FREESCALE MC143416

MOTOROLA
Freescale Semiconductor, Inc.
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SEMICONDUCTOR TECHNICAL DATA
MC143416
Freescale Semiconductor, Inc...
Advance Information
Dual 16-Bit Linear Codec-Filter
The MC143416 Dual 16–Bit Linear Codec–Filter is a single–chip implementation of the data conversion interface required to design high–speed
modems meeting a wide range of standards such as ITU–T V.34 and V.90
modem. It includes two high performance Analog–to–Digital (A/D) and
Digital–to–Analog (D/A) data converters. The device performs all filtering
operations related to the conditioning and sample rate conversion of signals to
and from the data interface. Output from both codecs (COder/DECoder) is in
16–bit 2s complement format.
The MC143416 includes the necessary logic needed to generate all clocks
(oversampling, intermediate frequency, and baud rate) required to perform the
data processing operations involved in the oversampling conversion of voice
and data signals. Sample rates are fully programmable in the range of 8
kilosamples/second (ks/s) to 16 ks/s. The bandwidth of the MC143416 is 0.425
* Sample Frequency (FS).
The MC143416 includes two Synchronous Serial Interfaces (SSIs) through
which an external Digital Signal Processor (DSP) can configure and monitor the
operation of the device. Digital sample data is transferred to and from the
codecs through the serial ports. In addition, information can be written and read
to the control and status registers of the device via the serial port, transparent to
the flow of sample data. When used in a high–speed modem application, the
MC143416 provides the analog front end interface required to support modem
and voice features.
44
PB SUFFIX
TQFP
CASE 824D
1
ORDERING INFORMATION
MC143416PB
TQFP
MC143416 Features
• Fully–Differential Analog Circuit Design for Lowest Noise
• Two High Performance 16–Bit Sigma–Delta A/D and D/A Converters
• Band–Pass and Low–Pass Filtering for Both Codecs is Performed
On–Chip
• Power Monitor Circuit
• Single 5 V ± 5% Power Supply
• Two Configurable Serial Ports
• On–Chip Precision Reference Voltage
• On–Chip Speaker Driver and Mixer with Programmable Gain — Capable of
Delivering 15 mW of Power into a Small Speaker (32 Ω)
• Bandwidth is 0.425 * FS
• No External Filtering Required Because of Flat Response Over Passband
• Capable of Providing the Analog Front End for Wide Range of Modem
Standards
This document contains information on a new product. Specifications and information herein are subject to change without notice.
REV 3
5/98
TN98052800

Motorola, Inc. 1998
MOTOROLA
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MC143416
1
Freescale Semiconductor, Inc.
AO1-
AO1+
SSIDS
SSIMS
26
25
24
23
27
AG1+
AVDD 2
AGND2
AI130
28
AI1+
31
29
VAG
AG132
33
14
DVDD3
DGND3
AO0-
43
13
SRx0
AO0+
44
12
STx0
11
15
42
SCK0
AVDD1
AGND1
10
SSYNC1
41
SSYNC0
16
9
40
8
SCK1
AG0+
RESET
17
RSTEXT
39
7
STx1
AI0-
PDI
18
6
38
MCLK1
SRx1
AI0+
5
DGND1
19
MCLK0
20
37
4
36
AG0-
DVDD 2
SPK+
3
DVDD1
XTAL out
SSIFM
21
2
22
35
1
34
XTAL in
VAGREF
SPK-
DGND2
BLOCK DIAGRAM
ANALOG INTERFACE
SSYNC0
SCLK0
STx0
SSIFM
SSIDS
GAIN
+
-
AAF
SSI0
16-BIT
SIGMA-DELTA
DAC
LOW-PASS
FILTER
SRx0
SSIMS
16-BIT
SIGMA-DELTA
ADC
CONTROL AND
STATUS REGISTERS
CONFIGURATION
INPUTS
AG0AI0+
AI0AG0+
SF
+
-
AO0+
AO0-
SPEAKER MIX
ATTENUATE AND
CONTROL
+
-
SPK+
SPK-
SF
+
-
AO1+
AO1-
CODEC 0
BAND-PASS
FILTER
RESET
SSYNC1
SCLK1
STx1
SSI1
SRx1
BAND-PASS
FILTER
PDI
XTALin
XTALout
MC143416
2
16-BIT
SIGMA-DELTA
DAC
LOW-PASS
FILTER
CLOCK
GENERATION
POWER
MONITOR
MCLK0 MCLK1
RSTEXT
16-BIT
SIGMA-DELTA
ADC
VAG
VAG VAGREF
GAIN
AAF
+
-
AG1AI1+
CODEC 1
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PIN ASSIGNMENT
AI1AG1+
POWER SUPPLIES
AGND
DGND
DVDD
AVDD
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MAXIMUM RATINGS (Voltages Referenced to DGND or AGND)
Symbol
VDD
Parameter
Value
Unit
– 0.5 to 6.0
V
Voltage on Any Analog Input or Output
Pin
AGND – 0.3
to VDD + 0.3
V
Voltage on Any Digital Input or Output
Pin
DGND – 0.3
to VDD + 0.3
V
Operating Temperature Range
– 40 to 85
°C
Storage Temperature Range
– 85 to 150
°C
DC Supply Voltage
TA
Tstg
This device contains protection circuitry to
guard against damage due to high static voltages or electric fields. However, precautions
must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high–impedance circuit.
POWER SUPPLY (TA = – 40 to 85°C)
Characteristics
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DC Supply Voltage
Min
Typ
Max
Unit
4.75
5.0
5.25
V
mA
Active Current Dissipation (VDD = 5 V)
2 Codecs @ 16 kHz and XTAL @ 25 MHz
with OSR = 1.632 MHz
Analog
—
6
12
Digital
—
44
52
Power–Down Current
Analog
Digital
—
—
60
60
100
100
µA
Min
Max
Unit
DIGITAL LEVELS (VDD = 4.75 to 5.25 V, DGND = 0 V, TA = – 40 to 85°C)
Symbol
Characteristics
VIL
Input Low Voltage
—
0.8
V
VIH
Input High Voltage
2.4
—
V
VOL
Output Low Voltage (STx Pin, IOL= 4 mA @ 5 V VDD)
—
0.5
V
VOH
Output High Voltage (STx Pin, IOH = – 4 mA @ 5 V VDD)
4.25
—
V
IL
Input Low Current (DGND ≤ Vin ≤ VDD)
– 10
10
µA
IH
Input High Current (DGND ≤ Vin ≤ VDD)
– 10
10
µA
IOZ
Output Current in High Impedance State (DGND ≤ STx0,1 ≤ VDD)
– 10
10
µA
Cin
Input Capacitance of Digital Pins
—
10
pF
Output Capacitance of STx0 and STx1 Pin when High–Z
—
10
pF
Cout
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ANALOG ELECTRICAL CHARACTERISTICS (AVDD = 4.75 to 5.25 V, AGND = 0 V, TA = – 40 to 85°C)
Characteristics
Differential Mode Input Resistance
Typ
Max
Unit
—
65
—
kΩ
Input Current
AI+, AI–
– 10
—
10
µA
Input Resistance to VAG (VAG – 0.5 V ≤ Vin ≤ VAG + 0.5 V)
AI+, AI–
10
—
—
MΩ
Input Capacitance
AI+, AI–
—
10
—
pF
Input Offset Voltage of AG Op Amp
AI+, AI–
—
20
—
mV
Input Common Mode Voltage Range
AI+, AI–
—
2.5
—
V
Input Common Mode Rejection Ratio
(Input Amp Only)
AI+, AI–
60 Hz
0 – 4 kHz
0 – 20 kHz
60 Hz
0 – 4 kHz
—
—
—
—
—
120
72
68
106
75
—
—
—
—
—
dB
Gain Bandwidth Product (10 kHz) of AG Op Amp (RL ≥ 10 kΩ)
—
1000
—
kHz
DC Open Loop Gain of AG Op Amp (RL ≥ 10 kΩ)
—
110
—
dB
Input Amplifier Signal to Noise + Distortion (Between AI+ and AI–, 1.5 Vrms,
0.2 – 3.4 kHz)
—
95
—
dB
Output Load Capacitance for AG Op Amp
—
—
220
pF
AGND + 1
—
VDD – 1
V
(Complete A/D Path)
Freescale Semiconductor, Inc...
