FREESCALE MCZ33730EK/R2

Freescale Semiconductor
Advance Information
Document Number: MC33730
Rev. 6.0, 2/2010
Switch Mode Power Supply with
Multiple Linear Regulators
33730
The 33730 is a multiple output power supply integrated circuit for
automotive applications. The integrated circuit (IC) incorporates a
switching regulator, which operates over a wide input voltage range
from 4.5 to 26.5 V.
The step-down switching regulator uses a fixed frequency PWM
voltage mode control. It has a 3.5 A current limit (typical) and the slewrate is adjustable via a control pin to reduce switching noise. The
switching regulator has an adjustable frequency oscillator, which
allows the user to optimize its operation over a wide range of input
voltages and component values.
The linear regulators can be configured either as two normal mode
regulators (VDD3, VDDL) and one standby regulator (VKAM), or as one
normal mode linear regulator (VDDL) and two standby regulators (VKAM
and VDD3 Standby). Two protected outputs [VREF (1, 2)] are used to
provide power to external sensors.
SWITCHING POWER SUPPLY
EK SUFFIX (PB-FREE)
98ARL10543D
32-LEAD SOICW-EP
Features
• Provides all regulated voltages for Freescale 32-bit
ORDERING INFORMATION
microcontroller family
• Adjustable frequency switching buck regulator with slew-rate
Temperature
Package
Device
control
Range (TA)
• Power sequencing provided
MCZ33730EK/R2
- 40°C to 125°C
32-SOICW-EP
• Programmable voltages VDDL, VDD3 - 3% accuracy
• Programmable standby regulator VKAM - 15% accuracy,
operating down to 4.5 V at the KA_VBAT pin
• VDD3 can be programmed as an optional second standby regulator with 15% accuracy
• Provides two 5.0 V protected supplies for sensors
• Provides reverse battery protection FET gate drive
• Provides necessary MCU monitoring and fail-safe support
• Pb-free packaging designated by suffix code EK
33730
+
+
VBAT
PFD
KA_VBAT
VIGN
IGN_ON
5.0 V
+
BOOT
SW
+
VDDH
INV
VCOMP
VDD3_B
VDD3
5.0 V
3.3 V
VREF1,2
P1
P2
P3
CP
MCU
VDDL_B
VDDL
VKAM
GND
HRT
(32 Bit)
1.5 V
5.0V
KA_1.0 V
RSTs
REGON
Figure 1. 33730 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2009 - 2010. All rights reserved.
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VBAT
VBAT
SW
UVLO
/OVLO
SW
Feed
Forward
Ramp
Generator
Protection
FET
Drive
BOOT
Control Logic
VKAM
15 mA, ILIM,
TLIM
SR
+
–
CP
PFD
HS Drive
Level
Shifter
CP
Buck
KA_VBAT
VKAM
FREQ
Oscillator
10.4 K
Charge
Pump
+
–
REG ON
–
+
INV
1.98 K
VBG
VCOMP
VIGN
Enable
IGN_ON
VDDH
VDD3
T-lim
VREF1
VREF2
5.0 V
ILIM=15 0mA
26.5 V,-1V,TLIM
5.0 V
Standby
Control
Bandgap
Preference
P2
P3
Block
VDD3_B
VDD3_SBY
I
Lim, TLim
VDD3
VDDL
I
ILIM=150 mA
Ref. Voltage
Programming
Lim, TLim
VBG
Lim
26.5 V,-1V,TLIM
P1
I
VDDL_B
VDDL
VKAM, VDDL, VDD3,
VDD3_SBY
Reference Voltage
RSTKAM
VKAM
Reset Detect
RSTH
VDDH
Reset Detect
RST3
VDD3
Reset Detect
RSTL
VDDL
Reset Detect
HRT
HR Timer
GND
Figure 2. 33730 Simplified Internal Block Diagram
33730
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
HRT
RSTKAM
RSTH
RSTL
RST3
VREF2
VDDL
VDDH
VDDL_B
VREF1
REGON
IGN_ON
VCOMP
INV
FREQ
P1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
P3
VIGN
GND
VDD3_B
VDD3
VKAM
CP
KA_VBAT
VBAT
VBAT
SW
SW
SR
BOOT
PFD
P2
Note: The exposed pad is electrically and thermally connected to the IC ground.
Figure 3. 33730 Pin Connections
Table 1. 33730 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 11.
Pin Number
Pin Name
Pin Function
Formal Name
Definition
1
HRT
Analog
Output
2
RSTKAM
Open Drain
VKAM Reset
This pin is an open drain reset output, monitoring the VKAM supply to the
microprocessor.
3
RSTH
Open Drain
VDDH Reset
This pin is an open drain reset output, monitoring the VDDH regulator.
4
RSTL
Open Drain
VDDL Reset
This pin is an open drain reset output, monitoring the VDDL regulator.
5
RST3
Open Drain
VDD3 Reset
This pin is an open drain reset output, monitoring the VDD3 regulator.
6
VREF2
Power Output
VREF Output 2
This pin is the output of the protected supply VREF2. The pin is supplied
from the VDDH through the protection FET.
7
VDDL
Analog Input
VDDL Regulator
This pin is the VDDL regulator output feedback pin.
8
VDDH
Analog/
Power Input
VDDH Regulator
This pin is the 5.0 V output feedback pin of the buck regulator. The pin is
also a power input for the protected outputs VREF1,2.
9
VDDL_B
Analog
Output
VDDL Regulator Base
Drive
10
VREF1
Power Output
VREF Output 1
11
REGON
Logic Input
Regulator Hold On
12
IGN_ON
Open Drain
VIGN Status
13
VCOMP
Analog
Output
Compensation
This pin provides switching pre-regulator compensation, it is the output of
the error amplifier.
14
INV
Analog Input
Inverting Input
Inverting input of the switching regulator error amplifier.
15
FREQ
16
P1
Hardware Reset Timer This pin is the hardware reset timer programmed with an external resistor.
VDDL linear regulator base drive.
This pin is the output of the protected supply VREF1. The pin is supplied
from the VDDH through the protection FET.
Regulator Hold On input pin (5.0 V logic level input).
This open drain output signals the status of the VIGN pin.
Analog Input Frequency Adjustment Frequency adjustment of the switching regulator. The value of the resistor
to ground at this pin determines the oscillator frequency.
Logic Input
Programming Pin 1
Programming pin 1 for the VDD3, VDDL, and VKAM reference voltages.
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
Table 1. 33730 Pin Definitions(continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on page 11.
Pin Number
Pin Name
Pin Function
Formal Name
Definition
17
P2
Logic Input
Programming Pin 2
18
PFD
Analog
Output
Protection FET Drive
19
BOOT
Analog Input
Bootstrap
This pin is connected to the bootstrap capacitor.
20
SR
Analog Input
Slew-rate
Slew-rate Control of the switching regulator.
