ICS ICS853001AMLFT

ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
GENERAL DESCRIPTION
FEATURES
The ICS853001 is a 1:1 Differential LVPECLto-LVPE C L B u f fe r a n d a m e m b e r o f t h e
HiPerClockS™
HiPerClock S ™ family of High Perfor mance
Clock Solutions from ICS. The ICS853001
may be used to regenerate LVPECL clocks which
may have been attenuated, across a long trace, or may also
be used as a differential-to-LVPECL translator. The differential input can accept the following differential input types:
LVPECL, LVDS and CML. The device also has an output enable pin for debug/test purposes. When the output is disabled,
it drives differential LOW (Q = LOW, nQ = HIGH). The
ICS853001 is packaged in either a 3mm x 3mm 8-pin TSSOP
or 3.9mm x 4.9mm 8-pin SOIC, making it ideal for use on
space-constrained boards.
• 1:1 Differential LVPECL-to-LVPECL / ECL buffer
ICS
• 1 LVPECL clock output pair
• 1 Differential LVPECL PCLK, nPCLK input pair
• PCLK, nPCLK pair can accept the following
differential input levels: LVPECL, LVDS, CML
• Maximum output frequency: >2.5GHz
• Part-to-part skew: 100ps (maximum)
• Propagation delay: 500ps (maximum)
• Additive phase jitter, RMS: 0.03ps (typical)
• LVPECL mode operating voltage supply range:
VCC = 2.375V to 5.25V, VEE = 0V
• ECL mode operating voltage supply range:
VCC = 0V, VEE = -5.25V to -2.375V
• -40°C to 85°C ambient operating temperature
• Lead-Free package RoHS compliant
BLOCK DIAGRAM
OE
PIN ASSIGNMENT
D Q
VCC
Q
nQ
VEE
LE
Q
nPCLK
8
7
6
5
OE
PCLK
nPCLK
VBB
ICS853001
PCLK
nQ
1
2
3
4
8-Lead TSSOP, 118 mil
3mm x 3mm x 0.95mm package body
G Package
Top View
V BB
ICS853001
8-Lead SOIC
3.90mm x 4.90mm x 1.37mm package body
M Package
Top View
853001AG
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1
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
TABLE 1. PIN DESCRIPTIONS
Number
Name
1
VCC
Power
Positive supply pin.
2, 3
Q, nQ
Output
Differential output pair. LVPECL interface levels.
4
VEE
Power
Negative supply pin.
5
6
7
8
NOTE:
Type
Description
Nominal bias voltage at VCC - 1.38V.
Pullup/ Inver ting differential LVPECL clock input. VCC/2 default when left
nPCLK
Input
Pulldown floating. Can accept LVPECL, LVDS, CML interface levels.
Non-inver ting differential LVPECL clock input.
PCLK
Input
Pulldown
Can accept LVPECL, LVDS, CML interface levels.
Active HIGH output enable. When logic HIGH, the output is enabled
and follows the input clock. When logic LOW, the output drives logic
OE
Input
Pullup
low (Q=LOW, nQ=HIGH). LVCMOS/LVTTL interface levels.
Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
VBB
Output
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
RPULLDOWN
Input Pulldown Resistor
37.5
KΩ
RPULLUP
Input Pullup Resistor
37.5
KΩ
853001AG
Test Conditions
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2
Minimum
Typical
Maximum
Units
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
6V (LVPECL mode, VEE = 0)
Negative Supply Voltage, VEE
-6V (ECL mode, VCC = 0)
Inputs, VI (LVPECL mode)
-0.5V to VCC + 0.5 V
Inputs, VI (ECL mode)
0.5V to VEE - 0.5V
Outputs, IO
Continuous Current
Surge Current
VBB Sink/Source, IBB
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage
to the device. These ratings are stress specifications only. Functional operation of product at
these conditions or any conditions beyond those
50mA
100mA
listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maxi-
± 0.5mA
mum rating conditions for extended periods may
affect product reliability.