Min
Output Voltage Range for AG
(RL = 2 kΩ to VAG)
Output Current (0.5 V ≤ Vout ≤ VDD – 0.5 V)
AG+, AG–
250
—
—
µA
Output Load Resistance to VAG
AG+, AG–
10
—
—
kΩ
Output Current (0.5 V ≤ Vout ≤ VDD – 0.5 V)
AO+, AO–
—
2
—
mA
Output Load Resistance to VAG
AO+, AO–
1.0
1.2
—
kΩ
Differential Output Impedance
Series Resistor Inductor @ 53 mA rms
from 60 Hz to 100 kHz
AO+, AO–
R
L
—
—
0.7
5.7
3
10
Ω
µH
Speaker Driver Output Impedance
Series Resistor Inductor @ 85 mA rms
from 60 Hz to 100 kHz
SPK+, SPK–
R
L
—
—
1.75
6.4
7.0
12.0
Ω
µH
AO–
—
—
0.1
µF
Output Load Capacitance
Differential Output Offset Voltage of AO+ and AO–
VAG Output Voltage Referenced to AGND (No Load)
VAG Output Current with ± 25 mV Change in Output Voltage
Power Supply Rejection Ratio
(2 kHz @0.1 Vrms Applied to VDD)
MC143416
4
A/D
D/A
—
—
20
mV
AVDD/2 – 0.07
—
AVDD/2 + 0.07
V
– 44
—
44
mA
40
40
—
—
—
—
dB
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Freescale Semiconductor, Inc.
ANALOG TRANSMISSION PERFORMANCE
(VDD = 4.75 to 5.25 V, All Analog Signals Referenced to VAG, 0.775 Vrms = 0 dBm into 600 Ω, FS = 8 kHz,
Measurement Band = 200 to 0.425 * FS, TA = – 40 to 85°C, Unless Otherwise Noted)
A/D
Characteristics
Min
Typ
D/A
Max
Min
Typ
Max
Unit
Dynamic Range
—
78
—
—
80
—
dB
Absolute Gain (– 3 dBm0 @ 1 kHz, TA = 25°C, VDD = 5.0 V)
1.5
1.8
2.3
9.4
9.55
9.7
dB
69
63.5
53
72
67
57
—
—
—
55.5
63
60
58
66
63
—
—
—
dB
—
18
—
—
22
—
dBrn0
—
– 0.15
– 0.20
—
– 20
0
– 0.14
– 33
—
0.15
0.12
– 32
– 0.25
– 0.25
– 0.25
—
0
0
0
– 66
0.25
0.25
0.25
62.5
dB
—
318
—
—
214
—
µs
—
—
—
—
—
—
—
96
46
2
0
22
189
290
—
—
—
—
—
—
—
—
—
—
—
—
—
—
– 26
– 24
– 20
– 18
86
120
169
—
—
—
—
—
—
—
µs
Signal to Noise + Distortion
(See Figures 1 and 2)
– 3 dBm0
– 10 dBm0
– 20 dBm0
Idle Channel Noise (dBrn0)
60 Hz
300 to 3000 Hz
3400 Hz
4000 Hz
Absolute Delay (1600 Hz)
Group Delay Referenced to 1600 Hz
500 to 600 Hz
600 to 800 Hz
800 to 1000 Hz
1000 to 1600 Hz
1600 to 2600 Hz
2600 to 2800 Hz
2800 to 3000 Hz
CROSSTALK
Characteristics
Min
Typ
Max
Unit
Intra–Channel A/D Talking; D/A Listening (Note 1)
—
– 77
– 69
dB
Intra–Channel D/A Talking; A/D Listening (Note 2)
—
– 70
– 64
dB
Inter–Channel A/D Talking; D/A Listening (Note 3)
—
– 78
– 66.5
dB
Inter–Channel D/A Talking; A/D Listening (Note 4)
—
– 73
– 62.5
dB
80
80
70
70
60
50
40
30
20
10
60
50
40
30
20
10
0
- 45 - 40 - 35 - 30 - 25 - 20 - 15
- 10
-5
0
Input Signal (dBm0)
Figure 1. Typical A/D Signal–to–Noise + Distortion
MOTOROLA
Signal to Noise + Distortion (dB)
NOTES:
1. 2 kHz, – 3 dBm0 signal applied to A/D input; 600 Hz, – 20 dBm0 signal applied to D/A input of same codec; 2 kHz content measure on D/A
output of same codec.
2. 2 kHz, – 3 dBm0 signal applied to D/A input; 600 Hz, – 20 dBm0 signal applied to A/D input of same codec; 2 kHz content measure on A/D
output of same codec.
3. 2 kHz, – 3 dBm0 signal applied to A/D input; 600 Hz, – 20 dBm0 signal applied to D/A input of opposite codec; 2 kHz content measure on
D/A output of opposite codec.
4. 2 kHz, – 3 dBm0 signal applied to D/A input; 600 Hz, – 20 dBm0 signal applied to A/D input of opposite codec; 2 kHz content measure on
A/D output of opposite codec.
Signal to Noise + Distortion (dB)
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Frequency Response (Relative to 1 kHz @ 0 dBm0)
0
- 45 - 40 - 35 - 30 - 25 - 20 - 15
- 10
-5
0
Input Signal (dBm0)
Figure 2. Typical D/A Signal–to–Noise + Distortion
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Table 1. Pin Descriptions
Pin No.
Pin Name
Pin Description
1
DGND2
Digital Ground #2
2
XTALin
Input — Crystal Oscillator Input
3
XTALout
Output — Crystal Oscillator Output
4
DVDD2
Digital Positive Power Supply #2
5
MCLK0
Input — Master Clock for Codec 0
6
MCLK1
Input — Master Clock for Codec 1
7
PDI
Input — Power Down Input
8
RESET
9
RSTEXT
Input — System Reset
Output — External Reset from Power Monitor Circuit
10
SSYNC0
Output — Serial Sync for Port 0
11
SCLK0
Output — Serial Clock for Port 0
12
STx0
Output — Serial Output for Port 0
13
SRx0
Input — Serial Input for Port 0
14
DGND3
Digital Ground #3
15
DVDD3
Digital Positive Power Supply #3
16
SSYNC1
Output — Serial Sync for Port 1
17
SCLK1
Output — Serial Clock for Port 1
18
STx1
Output — Serial Output for Port 1
19
SRx1
Input — Serial Input for Port 1
20
DGND1
Digital Ground #1
21
DVDD1
Digital Positive Power Supply #1
22
SSIFM
Input — SSI Framing Mode
23
SSIMS
Input — SSI Mode Select
24
SSIDS
Input — SSI Data Size
25
AO1+
Output — Codec 1 Non–Inverting Analog Output
26
AO1–
Output — Codec 1 Inverting Analog Output
27
AGND2
Analog Ground #2
28
AVDD2
Analog Positive Power Supply #2
29
AG1+
Output — Codec 1 Input Op Amp Non–Inverting Output
30
AI1–
Input — Codec 1 Input Op Amp Inverting Input
31
AI1+
Input — Codec 1 Input Op Amp Non–Inverting Input
32
AG1–
Output — Codec 1 Input Op Amp Inverting Output
33
VAG
Output — Analog Ground Voltage
34
VAGREF
35
SPK–
Output — Speaker Driver Inverting
36
SPK+
Output — Speaker Driver Non–Inverting
37
AG0–
Output — Codec 0 Input Op Amp Inverting Output
38
AI0+
Input — Codec 0 Input Op Amp Non–Inverting Input
39
AI0–
Input — Codec 0 Input Op Amp Inverting Input
40
AG0+
Output — Codec 0 Input Op Amp Non–Inverting Output
Output — Analog Ground Reference
Continued on next page
MC143416
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Table 1. Pin Descriptions (continued)
Pin No.
Pin Name
Pin Description
41
AVDD1
Analog Positive Power Supply #1
42
AGND1
Analog Ground #1
43
AO0–
Output — Codec 0 Inverting Analog Output
44
AO0+
Output — Codec 0 Non–Inverting Analog Output
PIN DESCRIPTIONS
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ANALOG POWER SUPPLY
DVDD1, DVDD2, and DVDD3
Digital Supply Pad (Pins 21, 4, and 15, Respectively)
These pins are the positive power supplies for the digital
circuitry and are internally tied together.
VAGREF
Analog Ground Reference (Pin 34)
CONFIGURATION INPUTS
This pin is used to capacitively bypass the on–chip circuitry that generates the mid–supply voltage for the VAG output
pin. This pin should be bypassed to AGND with a 0.01 µF
and 10 µF capacitor using short, low inductance traces. The
VAGREF pin is only used for generating the reference voltage
for the VAG pin. This pin can be overridden by an external
voltage source, such as a resistor divider, using two 2K resistors. No more than 100 na should be required to override this
circuit. All analog signal processing within this device is referenced to the VAG pin. If the audio signals to be processed are
referenced to AGND, then special precautions must be utilized to avoid noise between AGND and the VAG pin (such as
adding coupling capacitors). When this device is in power–
down mode, the VAGREF pin is pulled to the AVDD power
supply with a non–linear, high–impedance circuit.