21,22
SW
Power Output
Switch Node
23,24
VBAT
Power Input
Battery Voltage
Supply
25
KA_VBAT
Power Input
Keep Alive Supply
26
CP
Analog
Output
Charge Pump
27
VKAM
Power Output
Keep Alive Memory
28
VDD3
Analog Input VDD3 Linear Regulator
Programming pin 2 for the VDD3, VDDL, VKAM reference voltages.
Reverse battery protection FET gate drive.
These pins are the source of the internal power switch (N-channel
MOSFET).
Voltage supply to the IC (external reverse battery protection needed in
some applications).
This pin is the keep alive supply input.
External capacitor reservoir of the internal charge pump.
Keep-Alive Memory (standby) supply output.
This is a VDD3 regulator output feedback pin.
This pin is also the output of the VDD3 standby regulator.
This pin can be used also as an additional standby regulator without the
external pass transistor.
29
VDD3_B
Analog
Output
VDD3 Linear
Regulator Base Drive
30
GND
Ground
Ground
31
VIGN
Analog Input
Voltage Ignition
This pin is the ignition switch control input pin. It contains an internal
protection diode.
32
P3
Logic Input
Programming Pin 3
Programming pin 3 for the VDD3, VDDL, and VKAM reference voltages.
This pin is a ground.
33730
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VBAT
- 0.3 to +40
V
KA_VBAT
- 18 to +40
V
- 18 to +40
V
VBOOT
- 0.3 to +50
V
VBOOT - VSW
- 0.3 to +12
V
Charge Pump Output Voltage (CP)
VCP
- 0.3 to +12
V
Switch Node Voltage SW
VSW
- 2.0 to +40
V
Sensor Supplies (VREF1, VREF2)
VREF
- 1.0 to +26.5
V
VREFMAXSR
2.0
V/µs
Regulator Voltages (VDDH,VDD3, VDD3_B, VDDL,VDDL_B, VKAM)
VREG
- 0.3 to +7.0
V
Open Drain Outputs (RSTH, RSTL, RST3, RSTKAM, IGN_ON)
VDD
- 0.3 to +7.0
V
VREGON
-0.3 to +7.0
V
VIN
- 0.3 to + 3.0
V
Supply Voltage (VBAT)
Keep-Alive Supply Voltage (KA_VBAT)
Control Inputs (VIGN, P1, P2, P3), PFD Output
Bootstrap Voltage (BOOT, SR) referenced to ground
Bootstrap Voltage (BOOT, SR) referenced to SW
Sensor Supplies (VREF1, VREF2) Maximum Slew Rate
Regon Input
Analog Inputs (VCOMP, INV, FREQ, HRT)
ESD Voltage
(1)
VESD
V
Human Body Model - HBM (all pins except BOOT, VDDL, RSTL)
± 2000
Human Body Model - HBM (Pins BOOT, VDDL, RSTL)
± 1500
Machine Model - MM (all pins)
± 200
Charge Device Model - CDM (all pins)
±750
Operational Package Temperature (Ambient Temperature)
Storage Temperature
Peak Package Reflow Temperature During
Maximum Junction Temperature
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to
(4)
Case(5)
Reflow(2), (3)
TA_MAX
- 40 to + 125
°C
TSTO
- 65 to + 150
°C
TPPRT
Note 3
°C
TJ_MAX
150
°C
RθJ-A
41
°C/W
RθJ-C
1.2
°C/W
Notes
1. ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2), the Machine Model (MM) (AEC-Q100-003),
RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (AEC-Q100-011).
2.
3.
4.
5.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Thermal resistance measured in accordance with EIA/JESD51-2.
Theoretical thermal resistance from the die junction to the exposed pad.
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
RECOMMENDED OPERATING CONDITIONS
RECOMMENDED OPERATING CONDITIONS
Table 3. Recommended Operating Conditions
All voltages are with respect to ground unless otherwise noted.
Parameter
Value
Unit
*6.0 to 26.5
V
Switching Regulator Output Current (IVDDH) total, VBAT = 6.0 to 26.5 V
0 to 2.0
A
VDD3 Standby Output Current
0 to 15
mA
VKAM Standby Output Current
0 to 15
mA
VREF1,2 Output Current
0 to 100
mA
100 to 500
kHz
Supply Voltages (VBAT, KA_VBAT)
Switching Frequency Range
* Tracks battery voltage from 6.0 down to 4.5 V.
33730
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristic
Characteristics noted under conditions 6.0 V ≤ KA_VBAT = VBAT ≤ 26.5 V, - 40°C ≤ TA ≤ 125°C using the typical application circuit,
unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VKAM_STUP
4.5
—
—
V
VSTUP
4.5
—
—
V
VSHDN_R
35
—
42
VUVLO_F
3.6
—
4.3
VUVLO_R
3.7
—
4.4
VUVLO_HYS
—
0.1
—
—
—
500
GENERAL
Keep-Alive Start-up Voltage (at the KA_VBAT pin), VKAM Output Up
Start-up Voltage (at the KA_VBAT pin), VDD3, VDD3 standby, VDDL Up
Over-voltage Shutdown
V
Voltage at KA_VBAT pin rising
Under-voltage Lock-out
V
Voltage at KA_VBAT pin falling
Voltage at KA_VBAT pin rising
(6)
Under-voltage Lock-out Hysteresis
Sleep Quiescent Current (Sleep mode)
IQ
VIGN = 0 V, REGON = 0 V, IVKAM = 0 mA, VDD3 OFF, VBAT = 14.0 V,
µA
KA_VBAT = 14 V (P1=1, P2=1, P3=1)
SWITCHING REGULATOR (VDDH)
Buck Converter Output Voltage
VDDH
V
VBAT = 6.0 to 26.5 V, ILOAD = 100 mA
4.9
5.0
5.1
VBAT = 26.5 to 35 V, ILOAD = 100 mA
4.85
5.0
5.15
Switching Regulator Current Limit (see Figure 5)
Pulse-by-Pulse Current Limit
Extreme Current Limit (see Figure 5)(6)
SW Drain Source On
Resistance(6)
A
ILIM_SW
-2.25
-3.5
-4.25
ILIM_SW_EX
-3.75
-4.5
-6.00
—
—
200
TSH
—
—
195
TSL
155
—
—
TSHYS
1.0
—
20
RDS(ON)
ID = 500 mA, VBAT = 5.0 V
Thermal Shutdown Junction Temperature(6)
Thermal Shutdown Hysteresis(6)
mΩ
°C
°C
VDD3 LINEAR REGULATOR
VDD3 Output Voltage (Includes Line and Load Regulation)
VDD3
IVDD3 = 0 to -500 mA, See Table 1 for VDD3 Output Settings
%
-3.0
—
3.0
—
1.1
1.5
KA_VBAT = 14 V, VBAT = 14 V
-20
—
-50
KA_VBAT = 5.0 V, VBAT = 5.0 V
-20
—
-50
VDD3 Dropout Voltage (VDDH - VDD3)
VDD3_DO
IVDD3 = -800 mA (VDD3 set to 3.3 V via P1, P2, P3 and with an
external transistor)