Operating Temperature Range, TA -40°C to +85°C
Storage Temperature, TSTG
-65°C to 150°C
Package Thermal Impedance, θJA
8 Lead TSSOP
8 Lead SOIC
101.7°C/W (0 m/s)
112.7°C/W (0 lfpm)
(Junction-to-Ambient)
TABLE 3A. POWER SUPPLY DC CHARACTERISTICS, VCC = 2.375V TO 5.25V; VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
VCC
Positive Supply Voltage
Test Conditions
I EE
Power Supply Current
Minimum
Typical
Maximum
Units
2.375
3.3
5.25
V
27
mA
Maximum
Units
TABLE 3B. LVCMOS DC CHARACTERISTICS, VCC = 2.375V TO 5.25V; VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
Test Conditions
Minimum
Typical
VIH
Input High Voltage
OE
0.7VCC
VCC + 0.3
V
VIL
Input Low Voltage
OE
-0.3
0.3VCC
V
IIH
Input High Current
OE
VCC = VIN
150
µA
IIL
Input Low Current
OE
VCC = VIN
-150
µA
TABLE 3C. LVCMOS DC CHARACTERISTICS, VCC = 0V; VEE = -5.25V TO -2.375V, TA = -40°C TO 85°C
Symbol
Parameter
Maximum
Units
VIH
Input High Voltage
OE
0.3VEE
0.3
V
VIL
Input Low Voltage
OE
VEE - 0.3
0.7VEE
V
IIH
Input High Current
OE
VCC = VIN
150
µA
IIL
Input Low Current
OE
VCC = VIN
853001AG
Test Conditions
Minimum
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3
-150
Typical
µA
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
TABLE 3D. LVPECL DC CHARACTERISTICS, VCC = 2.375V TO 5.25V; VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
Maximum
Units
PCLK
Test Conditions
VCC = VIN
200
µA
nPCLK
VCC = VIN
200
µA
IIH
Input High Current
IIL
Input Low Current
V PP
Peak-to-Peak Input Voltage
Minimum
Typical
PCLK
VCC = 5.25, VIN = 0V
-200
µA
nPCLK
VCC = 5.25V, VIN = 0V
-200
µA
0.15
1.2
1.2
V
VCC
V
VCMR
Common Mode Input Voltage; NOTE 1, 2
VOH
Output High Voltage; NOTE 3
VCC - 1.005
V
VOL
Output Low Voltage; NOTE 3
VCC - 1.78
V
VSWING
Peak-to-Peak Output Voltage Swing
0.6
Bias Voltage
VCC - 1.44 VCC - 1.38
V BB
NOTE 1: Common mode voltage is defined as VIH.
NOTE 2: For single ended applications, the maximum input voltage for PCLK, nPCLK is VCC + 0.3V.
NOTE 3: Outputs terminated with 50Ω to VCC - 2V.
TABLE 4. AC CHARACTERISTICS, VCC = 0V; VEE = -5.25V TO -2.375V
Symbol Parameter
Output Frequency
t PD
Propagation Delay; NOTE 1
tsk(pp)
Par t-to-Par t Skew; NOTE 2, 3
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter Section
Output Rise/Fall Time
t R / tF
odc
Output Duty Cycle
V
VCC - 1.32
V
VCC = 2.375 TO 5.25V; VEE = 0V, TA = -40°C TO 85°C
Test Conditions
fMAX
tjit
OR
1. 0
Minimum
Typical
Maximum
Units
>2.5
GHz
500
ps
100
ps
250
155.52MHz, Integration Range:
12KHz - 20MHz
20% to 80%
50
250
ps
VCC = 2.375V to 3.6V, VEE = 0
48
52
%
54
%
IJ 1GHz
0.03
ps
VCC > 3.6V to 5.25V, VEE = 0 or
46
VEE = -5.25V to -3.6V,VCC = 0
All parameters are measured at ƒ ≤ 1.7GHz, unless otherwise noted.
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
NOTE 2: Defined as skew between outputs on different devices operating at the same supply voltages and
with equal load conditions. Using the same type of inputs on each device, the outputs are measured
at the differential cross points.
NOTE 3: This parameter is defined in accordance with JEDEC Standard 65.