SSIMS
Mode Select (Pin 23)
This pin selects whether the chip is operating in Dual SSI,
logic 0, or in Single SSI, logic 1. In dual mode, each codec is
operated from independent serial interfaces. The timing of
each interface is dictated by the associated codec timing. In
single serial mode, the timing of the interface is derived from
the timing of the faster of the two codecs. The faster codec is
defined by bit SSI_SEL in control register 4.
VAG
Analog Common Mode Voltage (Pin 33)
This output pin provides a mid–supply analog ground. This
pin should be decoupled to AGND with a 0.01 µF ceramic capacitor. All analog signal processing within this device is referenced to this pin. If the audio signals to be processed are
referenced to AGND, then special precautions must be utilized to avoid noise between AGND and the VAG pin. The
VAG pin becomes high impedance when this device is in
power–down mode.
AGND1 and AGND2
Analog Ground Pad (Pins 42 and 27, Respectively)
These pins provide the ground reference for the internal
analog circuitry.
SSIDS
SSI Data Size (Pin 24)
When this pin is logic 0, the 24–bit word length of the SSI is
enabled. When it is logic 1, the serial data format is adjusted
to accommodate 16–bit word length.
SSIFM
SSI Framing Mode (Pin 22)
When this pin is logic 0, Short Frame mode is selected.
This is defined as a 1–bit–wide clock pulse occurring before
the first bit (MSB) of the data stream. When the pin is logic 1,
Long Frame mode is selected. In long framing, the pulse
rises simultaneously with the first data bit (MSB) and falls after the last data bit (LSB) has been shifted out.
SPEAKER INTERFACE
SPK+ and SPK–
Speaker Positive and Negative Signal Outputs
(Pins 36 and 35, Respectively)
These pins are the outputs of the speaker driver and can
deliver 15 mW of power into a small 32 Ω speaker. The external speaker can be dc–coupled to the SPK+ and SPK– pins.
AVDD1 and AVDD2
Analog Supply Pad (Pins 41 and 28, Respectively)
CODEC INTERFACE
These pins are the positive power supplies for the analog
circuitry and are internally tied together.
AI0+, AI1+, AI0–, and AI1–
Analog Inputs for Codec 0 and Codec 1
(Pins 38, 31, 39, and 30, Respectively)
These pins are the non–inverting and inverting inputs of
the analog input gain setting amplifier. This fully–differential
amplifier is the first stage of the A/D modulator portion of the
codec. A low to moderate gain (up to 20 dB) can be obtained
from this amplifier using external components. There is an internal 2 pF feedback capacitor to provide high frequency
roll–off above 500 kHz.
DIGITAL POWER SUPPLY
DGND1, DGND2, and DGND3
Digital Ground Pad (Pins 20, 1, and 14, Respectively)
These pins provide the ground reference for the internal
digital circuitry.
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AG0+, AG1+, AG0–, and AG1–
Outputs of Input Amplifier for Codec 0 and Codec 1
(Pins 40, 29, 37, and 32, Respectively)
These pins are the differential outputs of the input gain setting amplifiers.
AO0+, AO1+, AO0–, and AO1–
Analog Outputs for Codec 0 and Codec 1
(Pins 44 ,25, 43, and 26, Respectively)
These pins are the non–inverting and inverting outputs of
the analog output amplifier. This unity gain line driver represents the final stage of the D/A section of the codec. This amplifier provides a differential output that can be dc–coupled
with a hybrid circuit and is able to drive a telephone line.
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SSI PORT 0 and PORT 1
SCLK0 and SCLK1
Serial Port 0 and Serial Port 1 Clock Signal Output Pins
(Pins 11 and 17, Respectively)
These pins are the timing reference for the transmission of
data through the STx and SRx pins. Data transfer can only
happen if the synchronization frame begins.
SSYNC0 and SSYNC1
Serial Port 0 and Serial Port 1 Sync Signal Output Pins
(Pins 10 and 16, Respectively)
These pins output the synchronization frame. The sync
signal defines the beginning of each word transmitted
through the STx and SRx pins.
STx0 and STx1
Serial Port 0 and Serial Port 1 Output Pins
(Pins 12 and 18, Respectively)
These pins are used to transmit data from serial ports 0
and 1. Serial transmission data is shifted on the rising edge
of the serial clock (SCLK).
SRx0 and SRx1
Serial Port 0 and Serial Port 1 Input Pins
(Pins 13 and 19, Respectively)
These pins are used to receive data from serial ports 0 and
1. Serial receive data is sampled internally on the falling
edge of the serial clock.
RESET
CLOCKING
XTALin, XTALout
Crystal Oscillator Input and Output
(Pins 2 and 3, Respectively)
These pins form a reference oscillator when connected to
terminals of an external parallel–resonant crystal. The internal logic clock timing (system clock) is always derived from
the XTALin clock signal. The timing for the codecs can be
derived from either the XTALin signal, or from the MCLK input.
Frequency–setting capacitors of appropriate values, as
recommended by the crystal supplier, are connected from
each pin to ground. The MC143416 has an inverter between
XTALin and XTALout. An external resistor below 5 M is required between these two pins to define the trip point. A resistor of around 910 K has been found to be the best value
for startup operation. This resistor value will result in a startup time of around 400 ms. Lower values will provide quicker
startup times, but the XTALout amplitude will diminish as the
resistor size goes down.
During power–down conditions, XTALout is placed in a
high–impedance state, and XTALin is internally disconnected, so the device needs to be powered up in order to allow the input of external signals or crystal usage.
During normal operation, an external signal can be applied
to XTALin, instead of a crystal. It should be noted that the
phase of this signal and the internal signal (derived from
XTALin) are inverted.
The drive capability of XTALout is somewhat small, so it will
be harder to start up the oscillation if the external resistor is
too large (> 5 MΩ). The crystal value and/or external clock
signal should be kept below 30 MHz.
MCLK0 and MCLK1
Master Clock Inputs for Codec 0 and Codec 1
(Pins 5 and 6, Respectively)
These pins are the master clock inputs for the codecs
when the timing is not derived from the crystal. The master
clock is equal to the oversampling clock.
PDI
Absolute Power–Down Input (Pin 7)
RESET
System Reset Input (Pin 8)
This pin is used to force a hardware reset of the
MC143416. Note: This is ineffective when the device is in
general power down.
RSTEXT
External Reset Output to Board Functions from Power
Monitor (Pin 9)
The MC143416 provides a voltage level sensing circuit
which generates an active low external reset when the power
MC143416
8
supply voltage drops below a nominal 4.5 V. The power on
reset (POR) does not reset the internal circuitry, but provides
an external reset signal for board use. The minimum duration
of the external reset is 140 ms.
This pin turns off any activity in the MC143416 except the
power monitor function by stopping the oscillator. After any
assertion of the PDI pin, a 10 ms period is required to resume
functional operation. This time constraint is needed for the
crystal oscillator to start up and stabilize to its defined operating point. It is mandatory to apply a hardware reset after this
oscillator startup phase. Alternatively, a software reset can
be applied after this startup phase and after making sure the
serial interface framing logic has synced up to the host control/data frame.
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greater than or equal to 8 when derived from the MCLK
input.
• The system clock should provide a minimum of 580
cycles per sampling period per codec. For example, the
Fmin value of two codecs running at 8 ks/s would be:
FUNCTIONAL DESCRIPTION
CLOCK GENERATION
Freescale Semiconductor, Inc...
Introduction
Fmin = FS * 580 * 2 = 8000 * 580 * 2 = 9.28 MHz
The clock generation block generates all timing signals
necessary for the operation of the device from a crystal input
or alternatively from the oversampling clock (OSR CLK) supplied through the MCLK input. The selection between these
two modes is controlled by the MCLK_SEL register.
The clock generation block generates the oversampling
clocks, the intermediate sampling clock (for internal use),
and the clocking signals for the SSI ports. The ratio of the
oversampling clock to the sampling clock defines the decimation/interpolation rate. When the MCLK input is used, this
clock is the OSR clock. The bit clock for the Synchronous
Serial Interfaces (SSIs) is equal to the oversampling clock
frequency (fOSR).
Note that the MCLK and XTALin frequency need to be integer multiples of the codecs’ sampling rates.
• The maximum crystal frequency and operating system
clock frequency is 30 MHz.
Clock Generation and Divide Ratios
The functional block diagram is shown in Figure 3.
HSDIV and LSDIV Ratios. The clock generation block
contains separate programmable divisors for each codec.