VDD3_B Current Limit, VDD3_B = 0 V,
V
IVDD3B_Lim
mA
Notes
6. Guaranteed By Design.
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristic(continued)
Characteristics noted under conditions 6.0 V ≤ KA_VBAT = VBAT ≤ 26.5 V, - 40°C ≤ TA ≤ 125°C using the typical application circuit,
unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
-15
—
15
—
—
1.4
Unit
VDD3 STANDBY LINEAR REGULATOR
VDD3 Standby Output Voltage (Includes Line and Load Regulation)
VDD3_SBY
IVDD3_SBY = 0 to -15 mA, See Table 1 for VDD3_SBY Output Setting
VDD3 Dropout Voltage (KA_VBAT - VDD3) Standby Mode
VDD3_DO
(VDD3 set at 3.3 V via P1, P2, P3) IVDD3 = -10 mA
VDD3 Standby Current Limit, VDD3 = 0 V
%
V
IVDD3SBY_LIM
mA
KA_VBAT = 14 V, VBAT = 14 V
-20
—
-50
KA_VBAT = 5.0 V, VBAT = 5.0 V
-20
—
-50
TSH
—
—
190
TSL
150
—
—
TSHYS
5.0
—
20
-3.0
—
3.0
—
—
280
KA_VBAT = 14 V, VBAT = 14 V
-18
—
-50
KA_VBAT = 5.0 V, VBAT = 5.0 V
-18
—
-50
-15
—
15
Thermal Shutdown Junction
Temperature(7)
Thermal Shutdown Hysteresis(7)
°C
°C
VDDL LINEAR REGULATOR
VDDL Output Voltage (Includes Line and Load Regulation)
VDDL
IVDDL = 0 to -500 mA, See Table 1 for VDDL Output Setting
VDDL_B Dropout Voltage (VDDH - VDDL)
VDDL_DO
%
mV
(VDDL set at 3.3 V via P1, P2, P3) IVDDL = -800 mA
VDDL_B Current Limit, VDDL = 0 V
IVDDL_LIM
mA
VKAM STANDBY LINEAR REGULATOR
VKAM Output Voltage (Includes Line and Load Regulation)
VKAM
IVKAM = 0 to -15 mA, See Table 1 for VKAM Output Setting
VKAM Dropout Voltage (KA_VBAT - VKAM)
%
VKAM_DO
IVKAM = -10 mA, VKAM set to 5.0 V (P1 = L, P2 = H, P3 = L)
V
—
—
1.4
VKAM STANDBY LINEAR REGULATOR (CONTINUED)
VKAM Current Limit, VKAM = 0 V
IVKAM_LIM
mA
KA_VBAT = 14 V, VBAT = 14 V
-20
—
-50
KA_VBAT = 5.0 V, VBAT = 5.0 V
-20
—
-50
TSH
—
—
190
TSL
150
—
—
TSHYS
5.0
—
20
Thermal Shutdown Junction Temperature
Thermal Shutdown Hysteresis(7)
(7)
°C
°C
Notes
7. Guaranteed By Design.
33730
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristic(continued)
Characteristics noted under conditions 6.0 V ≤ KA_VBAT = VBAT ≤ 26.5 V, - 40°C ≤ TA ≤ 125°C using the typical application circuit,
unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
RDS(ON)
—
—
500
mΩ
IREF_LIM
-150
-280
-450
mA
IREF_REVLIM
—
—
40
mA
IREF_REVLIM
-2.0
—
—
mA
TSH
—
—
190
°C
TSL
150
—
—
TSHYS
5.0
—
20
°C
VIGN_IH
4.0
4.3
4.6
V
VIGN_IL
2.0
2.15
2.4
VIGN-HYS
1.7
—
—
SENSOR SUPPLIES VREF1, VREF2
VREF On-resistance, IVREF = -100 mA
VREF Current Limit, VREF = -1.0 V
(8)
VREF Reverse Current Limit, VREF = 26.5 V
(8)
VREF Leakage Current, VREF Shut Down, VREF = -1.0
Thermal Shutdown Junction Temperature
V(8)
(9)
Thermal Shutdown Hysteresis(9)
SUPERVISORY AND CONTROL CIRCUITS
VIGN Input Voltage Threshold
VBAT = 14.0 V, KA_VBAT = 14 V
VIGN Hysteresis
VIGN Pull-down Current @ 5.0 V
IPD
VBAT = 14.0 V, KA_VBAT = 14 V
REGON Input Voltage Threshold
V
µA
10
30
60
VIH
1.7
—
—
VBAT = 14.0V, Battery Voltage = 14V
VIL
-0.3
—
1.0
REGON Input Voltage Threshold Hysteresis
V
VIHYS
0.1
0.3
0.4
V
REGON Pull-down Current @ 3.0 V
IPD
5.0
—
30
µA
Programming Pin Input Voltage Threshold
VIH
2.5
—
VBAT
V
VIL
-0.3
—
1.0
IPD
—
1.0
5.0
µA
VDDH Reset Upper Threshold Voltage (ΔVDDH/VDDH)
4.0
8.0
13.0
%
VDDH Reset Lower Threshold Voltage (ΔVDDH/VDDH)
-3.0
-8.0
-13.0
%
VDDL Reset Lower Threshold Voltage (ΔVDDL /VDDL)
-3.0
-8.0
-13.0
%
VDD3 Reset Lower Threshold Voltage (ΔVDD3 /VDD3)
-3.0
-8.0
-13.0
%
-3.0
-12.5
-30
-3.0
-12.5
-30
—
—
0.4
—
—
0.4
VBAT = KA_VBAT = 14 V
Programming P1, P2, P3 Leakage Current @ 14.0 V
VDD3_SBY Reset Lower Threshold Voltage
(ΔVDD3_SBY /VDD3_SBY)
VKAM Reset Lower Threshold Voltage (ΔVKAM /VkAM)
%
RSTH, RSTL, RST3, RSTKAM Low-level Output Voltage
IOL = 5.0 mA
V
IGN_ON Low-level Output Voltage
IOL = 5.0 mA
%
V
Notes
8. The short circuit transient events on the VREF outputs must be limited to the voltage levels specified in the Maximum Ratings and slew
rates of less than 2.0 V/µs, otherwise damage to the part may occur. Refer to the paragraph Sensor Supplies (VREF1, VREF2) on page
17 and typical application circuit diagrams on Figure 8,and Figure 9 for recommended VREF output termination.
