MPC94551 Rev 3, 2/2005 Freescale Semiconductor Technical Data Low Voltage 1:4 CMOS Clock Buffer MPC94551 The MPC94551 is a CMOS 1:4 fanout buffer. The MPC94551 is ideal for applications requiring lower voltage. Features • • • • • • • • 1:4 CMOS fanout buffer 300 ps output to output skew I/O frequency up to 160 MHz operation Non-inverting output clock 3.3 V supply voltage Output Enable mode tri-states outputs -40°C to 85°C industrial temperature range Standard 8-lead SOIC package 1:4 LVCMOS CLOCK BUFFER D SUFFIX 8-LEAD SOIC PACKAGE CASE 751-06 EF SUFFIX 8-LEAD SOIC PACKAGE Pb-FREE PACKAGE CASE 751-06 ORDERING INFORMATION Device Package MPC94551D SO-8 MPC94551DR2 SO-8 MPC94551EF SO-8 (Pb-FREE) MPC94551EFR2 SO-8 (Pb-FREE) Q1 Q2 ICLK ICLK 1 8 OE Q1 2 7 VDD Q2 3 6 GND Q3 4 5 Q4 Q3 Q4 OE Figure 1. Logic Diagram © Freescale Semiconductor, Inc., 2005. All rights reserved. Figure 2. Pin Assignment Table 1. Pin Description Pin Number Pin Name Pin Type Pin Description 1 ICLK Input 2 Q1 Output Clock output(1) 3 Q2 Output Clock output(1) 4 Q3 Output Clock output(1) 5 Q4 Output Clock output(1) 6 GND Power Connect to ground(2) 7 VDD Power Connect to 3.3 V(2) 8 OE Input Clock input, internal pull-up resistor Output enable, tri-states outputs when low, internal pull-up resistor 1. A 33 Ω series terminating resistor may be used on each clock output if the trace is longer than 1 inch. 2. A decoupling capacitor of 0.01 µF should be connected between VDD on pin 7 and GND on pin 6, as close to the device as possible. Table 2. Absolute Maximum Ratings(1) Parameter Rating Unit 3.9 V Power Supply Voltage, VDD –0.5 to VDD +0.5 V Ambient Operating Temperature All Inputs and Outputs –40 to +85 °C Storage Temperature –65 to +150 °C Junction Temperature 175 °C Soldering Temperature 260 °C 1. Stresses above the ratings listed below can cause permanent damage to the device. These ratings are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Table 3. DC Characteristics (VDD = 3.3 V ± 5%; Ambient Temperature = –40°C to 85°C) Parameter Operating Voltage Input High Voltage(1), Symbol Conditions Min VDD 3.15 VDD/2 + 0.7 ICLK VIH Input Low Voltage(1), ICLK VIL Input High Voltage, OE VIH Typ 2 Input Low Voltage, OE VIL Ouput Low Voltage VOL IOL = 12 mA Output High Voltage VOH IOH = –12 mA Operating Supply Current IDD No load, 135 MHz Nominal Output Impedance ZO 2.4 Max Unit 3.45 V 3.8 V VDD/2 – 0.7 V VDD V 0.8 V 0.4 V V 30 mA 27 Ω Internal Pull-up Resistor RPU ICLK 31 kΩ Input Capacitance CIN OE pin 5 pF CIN ICLK 1 pF ±50 mA Short Circuit Current IOS 1. Nominal switching threshold is VDD/2. MPC94551 2 Advanced Clock Drivers Devices Freescale Semiconductor Table 4. AC Characteristics (VDD = 3.3 V ± 5%; Ambient Temperature = –40°C to 85°C) Parameter Symbol Condition Min Input Frequency Typ 0 Output Frequency(1) Max Unit 160 MHz 15 pF load 160 MHz Output Clock Rise Time tOR 0.8 V to 2.0 V 1.5 ns Output Clock Fall Time tOF 2.0 V to 0.8 V 1.5 ns 5 ns 300 ps Propagation Delay(2) 135 MHz Output to Output Skew(3) 1.5 4 Rising edges at VDD/2 1. Measured with an external series resistor of 33Ω positioned close to each output pin 2. Measured with rail to rail input clock 3. Measured between any 2 outputs with equal loading PACKAGE DIMENSIONS D A 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. C 5 0.25 H E M B M 1 4 h B e X 45˚ θ A C SEATING PLANE L 0.10 A1 B 0.25 M C B S A S DIM A A1 B C D E e H h L θ MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0˚ 7˚ D/EF SUFFIX SOIC PACKAGE CASE 751-06 ISSUE T MPC94551 Advanced Clock Drivers Devices Freescale Semiconductor 3 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 [email protected] MPC94551 Rev. 3 2/2005 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. 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