The relationship of XTALin frequency, the dividers, and the
sampling frequency (FS) is:
XTALin = 2 * FS * (HSDIV * LSDIV)
where HSDIV = 7, 8, ..., 63 (default 16), and LSDIV = 51,
..., 127 (default 51).
When the signal is a MCLK input only, the LSDIV value applies; the HSDIV setting is a don’t care. Higher settings will
positively impact (reduce) power consumption.
Tables 2 through 5 provide examples of the divisor values
to derive the OSR and FS from several different crystal values.
System Divide Ratios. The system clock frequency has
to be set to a minimum of seven times the oversampling frequency of the codec running the maximum OSR. This is accomplished when clocking is derived from the crystal when
the HSDIV0 and HSDIV1 values are set to 7 or more. When
clocking is derived from MCLK0 and/or MCLK1, a minimum
ratio of 8 has to be guaranteed between any MCLK and the
XTALin frequency.
Oversampling Clock Selection
The practical maximum and minimum oversampling ratio
at which the device will operate is determined by the hardware implementation. At all times, the following conditions
need to be met for proper operation:
• Second order sigma–delta modulation is performed and
the oversampling ratio has to be kept in the range of 102
to 254 (LSDIV values 51 to 127).
• Oversampling frequency is limited to 4 MHz.
• The ratio of the oversampling clock to the system clock
should be greater than or equal to 7 when the
oversampling clock is derived from the crystal input, and
HSDIV0 (5:0)
LSDIV0 (6:0)
CODEC 0 OSR CLOCK
CLKSEL0
AND SSI0 BIT CLOCK
HSDIV
CODEC 0
MUX
LSDIV
INTERMEDIATE
SAMPLING CLOCK
FRAME SYNC
SSI0 FRAME SYNC
GENERATOR
LSDIV1 (6:0)
HSDIV1 (5:0)
CODEC 1 OSR CLOCK
AND SSI1 BIT CLOCK
CLKSEL1
CODEC 1
HSDIV
LSDIV
INTERMEDIATE
MUX
SAMPLING CLOCK
FRAME SYNC
GENERATOR
DIV1,
2, 3/2, 3
MCLK0
MCLK1
XTALin
SSI1 FRAME SYNC
SYSTEM CLOCK
SYS_DIV (1:0)
Figure 3. Block Diagram of the Clock Generation Scheme
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Table 2. Suggested Sample Rate Table with a 28.224 MHz Crystal
FS (Hz)
LSDIV
HSDIV
OSR = 2X LSDIV
FOSR (MHz)
8000
126
14
252
2.016
9600
105
14
210
2.016
11025
80
16
160
1.764
12000
98
12
196
2.352
16000
126
7
252
4.032
Freescale Semiconductor, Inc...
Table 3. Suggested Sample Rate Table with a 24.192 MHz Crystal
FS (Hz)
LSDIV
HSDIV
OSR = 2X LSDIV
FOSR (MHz)
7200
120
14
240
1.728
8000
126
12
252
2.016
8229*
105
14
210
1.728
8400
120
12
240
2.016
9000
112
12
224
2.016
9600
126
10
252
2.4192
10287*
98
12
196
2.016
12000
126
8
252
3.024
14400
120
7
240
3.456
16000
108
7
216
3.456
* Values rounded
Table 4. Suggested Sample Rate Table with a 21.504 MHz Crystal
FS (Hz)
LSDIV
HSDIV
OSR = 2X LSDIV
FOSR (MHz)
8000
112
12
224
1.792
9600
112
10
224
2.104
11025
Integer Ratio From Crystal Not Possible
12000
64
14
128
1.536
16000
96
7
192
3.072
Table 5. Suggested Sample Rate Table with a 20.16 MHz Crystal
FS (Hz)
LSDIV
HSDIV
OSR = 2X LSDIV
FOSR (MHz)
7200
100
14
200
1.44
8000
126
10
252
2.016
8229*
8400
Integer Ratio From Crystal Not Possible
120
10
240
2.016
9000
112
10
224
2.016
9600
105
10
210
2.016
10287*
98
10
196
2.016
12000
120
7
240
2.88
14400
100
7
200
2.88
16000
90
7
180
2.88
* Values rounded
NOTES FOR TABLES 2 THROUGH 5:
1. FS – desired sample rate.
2. LSDIV and HSDIV are the values loaded into the control registers in decimal format.
3. Values shown try to maximize oversampling rate.
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CNTL0_0: Power Control Register — Codec 0
REGISTER PROGRAMMING
ANARSVD0 (R/W, 0): This bit is reserved for future use
and must be kept 0.
ALOOP (R/W, 0): This bit controls the remote loopback
function at the analog/digital interface. Setting this bit to 1 will
force the single bit modulated output from Rx in the codec to
loopback into the single bit input of the D/A. See Figure 4.
DLOOP (R/W, 0): Setting this bit to 1 will force a digital
loopback in the codec. This occurs at a point between the
output of digital interpolator filter and the input of the digital
decimator filter. See Figure 4.
RST (R/W, 1): Setting this bit to 1 will force a value of 0x00
to all digital processing stages.
PWDN (R/W, 1): Setting this bit to 1 will disable all data
processing for this codec and power down the associated
analog circuitry.
TxEN (R/W, 0): Setting this bit to 1 will enable the transmitter on the codec. The transmitter is a differential mode
power stage. When disabled, the amplifier maintains a zero
differential output voltage (AO0+ = AO0– = VAG).
ALOCAL LOOP (R/W, 0): As opposed to the ALOOP bit of
this register, ALOCAL LOOP closes a local loopback at the
analog interface. When this bit is set active (1), the analog
output signal on pins AO0+ and AO0– is fed back into the input amplifier stage on pins AI0+ and AI0–. See Figure 4.
REGISTER PROGRAMMING MODEL
Table 6 is the register map of the MC143416’s control and
status registers. Registers labeled with a 0 suffix are
associated with SSI Port 0, and those with a 1 suffix are
associated with SSI Port 1. For example, register CNTL0_0
is associated with SSI Port 0, and CNTL0_1 is associated
with SSI Port 1.
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CONTROL AND STATUS REGISTERS
The MC143416 provides ten 8–bit control/status registers
that are available to use. The MSB of all these registers is
always 0 as a safety feature against desynchronization (address/data swap). Each register is doubled to serve one
associated codec, with the exception of register CNTL4,
CNTL5, CNTL6, and CNTL7, which carry global chip controls. These registers are accessible by either SSI port.
In the following paragraphs, the contents of each register
are discussed in detail. In the description of each individual
bit, two parameters are included: access and reset value. Access indicates whether the bit is read only, write only, or both;
reset value indicates the value upon reset. All register bits
are static except SWRESET in CNTL4.
Table 6. Register Map
Register
Addr
7
6
5
4
3
2
1
0
Mode
CNTL0_0
0x0
0
ANARSVD0
ALOOP0
DLOOP0
PWDN0
RST0
TxEN0
ALOCAL
LOOP
R/W
CNTL0_1
0x1
0
ANARSVD1
ALOOP1
DLOOP1
PWDN1
RST1
TxEN1
ALOCAL
LOOP
R/W
CNTL1_0
0x2
0
HPF_EN0
IN_GAIN0(1:0)
SPK_Rx0(1:0)
SPK_Tx0(1:0)
R/W
CNTL1_1
0x3
0
HPF_EN1
IN_GAIN1(1:0)
SPK_Rx1(1:0)
SPK_Tx1(1:0)
R/W
CNTL2_0
0x4
0
MCLK0_SEL
HSDIV0(5:0)
R/W
CNTL2_1
0x5
0
MCLK1_SEL
HSDIV1(5:0)
R/W
CNTL3_0
0x6
0
LSDIV0(6:0)
R/W
CNTL3_1
0x7
0
LSDIV1(6:0)
R/W
CNTL4
0x8
0
CNTL5
0x9
0
SWRESET
RSVD
SSI_SEL
SELF_CHECK (2:0)
TEST_RSVD (1:0)
CNTL6
SERIAL
LOOP
0
0
0xF
MOTOROLA
0
RO
WO
RO
WO
RSVD (6
(6:0)
0)
SYNC
TEST_MODE (1:0)
R/W
WO
RSVD (5
(5:0)
0)
CNTL7
SYS_DIV(1:0)
SEE DESCRIPTION
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RO
R/W
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11
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ALOCAL LOOP
DLOOP
AO+
Tx0
INTERPOLATION
AND NOISE SHAPER
D/A
Rx0
DECIMATION
SIGMA-DELTA
MODULATOR
LPF
AO-
AI+
AAF
GAIN
AI-
ALOOP
Functional Path
Freescale Semiconductor, Inc...