9. Guaranteed by design.
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 6.0 V ≤ KA_VBAT = VBAT ≤ 26.5 V, - 40°C ≤ TA ≤ 125°C using the typical application
circuit, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
0
—
68
8.0
—
12
ms
GENERAL
Power On Reset Delay Time (HR Timer) (see Table 7)
tD_POR
(Time to RESET up after Regulator in regulation)
Power On Reset Delay Time (HR Timer) Accuracy (33 k resistor)
ms
(10)
tLD_P
—
500
—
µs
Oscillator Frequency (Switching Freq.) Range - Adjustable (Figure 4)
Freq
100
—
500
kHz
Oscillator Frequency Tolerance at 100 kHz (FREQ Pin Open)
fTOL
90
—
110
kHz
Programming Pin Latching Delay
SWITCHING REGULATOR
SW Node Rise Time, VBAT = KA_VBAT = 14 V, ISW = 500
mA(10)
tSW_R
V/ns
SR pin shorted to SW pin
—
0.96
—
SR pin open
—
1.82
—
SR pin shorted to BOOT pin
—
2.38
—
SR pin shorted to SW pin
—
0.83
—
SR pin open
—
0.83
—
SR pin shorted to BOOT pin
—
0.83
—
SW Node Fall Time, VBAT = KA_VBAT = 14 V, ISW = 500
mA(10)
tSW_F
V/ns
Notes
10. Guaranteed by design.
33730
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33730 multi-output power supply integrated circuit
addresses the system power supply needs for applications
using the Freescale 32-bit microcontroller family architecture.
FUNCTIONAL PIN DESCRIPTION
HARDWARE RESET TIMER (HRT)
VDDL REGULATOR BASE DRIVE (VDDL_B)
This pin is the hardware reset timer input, which provides
delays for the Reset outputs. This delay is programmed by an
external resistor to GND.
VDDL linear regulator base drive. This output supplies
current into the base of the regulator external pass NPN
transistor.
VKAM RESET (RSTKAM)
VREF OUTPUT 1 (VREF1)
This pin is an open drain reset output monitoring the VKAM
supply to the microprocessor. This output is actively pulled
low when the VKAM output voltage falls below its reset
threshold level.
This pin is output of the protected supply VREF1. This
output supplies sensors outside of the electronic control
module and therefore it is protected against short battery and
short to -1.0 V. This pin is supplied from the VDDH through the
internal protection FET.
VDDH RESET (RSTH)
This pin is an open drain reset output monitoring the
VDDH regulator. This output is actively pulled low when the
VDDH output voltage falls below its reset lower threshold
level or when the VDDH output voltage exceeds its reset
upper threshold level
VDDL RESET (RSTL)
This pin is an open drain reset output monitoring the VDDL
regulator. This output is actively pulled low when the VDDL
output voltage falls below its reset threshold level.
VDD3 RESET (RST3)
This pin is an open drain reset output monitoring the VDD3
regulator. This output is actively pulled low when the VDD3
output voltage falls below its reset threshold level.
VREF OUTPUT 2 (VREF2)
This pin is output of the protected supply VREF2. This
output supplies sensors outside of the electronic control
module and therefore it is protected against a battery short
and short to -1.0 V. This pin is supplied from the VDDH
through the internal protection FET.
VDDL REGULATOR (VDDL)
This pin is the VDDL regulator output feedback pin. The
emitter of VDDL regulator external NPN pass transistor is
connected to this pin.
VDDH REGULATOR (VDDH)
This pin is the 5.0 V output feedback pin of the buck
regulator. This pin is also a power input for the protected
outputs VREF1 and VREF2.
REGULATOR HOLD ON (REGON)
Regulator Hold On input control pin. The 33730 can be
enabled or kept in the Normal operational mode by holding
this pin high. This is a 5.0 V logic input.
VIGN STATUS (IGN_ON)
This open drain output signals the status of the VIGN pin.
This logic output is actively pulled low when the VIGN control
input is pulled high.
COMPENSATION (VCOMP)
This pin provides switching pre-regulator compensation
network. It is the output of the switching regulator error
amplifier.
INVERTING INPUT (INV)
This pin is the inverting input of the switching regulator
error amplifier.
FREQUENCY ADJUSTMENT (FREQ)
This is the frequency adjustment input of the switching
regulator. The operating frequency of the switching regulator
can be programmed by an external resistor from this pin to
ground.
PROGRAMMING PIN 1 (P1)
Programming Pin 1 for the VDD3, VDDL, and VKAM
reference voltage. The output voltage of the VDD3, VDDL
and VKAM regulators can be programmed by the P1, P2, and
P3 pins (see Table 6).
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
PROGRAMMING PIN 2 (P2)
KEEP ALIVE SUPPLY (KA_VBAT)
Programming Pin 2 for the VDD3, VDDL, and VKAM
reference voltage. The output voltage of the VDD3, VDDL
and VKAM regulators can be programmed by the P1, P2, and
P3 pins (see Table 6).
This pin is the keep alive supply input. This input is reverse
battery protected. This input supplies power to the internal
supply and bias circuits that have to do with this VKAM and
other always-on supplies.
PROGRAMMING PIN 3 (P3)
CHARGE PUMP (CP)
Programming Pin 3 for the VDD3, VDDL, and VKAM
reference voltages. The output voltage of the VDD3, VDDL
and VKAM regulators can be programmed by the P1, P2, and
P3 pins (see Table 6).
External reservoir capacitor of the internal charge pump.
This charge pump provides the voltage needed to sufficiently
enhance the gates of the internal n-channel mosfets (VREF1,
VREF2, and VDDH) during the low battery condition.
PROTECTION FET DRIVE (PFD)
KEEP ALIVE MEMORY (VKAM)
Reverse battery protection FET gate drive. This pin is an
output drive for the gate of the external Reverse Battery
Protection N-channel FET.
Keep Alive Memory (standby) supply output. This output
supplies power for the module Keep-Alive memory. This
output is always on, if the voltage at the KA_VBAT pin is
above 4.5 V.
BOOTSTRAP (BOOT)
This pin is connected to the bootstrap capacitor. It
provides the supply power for the switching regulator highside drive.
SLEW-RATE (SR)
Slew-rate Control of the switching regulator. The slew-rate
of the switching regulator can be adjusted by connecting this
pin to switch node (SW pin, slow slew-rate selection), BOOT
pin (fast slew-rate selection), or it can be left open (medium
slew-rate selection).
SWITCH NODE (SW)
This pin is the source of the switching regulator internal
power switch (N-channel MOSFET source).
VDD3 LINEAR REGULATOR (VDD3)
This is a VDD3 regulator output feedback pin.The emitter
of VDD3 regulator external NPN pass transitory is connected
to this pin.
This pin can programmed to be the output of the VDD3
Standby regulator (see Table 6).
VDD3 LINEAR REGULATOR BASE DRIVE
(VDD3_B)
This pin can be used also as an additional standby
regulator without the external pass transistor.This output
supplies current into the base of the regulator external pass
NPN transistor.
