the feedback signal (VOUT) should be routed perpendicularly or at 45° on a different layer to avoid coupling noise, preferably between ground or power planes. IInnppuut Ca Capp ut C DO S Sw wiititcchhiin ingg N Noodde de Signal On State Signal Ground Planes Ground Plane Figure 19. Recommended shielding for critical signals. These signals shall not run parallel to power signals or other clock signals in the same routing layer. If they have to cross or to be routed close to a power signal, it is a good practice to trace them perpendicularly or at 45° on a different layer to avoid coupling noise. FFe dbaac ackk Feeeddb S Si Siggn gnaall C Coom mppeen enssa saattiiioonn Off State O Caapp Ouuttppuutt C Figure 20. Feedback Signal Tracing 34844 32 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. 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