Test Loops
Figure 4. Digital and Analog Loopback Features
CNTL0_1: Power Control Register — Codec 1
For Codec 1, refer to Power Control Register — Codec
0. The power control register address for Codec 1 is 0x1.
Pins AO0+, AO0–, AI0+, and AI0– for Codec 0 correspond to
pins AO1+, AO1–, AI1+, and AI1– for Codec 1, respectively.
CNTL1_0: Speaker Mixer Control and Other Analog
Control — Codec 0
HPF_EN (R/W, 0): This bit can be set to 1 when the codec
is processing voice data. It is used to perform an additional
high–pass filtering step on the voice D/A path to remove frequencies below 0.005 * FS. (40 Hz @ 8 kHz, 60 Hz @
12 kHz, etc.)
IN_GAIN (1:0) (R/W, 0x0): These bits define a software
controlled gain on the input amplifier to the codec as defined
in Table 7.
Table 7. Input Signal Gain Control
IN_GAIN (1:0)
Signal Gain
00
0 dB
01
12 dB
10
24 dB
11
36 dB
SPK_Rx (1:0) and SPK_Tx (1:0) (R/W, 0x0): These register bits provide control to the analog mixer. The mixer combines four separate signal sources (AG0+, AO0+, AG1+, and
AO1+, which correspond to Rx0, Tx0, Rx1, and Tx1) and
provides a selection of four different amplification levels. The
combined and amplified signal is then fed into the speaker
driver. Two of these signal sources are from Codec 0 and the
other two are from Codec 1. The signal source from the output amplifier is unaffected when the speaker driver amplifier
is turned off or by the settings of these control bits.
See the Speaker Driver and Mixer section for more detail.
Each of the four channels (Rx0, Tx0, Rx1, and Tx1) can
provide one of the four attenuation levels to the signals that
source the analog mixer. Table 8 defines the levels for a given channel.
MC143416
12
Table 8. Multiplexed Signal Gain Control
SPK_Rx (1:0),
SPK T (1:0)
(1 0)
SPK_Tx
Gain
Rx
Effect on the Signal
Tx
Rx
Tx
00
0
0
01
1.5
0.5
Disconnected
10
3
1
9.5 dB
0 dB
11
6
2
15.6 dB
+ 6 dB
3.5 dB
– 6 dB
Note that it is possible to process more than one channel
at the same time; this feature provides some flexibility to the
user. Setting the amplification level of all the channels to zero
(0x0), has the effect of powering down the speaker driver/
multiplexer.
CNTL1_1: Speaker Mixer Control and Other Analog
Control — Codec 1
For Codec 1, refer to Speaker Mixer Control and Other
Analog Control — Codec 0. The speaker mixer control and
other analog control register address for Codec 1 is 0x3. Pins
AI0+, AI0–, AG0+, and AG0– for Codec 0 correspond to pins
AI1+, AI1–, AG1+, and AG1– for Codec 1, respectively.
CNTL2_0: OSR Clock Generation Control Register —
Codec 0
HSDIV (5:0) (R/W, 0x10): This field is used to program the
crystal frequency divide value that will determine the frequency of the oversampling converters. The reset value of
this register is 0x10 (16 decimal).See Clock Generation for
a detailed description of the generation of clocks inside this
device.
MCLK0_SEL (WO, 0): When set to 0, the clock generation
block is sourced by the signal applied to XTALin. When set to
1, the source of the clocking for Codec 0 is defined to be
MCLK0.
CNTL2_1: OSR Clock Generation Control Register —
Codec 1
For Codec 1, refer to OSR Clock Generation Control
Register — Codec 0. The OSR clock generation control register address for Codec 1 is 0x5. MCLK0 for Codec 0 corresponds to MCLK1 for Codec 1.
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CNTL3_0: Sampling Clock Generation Control Register
— Codec 0
LSDIV (6:0) (R/W, 0x33): This field is used to program the
sampling clock divide value. See Clock Generation for a detailed description of the generation of clocks inside this device. The reset value of 0x33 (decimal = 51 = 0.5 min OSR) is
the minimum value for this register. Any attempt to write a
lower value will result in writing 0x33.
CNTL3_1: Sampling Clock Generation Control Register
— Codec 1
For Codec 1, refer to Sampling Clock Generation Control Register — Codec 0. The sampling clock generation
control register address for Codec 1 is 0x7.
CNTL5: Control Register 5
This register is primarily reserved for test purposes and
should be left to its reset value, with the exception of the serial loop bit.
SELF_CHECK (2:0) (RO, 0): This field returns the results
of a self test which occurs 1 ms after a hardware or software
reset. Any bit other than zero indicates a failure has been detected.
TEST_MODE (1:0) (WO, 0): This bit is reserved for the
test and should be kept at 0 for functional operation.
SerialLoop (WO, 0): When set to 1, this bit enables a serial loop mode. In this mode, data samples received from the
serial port are retransmitted back to the serial output after a
processing delay. Control and register data behavior is unchanged.
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CNTL4: Control Register 4
SWRESET (WO, 1): When set to 1 this bit has the same
effect as a hardware reset to be applied to the chip. All control, data, and internal registers are reset, including the serial
port. This bit auto resets to zero to restore functional operation.
SSI_SEL (WO, 0): This bit is used to select the timing generation path for the SSI port when running a single SSI supporting two codecs. This bit is ignored when running in dual
SSI mode(SSIMS = 0). Value 0 selects timing from Codec 0,
while value 1 selects timing from Codec 1. The codec running the highest rate must be selected as the SSI timing driver to guarantee enough bandwidth for data sampling.
SYS_DIV (1:0) (WO, 0x2): These bits control the operating frequency of the system clock through a programmable
clock divider. The operating frequency has to be set to a
minimum of eight times the oversampling frequency of the
codec running the maximum OSR. The reset value for
SYS_DIV is 0x2, which results in a system clock divider of 2.
Refer to Clock Generation for a more detailed description.
Table 9. System Clock Divider
Setting
SYS_DIV (1:0)
MOTOROLA
Divide Ratio
00
1
01
3/2
10
2
11
3
CNTL6: Control Register 6
This register is reserved and the reset value should not be
changed.
CNTL7: Control Register 7
This register is reserved and the reset value should not be
changed.
SYNC: Control Register F
This register is not a functional register in the sense that it
is only used to guarantee/verify the framing on the serial interface. This is a mandatory requirement when running in
single serial mode to make sure that control/data and sample
frames are processed as such. For a more detailed description on the use of this register see Synchronization of the
Serial Ports.
Requests for synchronization are identified as reads or
writes performed to this register. This allows the internal
framing hardware to “lock” on to the bit stream sent by the
host.
A read to this register returns the value 0x55 when the internal state machine is synchronized to the incoming stream.
It returns either 0x00 or indeterminate if the internal hardware is not properly aligned to the incoming data. The write
value is ignored.
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SERIAL TIMING DESCRIPTION
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Synchronous Serial Interface Ports
Digital data and control information is transmitted and received through the Synchronous Serial Interface (SSI) ports.
The ports and their modes of operation can be configured by
hardware pins and software controls. This offers greater flexibility to accommodate different hosts, data formats, and data
lengths (size).
The MC143416 uses two synchronous serial interfaces.
These interfaces consist of four pins each: SCLK, STx, SRx,
and SSYNC. The timing relationship of these pins can be
seen in Figure 5. The output serial data is registered on the
rising edge of SCLK so that each input bit can be sampled on
the falling edge of SCLK. The SSIs can be operated in 24–bit
or 16–bit, Dual SSI or Single SSI, long frame or short frame.
The primary difference between these modes is the number
of frames per sampling period and the organization of the
words. The serial ports can be configured through three independent pins: SSIDS (data size), SSIFM (framing mode),
and SSIMS (mode select). These pins need to be permanently tied to either DGND or DVDD. The pins are global controls applied on both serial ports according to Table 10.
Table 10. SSI Configuration Pins
Pin
Level
SSIDS
0
24 Bits per Frame
1
16 Bits per Frame
0
Dual Serial Mode: Each codec is operated
from an independent serial interface. The
timing of each interface is dictated by the
associated codec timing.
1
Single Serial Mode: Utilizes only SSI0. The
timing of SSI0 is derived from the timing of
the faster of the two codecs. The faster
codec is defined by bit SSI_SEL in control
register 4.
0
Short Frame Mode
1
Long Frame Mode
SSIMS
SSIFM
Configuration
Data Size — 16–Bit Mode and 24–Bit Mode: The data
size can be selected by the state of the pin SSIDS. When the
pin is tied low, the 24–bit data format is effective. In 24–bit
operation, the control data and register data (bits 23:16) alternately precede the data sample (bits 15:0) in each frame.