GROUND (GND)
BATTERY VOLTAGE SUPPLY (VBAT)
Voltage supply to the IC (external reverse battery
protection is recommended).
This pin is the ground pin of the integrated circuit.
VOLTAGE IGNITION (VIGN)
This pin is the turn-on control input that is controlled
through an ignition switch. This pin is reverse battery
protected.
33730
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
MC33730 - Functional Block Diagram
Output Functions
Input Functions
Voltage Programmming Input
Protection FET Driver
5 Volt Buck Switching
Regulator
Ignition Input
5 Volt Protected Outputs
(VREF1, VREF2)
Internal Functions
Linear Regulator Outputs
(VDDL, VDD3, VKAM)
Band Gap Reference
Sleep/Wake Circuitry
Oscillator
5.0 VOLT BUCK REGULATOR
This is the main regulator that supplies 5.0 Volts to the
following protected and regulated outputs, VREF1, VREF2,
VDD3, and VDDL.
OSCILLATOR
This is the frequency source for the switching (buck) 5 Volt
regulator. The frequency of oscillation is selected by an
external resistor to ground.
BAND GAP REFERENCE
This is the main voltage reference, which is used as the
standard for all the current and voltage sources in the
MC33730.
PROTECTION FET DRIVER
The protection FET is used to prevent reverse battery
connections from damaging the MC33730. The gate drive for
the Protection FET is provided by this driver circuit.
Ignition Driver
Reset Circuitry
output signal to indicate that the ignition switch has been
activated.
VREF1
This output is one of two protected 5.0 volt outputs that can
be used to supply external sensors or other analog circuits
requiring a regulated, short-circuit protected 5.0 volt supply.
VREF2
This output is one of two protected 5.0 volt outputs that can
be used to supply external sensors or other analog circuits
requiring a regulated, short-circuit protected 5.0 volt supply.
VDD3 REGULATOR
This is one of three, voltage programmable, regulated
supplies. This supply is controlled by the ignition switch.
VDDL REGULATOR
This is one of three, voltage programmable, regulated
supplies. This supply is controlled by the ignition switch.
SLEEP/WAKE CIRCUITRY
This circuitry is responsible for the two main modes of
operation for the MC33730, Sleep mode and Wake mode. In
the Sleep mode, only the keep alive outputs are active, and
the rest of the circuitry is in a low power drawing sleep state.
In the Wake mode, the MC33730 is fully functional and
normal current is being consumed.
IGNITION DRIVER
This block of circuitry controls all the voltage outputs,
except for the keep alive voltage output(s). It also provides an
VKAM
This is one of three, voltage programmable, regulated
supplies. This supply is NOT controlled by the ignition switch.
VOLTAGE PROGRAMMING
P1, P2, and P3 are three logic level inputs that control the
voltage that is available on the VDD3, VDDL and VKAM
outputs.
Table 6 indicates the 8 different combinations of P1, P2,
and P3 and the resultant voltage values.
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
RESET CIRCUITRY
REGON INPUT
There are four open drain reset lines that indicate the
status of the four voltage outputs; VDDH, VDDL, VDD3, and
VKAM. They are labeled: RSTH, RSTL, RST3, and
RSTKAM.
This input is OR’d with VIGN. However, it is a 5.0 volt logic
input, as opposed to VIGN, which is a VBAT level input. This
input is controlled by an MCU I/O pin, to hold power up when
the ignition switch is turned off, so housekeeping functions
can be performed before power is shut off, by lowering the
REGON line. IF REGON is not needed, it should be tied to
GND.
33730
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATION DESCRIPTION
FUNCTIONAL DEVICE OPERATION
OPERATION DESCRIPTION
The 33730 has two supply inputs. The KA_VBAT pin is the
supply input for the standby regulators VKAM (and optionally
VDD3_SBY, see Table 6) and for the internal supply circuits.
The VBAT pin is the power input of the integrated buck
regulator, which steps-down the protected battery voltage
providing directly the 5.0 V system supply VDDH. VDDH
provides power for the main linear regulator(s) VDDL, VDD3,
and also for the other module circuits requiring 5.0 V supply
voltage (e.g. protected VREF1,2 outputs).
If the supply voltage ramps from zero volts up to its
nominal level, the 33730 will start at the latest when the
supply (battery) voltage reaches VSTUP at the KA_VBAT pin.
If the supply voltage ramps down, the 33730 will keep
operating (with degradation of the output voltage regulation)
down to VUVLO_f at the KA_VBAT pin. The VKAM output stays
operational down to VUVLO_f at the KA_VBAT pin.
The 33730 will operate in systems with and without
standby mode. In the Standby (sleep) mode of operation the
IC will draw maximum IQ quiescent current, assuming only
the VKAM is used as a standby output, and it is unloaded.
When VDD3 is used as an additional standby output the
quiescent current increases by approximately another
100 μA.
POWER UP
The 33730 will safely power up when the power is applied
simultaneously (hot plugged) or in the random sequence to
the KA_VBAT, VBAT and VIGN (or REGON) inputs.
POWER DOWN
The 33730 will safely power down when the power is
disconnected from any of the KA_VBAT, VBAT inputs or
when control signals the VIGN or REGON inputs go low.
UNDERVOLTAGE LOCK-OUT (UVLO)
There is an under-voltage lock-out feature implemented
into the IC. When the battery voltage at the KA_VBAT pin
falls below VUVLO_f the under-voltage comparator initiates the
power down sequence for the whole IC. The under-voltage
lock-out circuit has a VUVLO_hys hysteresis and 5.0 μs glitch
filter in order to prevent spurious tripping its threshold level
and consequent system oscillations between the ON and
OFF states.
SWITCHING REGULATOR
The 33730 switching regulator is a fixed frequency
(externally adjustable) PWM voltage mode controller with
integrated low-RDS(ON) N-channel power MOSFET. This
architecture is widely flexible and provides a possibility to
optimize its operation over a wide range of input voltages.
The 33730 switching regulator provide the following features:
Adjustable Switching Frequency
The adjustable frequency feature provides the ability to
modify the switcher performance for optimized cost (higher
frequency, smaller, cheaper components), or higher
efficiency and better EMC performance (lower switching
frequency for reduced losses and EMI). The operating
frequency of the switching regulator can be adjusted by
means of an external resistor RF connected from the FREQ
pin to ground (see Figure 4).
Frequency vs RFreq
600
Switching Frequency [kHz]
INTRODUCTION
500
400
300
200
100
0
0
20
40
60
80
100
RFreq [kohm ]
FSW ≅ 18.48 + (5098.7/RFREQ)
FSW is the switch frequency in kHz
RFREQ is the resistor value in kOhms
Figure 4. Switching Regulator Frequency vs. RFreq Value
Adjustable Slew-rate
The adjustable slew-rate option allows, with selection of
the right switching frequency, optimization of the system for
EMC performance.