See Figures 6 and 8. When this pin is set high, the serial data
format is adjusted to accommodate 16–bit data. In 16–bit operation, the control data and register data are coupled into
one frame, and the data sample is contained in a separate
frame. See Figures 7 and 9.The ordering of the data words
depends on whether the device is in Dual or Single SSI
mode.
Data Mode — Dual SSI Mode and Single SSI Mode:
The SSIMS pin is used to select either Dual SSI mode or
Single SSI mode. When SSIMS is low, the device operates in
Dual SSI mode, and when SSIMS is high, the device operates in Single SSI mode. In Dual SSI mode, each codec operates through an independent serial interface (Codec 0
operates through SSI0, and Codec 1 operates through
SSI1). The timing of each serial interface is directly related to
the timing of its associated codec (bit clock has the same frequency as the oversampling clock). In Single SSI mode, both
codecs operate from a single SSI interface (SSI0), and the
serial interface timing is dictated by the faster of the two codecs. When in this mode, the SRx1 input should be tied to
ground, and the SSI1 port is not functional.
Frame Mode — Long Frame Sync Mode and Short
Frame Sync Mode: This device is able to generate both
long and short framing signals depending on the state of the
pin SSIFM. When SSIFM is low, the device operates in Short
Frame mode, which is defined as a one–bit–wide clock pulse
occurring before the first bit of the data stream (MSB). When
SSIFM is high, the device operates in Long Frame mode. In
this mode, the framing pulse rises simultaneously with the
first data bit (MSB) and falls after the last data bit (LSB) has
been shifted out. The different framing modes are shown in
Figure 5.
SSYNC
(SHORT FRAME)
SSYNC
(LONG FRAME)
SCLK
HIGH-Z
MSB
LSB
HIGH-Z
MSB
STx
MSB
DATA IS SHIFTED ON THE RISING EDGE OF CLK
LSB
MSB
SRx
DATA IS SAMPLED INTERNALLY ON THE FALLING EDGE OF CLK
Figure 5. Serial Interface Timing
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14
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Serial Port Data Format
The serial port is used to transport three classes of data —
the control word, the register data, and the data sample. The
control word contains eight bits that are used for register addressing, validity, and synchronization. The register data
contains eight bits, one of which is a synchronization bit. The
data sample is composed of sixteen bits and contains the
data to and from the codec. The serial port data format varies
depending on which mode the device is operating in. Diagrams of each mode can be seen in Figures 6, 7, 8, and 9.
Figure 6 describes the data format for 24–Bit Dual SSI
mode. The STx channel control field of frame ‘N’ always
echoes the control field of the SRx channel with a delay
equal to the number of frames in one repetition sequence.
For 24–bit dual mode, this repetition is equal to two frames,
and the sampling period is one frame. A control word issued
in frame ‘N’ will be echoed in frame ‘N+2’. A data read requested through control channel at frame ‘N’ will therefore be
available in frame ‘N+3’. (Note: This only applies for 24–bit
dual mode.)
Figure 7 describes the data format for 16–Bit Dual SSI
mode. Note that the repetition sequence and the sampling
period in this mode are equal to two frames.
Figure 8 describes the data format for 24–Bit Single SSI
mode. Note that the control word and register data alternate
between frames, as well as the data for Codec 0 and Codec
1. The repetition sequence and the sampling period are
equal to two frames.
Figure 9 describes the data format for 16–Bit Single SSI
mode data. Note that the repetition sequence and the sampling period are equal to three frames.
Control Word
The control word consists of eight bits: V0, V1, AEN, RWB,
and A(3:0). Bits V0, V1, and A0 take on slightly different
meanings depending upon which mode the device is operating.
Control(7) = V0: This bit indicates the validity of the data
sample following the control byte. If it is set high, the subsequent data sample is valid. If it is set low, the subsequent
data sample is not valid. This bit will always read 0 when Codec 0 is powered down.
Single SSI Mode: This bit is primarily intended to support
Single SSI mode with codecs operating at different rates.
Since the timing for the serial interface is based on the faster
codec in this mode, there will be frames when the data
associated with the slower codec is not valid. During these
frames, this bit will be low to indicate the data is invalid.
Dual SSI Mode: In Dual SSI mode, the sample data will
always be valid as the serial interface is operating at the
same rate as the associated codec.
Control(6) = V1: This bit is used either as a synchronizing
bit (Dual SSI mode) or a data validity bit for Codec 1.
Single SSI Mode: In Single SSI mode, this bit acts as a
validity bit for the subsequent data sample of Codec 1. The
clocking is modified to generate two frames per sampling interval (three frames in 16–bit mode) and the data from both
codecs is time multiplexed onto two successive syncs as described in Figures 8 and 9. The sampling interval is defined
by the rate of the faster codec. This information is provided to
the chip through the SSI_SEL bit in register CNTL4. The validity bit in the control field may take a logic 0 or logic 1 value
depending on the operational rate of the associated codec.
Dual SSI Mode: In Dual SSI mode, this bit is always set to1
as an identifier for the control byte. If read as a 0, the device
will assume desynchronization and ignore the frame. See
Synchronization of the Serial Ports for additional information.
Control(5) = AEN (Access Enable): This bit acts like a
chip select. When set to logic 0, this bit prevents access to
the internal control registers. Bits 0 through 4 of the control
word and associated register data are ignored.
Control(4) = RWB: This bit indicates the access mode of
the register addressed by bits A(3:0). A logic 1 indicates
read, and a logic 0 indicates write.
Control(3:0) = A(3:0): This is the address of the register
for which access is requested. The bit A0 (LSB) is always
used in Single SSI mode and conditionally used in Dual SSI
mode.
Single SSI Mode: In Single SSI mode, A0 is always valid
and either codec can be accessed given the proper register
address.
Dual SSI Mode: In Dual SSI mode, information related to a
given codec must be transmitted or received through the
associated SSI port. For example, if information related to
Codec 0 is required, then it must be accessed through SSI
Port 0. This means that for the codec specific registers (addresses 0x0 through 0x7), the A0 bit must a zero for Codec
0, and a one for Codec 1. The other registers are global and
do not apply to a specific codec, so A0 should be used as
needed to access the desired register from either serial port.
Table 11. Bit Sequence
Mode
Repetition Sequence
Frames per FS
24–Bit Dual
[Control, Data Sample N] [Register Data, Data Sample N+1]
1
16–Bit Dual
[Control, Register Data] [Data Sample N]
2
24–Bit Single
[Control, Codec 0 Data Sample N] [Register Data, Codec 1 Data Sample N]
2
16–Bit Single
[Control, Register Data] [Codec 0 Data Sample N] [Codec 1 Data Sample N]
3
NOTE: The [ ] symbols represent one frame.
MOTOROLA
For More Information On This Product,
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MC143416
15
MC143416
16
Figure 6. Dual SSI 24–Bit Format
For More Information On This Product,
Go to: www.freescale.com
AEN
AEN
A3
A3
CONTROL
RWB
RWB
A2
A2
A1
A1
F
S
A0
A0
DEAD
BITS*
DATA
D0
D0
SAMPLE
D15
D15
BIT
SYNC
DTAG
DTAG
R6
R6
R4
R4
R3
R3
R2
R2
REGISTER DATA
R5
R5
R1
R1
R0
R0
DATA
N + 1
SAMPLE
D15
D15
V1
V1
AEN
AEN
A3
A3
CONTROL
RWB
RWB
A2
A2
A1
A1
A0
A0
DTAG
DTAG
R6
R6
R4
R4
R3
R3
R2
R2
REGISTER DATA
R5
R5
F
S
R1
R1
R0
R0
BIT
SYNC
D15
D15
D14
D14
D13
D13
D11
D11
D10
D10
DATA SAMPLE N
D12
D12
D9
D9
Example: For LSDIV = 51, OSR = 102, dead bits = (102 - 34) = 68.
D0
D0
D0
D0
* The number of dead bits per sampling period is equal to the OSR minus the valid bits and the sync bits (i.e., bits for control, register data, data sample, and sync).
BIT
V0
SRx
SYNC
V0
MSB
Example: For LSDIV = 51, OSR = 102, dead bits = (102 - 25) = 77.
STx
(SHORT)
SSYNC
SCLK
V1
V1
* The number of dead bits per sampling period is equal to the OSR minus the valid bits and the sync bits (i.e., bits for control, register data, data sample, and sync).
BIT
V0
SRx
SYNC
V0
STx
(SHORT)
SSYNC
SCLK
Freescale Semiconductor, Inc...
BITS*
DEAD
BITS*
DEAD
BIT
SYNC
BIT
SYNC
V1
V1
AEN
AEN
V1
V1
AEN
AEN
CONTROL
V0
V0
MSB
CONTROL
V0
V0
Freescale Semiconductor, Inc.
Figure 7. Dual SSI 16–Bit Format
MOTOROLA
MOTOROLA
Figure 8. Single SSI 24–Bit Format
For More Information On This Product,
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V0
SRx
SYNC
V0
A3
A3
CONTROL
RWB
RWB
A2
A2
A1
A1
A0
A0
D15
D15
CODEC 0
SAMPLE N
DATA
D14
D14
D0
D0
BIT
SYNC
F
S
DTAG
DTAG
R6
R6
R4
R4
R3
R3
R2
R2
REGISTER DATA
R5
R5
R1
R1
R0
R0
D15
D15
CODEC 1
SAMPLE N
DATA
D14
D14
V1
V1
AEN
AEN
A3
A3
CONTROL
RWB
RWB
A2
A2
A1
A1
A0
A0
DTAG
DTAG
R6
R6
R4
R4
R3
R3
R2
R2
REGISTER DATA
R5
R5
F
S
R1
R1
R0
R0
BIT
SYNC
D14
D14
CODEC 0
DATA SAMPLE
D15
D15
D0
D0
BIT
SYNC
D0
D0
D14
D14
CODEC 1
DATA SAMPLE
D15
D15
Example: For LSDIV = 51, OSR = 102, dead bits = (102 - 51) = 51.
* The number of dead bits per sampling period is equal to the OSR minus the valid bits and sync bits (i.e., bits for control, register data, data sample, and sync).
BIT
AEN
AEN
Example: For LSDIV = 51, OSR = 102, dead bits = (102 - 50) = 52.
STx
(SHORT)
SSYNC
SCLK
V1
V1
D0
D0
* The number of dead bits per sampling period is equal to the OSR minus the valid bits and the sync bits (i.e., bits for control, register data, data sample, and sync).
BIT
V0
SRx
SYNC
V0
STx
(SHORT)
SSYNC
SCLK
Freescale Semiconductor, Inc...
BITS*
DEAD
BITS*
DEAD
BIT
SYNC
BIT
SYNC
V1
V1
AEN
AEN
V0
V0
AEN
AEN
CONTROL
V1
V1
CONTROL
V0
V0
Freescale Semiconductor, Inc.
Figure 9. Single SSI 16–Bit Format
MC143416
17
Freescale Semiconductor, Inc.
4
SSYNC
(SHORT)
5
SSYNC
(LONG)
SCLK
1
Freescale Semiconductor, Inc...
Tx
Rx
3
2
Ref. No.
Characteristics
Min (ns)
Max (ns)
—
SCLK Period
250
—
—
SCLK Rise Time
0
10
—
SCLK Fall Time
0
10
1
Data Valid on Tx After Rising Edge of SCLK
0
50
2
Setup Time of Rx Before Falling Edge of SCLK
0
—
3
Hold Time of Rx After Falling Edge of SCLK
50
—
4
Data Valid on SSYNC (Short) After Rising Edge of SCLK
0
50
5
Data Valid on SSYNC (Long) After Rising Edge of SCLK
0
50
NOTE: Timing information based on using the XTAL input driving SYS clock and OSR clock @ 25 MHz.
Figure 10. Timing Characteristics
Register Data
The MSB of the register data is called the ‘DTAG’ bit and
must be set to logic 0 as a frame identifier. If read as a 1, the
device will assume desynchronization and ignore the frame.
See Synchronization of the Serial Ports for additional information. The remaining bits of this word are used to contain
the register data.
Synchronization of the Serial Ports
Although serial port master, special internal hardware will
slave the MC143416 framing sequence to the host processor
incoming stream of data based on the known value of bits V1
(logic 1) and DTAG (logic 0). These bits alone are not enough
to guarantee correct frame identification because the register
value and/or the data sample may imitate the pattern created
by those bits. Moreover, in Single SSI mode, only DTAG
(MSB of register data) is available. The internal state ma-
MC143416
18
chine will shift the framing identification every time the value
of the above–mentioned bits are violated, thus performing a
resync on the next frame. If the sample(s) imitate the control
and/or the register data in Single SSI mode, locking cannot
be performed securely. To protect against false locking, the
host processor should perform a minimum of two accesses
to the SYNC register in Single SSI 24–bit mode and three accesses in Single SSI 16–bit mode. Typically, the host will perform two write accesses to the SYNC register, followed by a
read. A read value of 0x55 indicates that the internal state
machine has locked on the incoming frame and full operation
can begin. The internal state machine, if “unlocked”, will use
the register address and AEN bit as locking information. Any
value other than 0x55 read from the sync register indicates
the internal state machine is not ready to perform register access. Note that once synchronized, the timing of the Rx
channel (host to MC143416) is mapped onto the Tx channel
(MC143416 to host).
For More Information On This Product,
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MOTOROLA
Freescale Semiconductor, Inc.
ANALOG DESCRIPTION
Codec Structure
Freescale Semiconductor, Inc...
The digital–to–analog (D/A) section is independent of the
analog–to–digital (A/D) modulator section although it receives the same clocking controls. There are six package
pins that externally interact with each codec. The analog section of one codec is represented in Figure 11.
The D/A takes a sampling clock and a one–bit modulated
stream into a switched–capacitor low–pass filter that uses a
temperature stable reference in the D/A conversion. The
bandwidth for this filter is:
f3dB = fOSR / 58.74
Then a second order lowpass Butterworth smoothing filter
follows. This filter has a cutoff frequency of 64 kHz and a Q of
1.0; the overall D/A filtering is that of a third order filter. The
D/A converter ends with a unity gain line driver that is able to
drive the telephone line. The complete D/A path is differential, except for the output amplifier which is pseudo–differential. This amplifier could be dc–coupled to an analog modem
hybrid circuit using the transmitter pair AO+ and AO– pins.
The A/D modulator has an input amplifier that can be used
to complete the hybrid circuit; a low–to–moderate gain (up to
20 dB) can be obtained from this amplifier using the four receiver stage pins: AI–, AI+, AG+, and AG–. In addition, this
input amplifier is used in a stage that provides four software
controlled gain steps (0, 12, 24, and 36 dB). The overall amplifier is kept with a constant unity gain frequency regardless
of the particular gain settings; this helps to maintain the overall amplifier bandwidth defined by the external components
attached to the AI+, AI–, AG+, and AG– pins. The input stage
amplifier has an internal 2 pF feedback capacitor to provide
high frequency roll–off above 500 kHz. The anti–aliasing filter
(AAF) is a replica of the smoothing filter of the D/A section. It
is recommended that the input amplifier portion of the application be designed with a low–pass filter with a f3db of
64 kHz. This will result in an overall effect of a three–pole
system. After the AAF, a second order sigma–delta modula-
tor completes the A/D converter section. This modulator is
based on a switched–capacitor approach, which uses a temperature–stable voltage reference and is able to accept a
dither frequency to eliminate low frequency tone generation.
The complete A/D section is fully differential.
Frequency Response
The overall bandpass width of the MC143416 is defined as
0.425 * FS, where FS is the sampling frequency. For example, at a sample rate of 8 ks/s, the bandwidth is 0.425 * 8000
= 3400 kHz. At 16 ks/s, the bandwidth increases to 0.425 *
16000 = 6800 kHz.
The high–pass filter option, which is used in voice processing to reduce dc and 60 Hz levels, is actually a notch filter
with a zero at 0.005 * FS.
Speaker Driver and Multiplexer
An analog output to drive a low level speaker is provided
though a four–channel mixer. Signals may come from both
input (Rx) and output (Tx) paths according to Figure 12.
The output driver is able to deliver 15 mW of power into a
small 32 Ω speaker for a 1.1 Vrms signal from the Tx paths
(equivalent to the output level at the phone line). The circuit
performs a current summation at the inputs of a differential
power amplifier to emulate the action of a signal mixer. Setting the amplification level of all the channels to 0x0 has the
effect of powering down the power amplifier, thus reducing
software overhead.
The external speaker can be dc–coupled to the pair of pins
SPK+ and SPK–, using a resistor in series to, and a bypass
capacitor in parallel to, the speaker. The values of these external components are a function of the particular speaker.
The capacitor is used to reduce the impedance of the speaker circuit at high frequencies one decade above the voice
bandwidth. Typical values are 0.1 µF.
Note that no special hardware is included to guarantee immunity to switching noise when modifying the gain setting of
the different channels.
AGA/D
MODULATED
SINGLE BIT
SIGMA-DELTA
MODULATOR
AAF
SOFTWARE
CONTROLLED
GAIN
+
AI+
-
AIAG+
D/A
MODULATED
SINGLE BIT
ANALOG D/A LP FILTER
1ST ORDER
SMOOTHING FILTER
2ND ORDER
+
AO+
-
AO-
Figure 11. Codec Structure
MOTOROLA
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MC143416
19
Freescale Semiconductor, Inc...