Over-voltage Lock-Out (Shutdown)
The over-voltage lock-out (shutdown) feature turns the
switching regulator off when the input voltage exceeds the
VSHDN_r limit. This extends the 33730 capability to survive
the severe load dump conditions up to max VBAT.
Operation at 100% Duty Cycle
The internal charge pump is used to enhance the power
MOSFET gate when the switching regulator reaches 100%
duty cycle during the low battery conditions.
The switching regulator output voltage VDDH is regulated
to provide 5.0 V @ 2.0 A with ±2% accuracy and it is intended
to directly power the digital and analog circuits of the
Electronic Control Module (ECM). The switching regulator
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
FUNCTIONAL DEVICE OPERATION
OPERATION DESCRIPTION
output current is also used by the following linear regulators
VDD3_3, VDDL, and sensor supplies VREF1, and VREF2.
The direct voltage conversion to VDDH = 5.0 V together
with the Protection FET Driver circuit allows operation of the
IC at very low battery voltages, which would otherwise
require to use a boost regulator (with an additional system
cost) or a different and more expensive switching converter
topology (e.g. flyback).
LINEAR REGULATORS
Short Circuit Protection
The switching regulator is protected against the overcurrent and short-circuit conditions. It integrates a current
limit circuit, which has two threshold levels - the pulse by
pulse, and the extreme.
Pulse by Pulse Current Limit
Pulse-by-Pulse Current Limit threshold has a nominal
value set ILIM_SW. When the current flowing through switching
regulator power FET exceeds this value the power FET is
immediately turned off. During the next switching cycle the
power FET is turned on again until it is commanded off by its
natural duty cycle or until the current reaches the threshold
level again. It should be noted that the current limit is blanked
for several tens of nanoseconds during the turn-on and turnoff transition times in order to prevent erroneous turn off due
to the current spikes caused by switcher parasitic
components.
Extreme Current Limit.
In some cases, during the over-current or short-circuit
condition, the inductor current does not sufficiently decay
during the off time of the switching period. The current rise
during the current limit blanking time is higher than the decay
during the off time. In this case the current in the inductor
builds up every consecutive switching cycle. In order to
prevent the power FET failure during this condition an
extreme current limit has been implemented. When the
current flowing through the power FET reaches the
ILIM_SW_Ext threshold, the switching regulator will shut off for
500 μs, before the switching regulator is allowed to turn on
again (see Figure 5).
Ex t.
I
4.5A Lim
I
Lim
3.5A
Inductor
Cu rrent
tBLANK
0
TSW
Soft Start
The switching regulator has an integrated soft-start
feature. During the soft-start sequence the duty cycle of the
internal power switch will be gradually increased from low
value to the regulation level. This technique prevents any
undesirable inrush current into the buck regulator output
capacitor.
500us d elay
Switcher
FET Gate
Figure 5. 33730 Current Limit
TSW
The 33730 integrates two linear regulator control circuits
VDD3 (programmable), VDDL (programmable) both capable of
driving up to 15 mA (min.) base current into the external pass
NPN transistors. The output voltage of both linear regulators
is monitored at their feedback pins (VDD3 and VDDL). If the
voltage at any of the VDD3, VDDL feedback pins fall below their
regulation level, the supervisory Reset control circuits will
assert the corresponding reset signal (RSTL, and/or RST3
lines will be pulled low). See Table 6 for the output voltage
selection details.
The linear regulators will stay in regulation down to 4.5 V
at the KA_VBAT pin.
The 33730 linear regulators offer high flexibility and
variability of the module design in terms of selectable output
voltages as well as wide range of output current capability.
There several types of suitable external pass NPN transistors
which could be used. The choice of the particular type
depends mostly on the expected power dissipation of the
pass transistor. The following parts provide good solution and
have been bench tested with the 33730:
BCP68T1 (SOT-223)
NJD2873T4 (DPAK)
MJB44H11 (D2PAK)
Available from ON Semiconductor.
NOTE: The 33730 linear regulators have been designed to
use low ESR ceramic output capacitors - see Figure 8 and
Figure 9 for the recommended values.
STANDBY REGULATORS
The 33730 integrates two standby linear regulators, the
VKAM and the optional standby regulator VDD3 (see Figure 9)
for the optional standby circuit).The output voltage levels of
both standby linear regulators are programmable and
supervised by the Reset control circuits (RSTKAM, and/or
RST3). Both the VKAM and VDD3 outputs are capable of
delivering IVKAM_LIM and IVDD3_LIM of load current. See
Table 6 for the VKAM and VDD3 standby output voltage
selection details.
The VKAM standby regulator will keep functioning even
below VUVLO_f but the specified drop out voltage may not be
maintained.
NOTE: The 33730 standby regulators have been designed
to use low ESR ceramic output capacitors - see Figure 8 and
Figure 9 for recommended values.
33730
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATION DESCRIPTION
PROGRAMMING LINEAR REGULATOR OUTPUT
VOLTAGE
The output voltage of the VDD3, VDDL and VKAM outputs
can be externally programmed by placing logic levels on the
programming pins P1, P2, and P3 (see Table 6). This
extends the application flexibility of the IC without having to
use an external resistor divider, thus improving the regulator
accuracy over the whole temperature range, and reducing
the component count.
The status of the programming pin can be selected either
by tying the pin to ground (logic level “0”). The logic level “1”
can be selected either by tying the programming pin up (the
programming pin can be tied up to the battery voltage) or by
leaving the pin open.
The programming information is read and latched with the
500 μs delay after the power is applied to the IC.
Table 6. Programming VDD3, VDDL, VKAM Output
Voltage
P1
P2
P3
VDD3
VDDL
VKAM
High
High
High
3.3 V
2.6 V
2.6 V
High
High
Low
3.3 V
3.3 V
3.3 V
High
Low
High
3.3 V
1.5 V
1.0 V
High
Low
Low
3.3 V
3.3 V
1.0 V
Low
High
High
3.3 V Standby
3.3 V
1.0 V
Low
High
Low
2.0 V
3.15 V
5.0 V
Low
Low
High
2.6 V Standby
3.3 V
1.0 V
Low
Low
Low
2.6 V Standby
3.3 V
1.5 V
The Programming Pins can be tied high to battery voltage
POWER SEQUENCING (VDDH, VDD3, VDDL)
VDDH, VDD3, and VDDL are power sequenced by means of
internal pull-down FETs. During the power up sequence,
VDD3 and VDDL will follow VDDH.
During the power down sequence the VDD3 and VDDL
outputs will be pulled down by the internal pull-down power
FETs, and VDDH will be shut off with a defined delay (~100 μs
typ.).
In order to engage the power down sequence, the
following conditions have to be met:
(VIGN . REGON) + UVLO = Power Down
The VDD3 output is not power sequenced when used as a
standby regulator.