Freescale Semiconductor, Inc.
AG0
SOFTWARE
CONTROLLED
ATTENUATION
Rx0
AO0
SOFTWARE
CONTROLLED
ATTENUATION
Tx0
AG1
SOFTWARE
CONTROLLED
ATTENUATION
Rx1
AO1
SOFTWARE
CONTROLLED
ATTENUATION
Tx1
+
SPKM
-
SPKP
Figure 12. Speaker Mixer
MC143416
20
For More Information On This Product,
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MOTOROLA
Freescale Semiconductor, Inc.
LAYOUT CONSIDERATIONS
Freescale Semiconductor, Inc...
Printed Circuit Board Layout Considerations
The MC143416 is manufactured using high–speed CMOS
VLSI technology to implement the complex analog signal
processing functions of a PCM Codec–Filter. The fully–differential analog circuit design techniques used for this device
result in superior performance for the switched capacitor filters, the analog–to–digital converter (ADC) and the digital–
to–analog converter (DAC). Special attention was given to
the design of this device to reduce the sensitivities of noise,
including power supply rejection and susceptibility to radio
frequency noise.
This device was designed for ease of implementation, but
due to the large dynamic range and the noisy nature of the
environment for this device (digital switches, radio telephones, DSP front–end, etc.), special care must be taken to
assure optimum analog transmission performance.
PC Board Mounting
It is recommended that the device be soldered to the PC
board for optimum noise performance. If the device is to be
used in a socket, it should be placed in a low parasitic pin
inductance (generally, low–profile) socket.
Power Supply, Ground, and Noise Considerations
This device is intended to be used in switching applications which often require plugging the PC board into a rack
with power applied. This is known as “hot–rack insertion”. In
these applications, care should be taken to limit the voltage
on any pin from going positive of the VDD pins, or negative of
the GND pins. One method is to extend the ground and power contacts of the PCB connector. The device has input
protection on all pins and may source or sink a limited
amount of current without damage. Current limiting may be
accomplished by series resistors between the signal pins
and the connector contacts.
The most important considerations for PCB layout deal
with noise. This includes noise on the power supply, noise
generated by the digital circuitry on the device, and cross–
coupling digital or radio frequency signals into the audio signals of this device. The best way to prevent noise is to:
• Keep digital signals as far away from audio signals as
possible.
• Keep radio frequency signals as far away from the audio
signals as possible.
• Use short, low inductance traces for the audio circuitry to
reduce inductive, capacitive, and radio frequency noise
sensitivities.
MOTOROLA
• Use short, low inductance traces for digital and RF
circuitry to reduce inductive, capacitive, and radio
frequency radiated noise.
• Bypass capacitors should be connected from DVDD to
DGND, and VAGREF and VAG to AGND with minimal
trace length. Ceramic monolithic capacitors of about 0.1
µF are acceptable for the DVDD and VAGREF pins to
decouple the device from its own noise. The DVDD
capacitor helps supply the instantaneous currents of the
digital circuitry in addition to decoupling the noise which
may be generated by other sections of the device or
other circuitry on the power supply. The VAGREF
decoupling capacitor is effecting a low–pass filter to
isolate the mid–supply voltage from the power supply
noise generated on–chip, as well as external to the
device. The VAG decoupling capacitor should be about
0.01 µF. This helps to reduce the impedance of the VAG
pin to AGND at frequencies above the bandwidth of the
VAG generator, which reduces the susceptibility to RF
noise.
• Use a short, wide, low inductance trace to connect the
DGND ground pin to the power supply ground. The
DGND pin is the digital ground and the most negative
power supply pin for the analog circuitry. All analog
signal processing is referenced to the VAG pin, but
because digital and RF circuitry will probably be powered
by this same ground, care must be taken to minimize
high frequency noise in the AGND trace. Depending on
the application, a double–sided PCB with a ground plane
connecting all of the digital and analog GND pins
together would be a good grounding method. A
multilayer PC board with a ground plane connecting all
of the digital and analog GND pins together would be the
optimal ground configuration. These methods will result
in the lowest resistance and the lowest inductance in the
ground circuit. This is important to reduce voltage spikes
in the ground circuit resulting from the high–speed digital
current spikes. The magnitude of digitally–induced
voltage spikes may be hundreds of times larger than the
analog signal the device is required to digitize.
• Use a short, wide, low inductance trace to connect the
VDD power supply pin to the 5 V power supply.
Depending on the application, a double–sided PCB with
VDD bypass capacitors to the ground plane, as described
above, may complete the low impedance coupling for the
power supply. For a multilayer PC board with a power
plane, connecting all of the VDD pins to the power plane
would be the optimal power distribution method. The
integrated circuit layout and packaging considerations for
the 5 V VDD power circuit are essentially the same as for
the ground circuit.
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MC143416
21
Freescale Semiconductor, Inc.
APPLICATIONS
The MC143416 is used in several Motorola modem reference design kits. More detailed documentation describing
these kits is available from your local Motorola distributor or
semiconductor sales office, or through a Motorola Literature
Distribution Center.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
Document Title
Order Number
MC143450RDK External/Embedded Modem Reference Design Kit Product Preview
MC143450RDKPP/D
MC143450RDK External/Embedded Modem Reference Design Kit User’s Manual
MC143450RDKUM/D*
MC143452RDK ISA Controller–less Modem Reference Design Kit Product Preview
MC143452RDKPP/D
MC143452RDK ISA Controller–less Modem Reference Design Kit User’s Manual
MC143452RDKUM/D*
MC143455RDK PCI Controller–less Modem Reference Design Kit Product Preview
MC143455RDKPP/D
MC143455RDK PCI Controller–less Modem Reference Design Kit User’s Manual
MC143455RDKUM/D*
Freescale Semiconductor, Inc...
*Call the CTAS Division Service Center for details. U.S. phone 1–800–422–6323.
MC143416
22
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
PB SUFFIX
TQFP (THIN QUAD FLAT PACKAGE)
CASE 824D–01
L
–T–, –U–, –Z–
–Z–
44
34
11
T-U
S
AE
DETAIL AA
M
0.20 (0.008)
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
F
PLATING
J
23
12
G
V
Z
0.05 (0.002)
0.20 (0.008)
DETAIL AA
AE
AC
Z
S
T-U
S
Z
B
L
AB
–U–
M
Freescale Semiconductor, Inc...
–T–
S
33
1
22
BASE METAL
N
D
0.20 (0.008)
A
0.20 (0.008)
0.05 (0.002)
AB
M
T-U
S
Z
S
T-U
S
Z
S
T-U
Z
S
S
SECTION AE–AE
T-U
S
0.20 (0.008)
AC
M
M
NOTES:
AC
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS -T-, -U- AND -Z- TO BE DETERMINED AT
DATUM PLANE -AB-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
M
DETAIL AD
SEATING PLANE -AC-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
C
–AB–
E
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -AB-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
0.10 (0.004)
–AC–
H
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
Y
R
K
W
Q
X
VIEW AD
MOTOROLA
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
For More Information On This Product,
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DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
Q
R
S
V
W
X
Y
MILLIMETERS
MIN
MAX
INCHES
MIN
MAX
9.950
10.050
0.392
0.396
9.950
10.050
0.392
0.396
1.400
1.600
0.055
0.063
0.300
0.450
0.012
0.018
1.350
1.450
0.053
0.057
0.300
0.400
0.012
0.016
0.800 BSC
0.031 BSC
0.050
0.150
0.002
0.006
0.090
0.200
0.004
0.008
0.450
0.550
0.018
8.000 BSC
_
12
0.090
_
_
REF
12
0.160
1
0.022
0.315 BSC
5
_
0.004
_
REF
0.006
1
5
_
0.100
0.200
0.004
0.008
11.900
12.100
0.469
0.476
11.900
12.100
0.469
0.476
0.200 REF
0.008 REF
1.000 REF
0.039 REF
_
12
REF
_
12
REF
MC143416
23
Freescale Semiconductor, Inc...
Freescale Semiconductor, Inc.
Home Page:
www.freescale.com
email:
[email protected]
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
(800) 521-6274
480-768-2130
[email protected]
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
[email protected]
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku
Tokyo 153-0064, Japan
0120 191014
+81 2666 8080
[email protected]
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate,
Tai Po, N.T., Hong Kong
+800 2666 8080
[email protected]
For Literature Requests Only:
Freescale Semiconductor
Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
(800) 441-2447
303-675-2140
Fax: 303-675-2150
LDCForFreescaleSemiconductor
@hibbertgroup.com
Home Page:
www.freescale.com
email:
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MC143416
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MC143416/D