SENSOR SUPPLIES (VREF1, VREF2)
There are two sensor supplies, VREF1 and VREF2,
integrated into the IC. They are internally connected to VDDH
through power MOSFETs which protect against short to
battery and short to ground conditions.
Severe fault conditions on the VREF1 and VREF2 outputs,
like shorts to either ground or battery, will not disrupt the
operation of the main regulator VDDH, or cause assertion of
any Reset signal.
IMPORTANT NOTE:
The VREF outputs MUST be externally protected against
transient voltage events with slew rates faster than
2.0 V/μs, otherwise damage to the part may occur. A
practical and inexpensive solution consists of using a series
RC network connected from the VREF output to ground (see
Figures 8 and 9 for typical component values). Other means,
such as a single electrolytic capacitor with its capacitance
value C > 10 μF, may be also used.
LOW BATTERY OPERATION
PROTECTION FET DRIVE (PFD)
When the battery voltage falls below the specified
minimum value, the 33730 switching regulator will enter a
100% duty cycle mode of operation and its output voltage
VDDH will follow the decreasing battery voltage. If the battery
voltage continues to fall, the VDDH voltage reaches its reset
threshold level, and the RSTH signal will be pulled low, but
the other linear regulators will continue to operate, and their
monitoring signals stay high as long as the VDDH provides
sufficient headroom for the regulators to stay in their
regulation limits (see Figure 6 and Figure 7). If the battery
voltage continues to fall, the linear regulators would not have
sufficient headroom to stay in regulation, and their resets
would be asserted (RSTL, RST3, or both would be pulled
low). At that moment the power down sequence would be
engaged.
The VKAM standby regulator will operate down to (VKAM and
VKAM_DO) and VKAM-DO at the KA_VBAT pin.
The Protection FET Drive circuit allows using an optional
N-channel protection MOSFET (instead of a standard
reverse protection diode) to protect against a reverse battery
voltage condition. This approach improves the operating
capabilities at very low battery voltages.
An internal charge pump is used to enhance the
Protection FET gate during nominal and low battery
conditions. The charge pump will be enabled at the startup
voltage. When the battery voltage gets sufficiently high, the
Protection FET is turned off and the integrated circuit power
input (VBAT pins) are supplied through the body diode of the
Protection FET.
Use of the Protection FET is not necessary in systems
already using a protection diode, relay or when no reverse
battery protection is required.
CONTROL INPUT (VIGN)
The VIGN pin is used as a control input to the IC. The
regulation circuits will function and draw current from VBAT
when VIGN is high (active) or when the REGON pin is high.
The VIGN pin has a VIHN-IH power-up threshold VIGN-IL typical
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
FUNCTIONAL DEVICE OPERATION
OPERATION DESCRIPTION
power-down threshold) and VIGN-HYS (minimum) of
hysteresis. VIGN is designed to operate up to max VBAT
battery while providing reverse battery and max VBAT load
dump protection.
REGON
The REGON feature permits the microcontroller to select
a delayed shutdown of the 33730. It holds off the activation of
the reset signals to the microcontroller after the VIGN signal
has transitioned. This allows the microcontroller to control the
power up and power down of the main regulator outputs
except for the standby supplies. The REGON pin input
threshold voltages allow control by the standard 2.5 V (up to
5.0 V) logic ICs.
HARDWARE RESETS (RSTL, RST3, RSTH, and
RSTKAM)
The RSTKAM control circuit monitors the VKAM output. If
the VKAM output is out of regulation (low), the device will
assert the RSTH signal low.
All Reset monitoring circuits have a 20 μs delay filter to
avoid unintended resets caused by noise glitches on the
regulator output lines.
HR TIMER
The HR (Hardware Reset) Timer provides the delay
between the time when the particular regulator output voltage
is in regulation and the release of the Reset signal. This delay
can be programmed by a single external resistor. This
solution provides better accuracy than the commonly used
external RC timer. The HR Timer delay can be programmed
in eight 8ms steps from 0 to 56 ms (see Table 7)
.
Table 7. HR Timer Delay Programming
The Hardware Resets are open drain, active low outputs
capable of sinking 5.0 mA current and able to withstand
+7.0 V.
The RSTL control circuit monitors the VDDL output. If the
VDDL output is out of regulation (low), the device will assert
the RSTL signal low.
The RST3 control circuit monitors the VDD3 output. If the
VDD3 output is out of regulation (low), the device will assert
the RST3 signal low.
The RSTH control circuit monitors the VDDH output. If the
VDDH output is out of regulation (low or high), the device will
assert the RSTH signal low.
Programming Resistor
Value RHRT [ohms]
Delay (typ.) [ms]
68 k
0
33 k
10
16 k
19
8.2 k
29
3.9 k
39
2.0 k
48
1.0 k
58
470
68
VDDH = 5.0 V
4.5V
V DDL = VDD3 = 3.3V
Battery
Voltage
V
KAM
= 1. 0V
POR Delay
RSTKAM
RST L, RST 3
RSTH
POR Delay
POR Delay
Figure 6. Battery Voltage Ramp Up
33730
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
VDDH
out of
regulation
B att ery
Voltage
V DD3,
V DDL
out of
regulat ion
100us
V DDH
turned
off
VDDH = 5. 0 V
VDDL = V DD3 = 3. 3V
VDD3, V DDL
act ively
pulled low
4.5V
3.0V
V
= 1.0V
KA M
RS TKA M
RS TL, RS T3
RSTH
Figure 7. Battery Voltage Ramp Down
OPERATIONAL MODES
The 33730 can operate in the two modes: Low quiescent
current Sleep mode and Normal mode of operation.
SLEEP MODE
The 33730 operates in the Sleep mode when both the
VIGN pin and the REGON pins are pulled low. Both of these
pins have internal pull-downs, which assures that the IC is in
this defined state when those pins are left open.
When the IC enters the Sleep mode, all major functions
are disabled except for the Standby regulators. The KeepAlive regulator VKAM stays always operational (see Table 6).
If this output stays unloaded, the IC in the Sleep mode
consumes very low quiescent current (IQ).
If the VDD3 output was programmed as a VDD3 Standby
regulator (see Table 6), it too stays operational during the
Sleep mode, as well as the VKAM regulator. In this case, the
IC consumes about 100 μA of additional quiescent current
(assuming both VKAM and VDD3 Standby outputs are
unloaded).
NOTE: In the Sleep mode, the RSTKAM and RST3 are not
active and their outputs (as well as the outputs of RSTL and
RSTH) are in the high-impedance state.
NORMAL MODE
The 33730 enters the Normal mode of operation when
either the VIGN pin or the REGON pin is pulled high. In this
case the IC is fully operational with all regulator outputs ready
to supply power and all control, monitoring and protection
features activated.
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
TYPICAL APPLICATIONS
OPERATIONAL MODES
TYPICAL APPLICATIONS
Battery
10nF
Optional
Protection FET
3.3uH
VBAT
100uF
1.0uF
VBAT
Feed
Forward
Ramp
Generator
UVLO
/OVLO
KA_VBAT
SW
FREQ
Oscillator
CP
Buck
VKAM
1.0 V
4.7uF
10nF
CP
PFD
REGON
5.1k
HS Drive,
Level
Shifter
VKAM
15 mA,I Lim,
TLim
VDDH
= 5.0= V
VDDH
5.0V
@
mA(11)
@2000
2000mA
total
100uF
SS26
BOOT
RFreq
SR
Control Logic
10nF
1.0uF
22uH
SW
Feedback Compensation Network
10.4
20k k
CP
Protection
FET
Drive
5.0k k
1.98
V BG
Charge
Pump
1.5nF
INV
k(12)
20-60 20k
2.2nF
VCOMP
430R
56pF
2.2-4.7 μF(12)
VIGN
VREF1
5.0 V
1.5R
5.0 V
1.5R
1.0uF
P1
P2
4 x 5.1k
Standby
Control
5.0 V,
I Lim=150 mA
26.5V,-1V,TLim
VREF2
P3
Ref. Voltage
Programming
Block
VDD3
ILim,TLim
T-lim
5.0 V,
ILim=150 mA
26.5V,-1V,TLim
1.0uF
VDDH
Enable
IGN_ON
Band-Gap
Reference
VDD3_SBY
ILim,TLim
V BG
VKAM, VDDL, VDD3,
VDD3_SBY
Ref. Voltage
RSTKAM
RSTH
Q2
VDD3_B
3.3 V
VDD3
4.7uF
VDDL
10nF
Q1
1.5 V
I Lim
VDDL
10uF
10nF
HRT
HR Timer
RHRT
Reset Detect
VDD3
Reset Detect
RSTL
100nF
VDDL_B
VKAM
Reset Detect
V DDH
RST3
10nF
GND
Recommended Q1, Q2:
BCP68T1 (SOT-223)
NJD2873T4 (DPAK)
MJB44H11 (D2PAK)
V DDL
Reset Detect
Notes
11. The VDDH total current includes the sum of all output currents of the IC.
12. Higher resistance (60 k) and higher capacitance (4.7μF) in the compensation network will reduce the VDDH overshoot.
Compensation network values should be optimized for specific circuit applications.
Figure 8. 33730 Typical Application Circuit
Table 8. Programming Output Voltage (BOLD denotes selected combinations)
P1
P2
P3
VDD3
VDDL
VKAM
High
High
High
3.3 V
2.6 V
2.6 V
High
High
Low
3.3 V
3.3 V
3.3 V
High
Low
High
3.3 V
1.5 V
1.0 V
High
Low
Low
3.3 V
3.3 V
1.0 V
Low
High
High
3.3 V Standby
3.3 V
1.0 V
Low
High
Low
2.0 V
3.15 V
5.0 V
Low
Low
High
2.6 V Standby
3.3 V
1.0 V
Low
Low
Low
2.6 V Standby
3.3 V
1.5 V
33730
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
TYPICAL APPLICATIONS
OPERATIONAL MODES
Battery
10nF
Optional
Protection FET
3.3uH
VBAT
VBAT
100uF
1.0uF
UVLO
/OVLO
KA_VBAT
Feed
Forward
Ramp
Generator
SW
FREQ
Osc illator
CP
Buck
1.0 V
VKAM
4.7uF
10nF
CP
PFD
REGON
5.1k
1.5R
1.0uF
VREF2
1.5R
1.0uF
P1
P2
4 x 5.1k
Feedback Compens ation Network
10.4
20k k
CP
Protection
FET
Drive
1.98
5.0k k
V BG
Charge
Pump
1.5nF
INV
k(14)
20-60 20k
56pF
2.2nF
VCOMP
430R
2.2-4.7 μF(14)
VIGN
VREF1
5.0 V
RFreq
SR
VKAM
15 mA,I Lim,
TLim
P3
VDDH
Enable
IGN_ON
5.0 V
100uF
SS26
BOOT
Control Logic
10nF
1.0uF
HS Drive,
Level
Shifter
VDDH
= 5.0
V
VDDH
= 5.0V
@ 2000mA
2000 mA(13)
@
total
22uH
SW
Standby
Control
5.0 V,
I Lim =150 mA
26.5V,-1V,TLim
Ref. Voltage
Programming
Block
RSTKAM
VDD3
ILim,TLim
T-lim
5.0 V,
ILim=150 mA
26.5V,-1V,TLim
Band-Gap
Reference
VDD3_SBY
ILim,TLim
V BG
VKAM, VDDL, VDD3,
VDD3_SBY
3.3 V Standby
VDD3
4.7uF
10nF
VDDL_B
VDDL
Q1
1.5 V
I Lim
VDDL
10uF
VKAM
Reset Detect
10nF
HRT
HR Timer
V DDH
RHRT
Reset Detect
VDD3
Reset Detect
RSTL
100nF
VDD3_B
Ref. Voltage
RSTH
RST3
10nF
GND
V DDL
Reset Detect
Recommended Q1, Q2:
BCP68T1 (SOT-223)
NJD2873T4 (DPAK)
MJB44H11 (D2PAK)
Notes
13. The VDDH total current includes the sum of all output currents of the IC.
14. Higher resistance (60 k) and higher capacitance (4.7μF) in the compensation network will reduce the VDDH overshoot.
Compensation network values should be optimized for specific circuit applications.
Figure 9. 33730 Typical Application, VDD3 Standby Output @ 15 mA
Table 9. Programming Output Voltage (BOLD denotes selected combinations)'
P1
P2
P3
VDD3
VDDL
VKAM
High
High
High
3.3V
2.6V
2.6V
High
High
Low
3.3V
3.3V
3.3V
High
Low
High
3.3V
1.5V
1.0V
High
Low
Low
3.3V
3.3V
1.0V
Low
High
High
3.3 V Standby
3.3 V
1.0 V
Low
High
Low
2.0 V
3.15 V
5.0 V
Low
Low
High
2.6 V Standby
3.3 V
1.0 V
Low
Low
Low
2.6 V Standby
3.3 V
1.5 V
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
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33730
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
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PACKAGE DIMENSIONS (Continued)
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33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
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PACKAGING
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33730
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
REVISION HISTORY
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
5.0
2/2009
•
Initial Release
6.0
2/2010
•
•
•
•
•
•
•
•
Updated resistors on the INV pin (page 2, 20, 21)
Clarified REGON pin operation (page 3, 9, 11, 14)
Added sensor supply max. slew rate (page 5,17)
Clarified POR delay section with updated typical values (page 10,18)
Modified the SW rise and fall time to V/ns (page 10)
Provided a switching frequency equation (page 15)
Updated the recommended compensation network values (page 20,21)
Made format layout corrections
33730
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
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MC33730
Rev. 6.0
2/2010