853001AG
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4
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
ADDITIVE PHASE JITTER
the 1Hz band to the power in the fundamental. When the required offset is specified, the phase noise is called a dBc value,
which simply means dBm at a specified offset from the fundamental. By investigating jitter in the frequency domain, we get a
better understanding of its effects on the desired application over
the entire time record of the signal. It is mathematically possible
to calculate an expected bit error rate given a phase noise plot.
The spectral purity in a band at a specific offset from the fundamental compared to the power of the fundamental is called the
dBc Phase Noise. This value is normally expressed using a
Phase noise plot and is most often the specified plot in many
applications. Phase noise is defined as the ratio of the noise
power present in a 1Hz band at a specified offset from the fundamental frequency to the power value of the fundamental. This
ratio is expressed in decibels (dBm) or a ratio of the power in
0
-10
Additive Phase Jitter, RMS
-20
@ 155.52MHz (12KHz to 20MHz)
= 0.03ps typical
-30
-40
-50
SSB PHASE NOISE dBc/HZ
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
-190
1k
10k
100k
1M
10M
100M
OFFSET FROM CARRIER FREQUENCY (HZ)
As with most timing specifications, phase noise measurements
have issues. The primary issue relates to the limitations of the
equipment. Often the noise floor of the equipment is higher than
the noise floor of the device. This is illustrated above. The de-
853001AG
vice meets the noise floor of what is shown, but can actually be
lower. The phase noise is dependant on the input source and
measurement equipment.
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5
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
PARAMETER MEASUREMENT INFORMATION
2V
VCC
Qx
VCC
SCOPE
nPCLK
LVPECL
V
V
Cross Points
PP
CMR
PCLK
nQx
VEE
V EE
-3.25V to -0.375V
OUTPUT LOAD AC TEST CIRCUIT
DIFFERENTIAL INPUT LEVEL
nQx
PART 1
Qx
nPCLK
nQy
nQ
PCLK
PART 2
Qy
Q
tPD
t sk(pp)
PART-TO-PART SKEW
PROPAGATION DELAY
nQ
80%
80%
Q
VSW I N G
Clock
Outputs
Pulse Width
20%
20%
tR
t
PERIOD
tF
odc =
t PW
t PERIOD
OUTPUT RISE/FALL TIME
853001AG
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
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6
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
APPLICATION INFORMATION
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LVCMOS LEVELS
Figure 1A shows an example of the differential input that can
be wired to accept single ended LVCMOS levels. The reference
voltage level VBB generated from the device is connected to
the negative input. The C1 capacitor should be located as close
as possible to the input pin.
VCC
R1
1K
Single Ended Clock Input
PCLK
V_REF
nPCLK
C1
0.1u
R2
1K
FIGURE 1A. SINGLE ENDED LVCMOS SIGNAL DRIVING DIFFERENTIAL INPUT
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LVPECL LEVELS
Figure 1B shows an example of the differential input that can
be wired to accept single ended LVPECL levels. The reference
voltage level VBB generated from the device is connected to
the negative input.
VCC
C1
0.1u
CLK_IN
PCLK
VBB
nPCLK
FIGURE 1B. SINGLE ENDED LVPECL SIGNAL DRIVING DIFFERENTIAL INPUT
853001AG
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7
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
TERMINATION FOR 2.5V LVPECL OUTPUT
Figure 2A and Figure 2B show examples of termination for 2.5V
LVPECL driver. These terminations are equivalent to terminating 50Ω to VCC - 2V. For VCC = 2.5V, the VCC - 2V is very close to
ground level. The R3 in Figure 2B can be eliminated and the
termination is shown in Figure 2C.
2.5V
VCC=2.5V
2.5V
2.5V
VCC=2.5V
R1
250
Zo = 50 Ohm
R3
250
+
Zo = 50 Ohm
+
Zo = 50 Ohm
-
Zo = 50 Ohm
2,5V LVPECL
Driv er
-
R1
50
2,5V LVPECL
Driv er
R2
62.5
R2
50
R4
62.5
R3
18
FIGURE 2B. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
FIGURE 2A. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
2.5V
VCC=2.5V
Zo = 50 Ohm
+
Zo = 50 Ohm
-
2,5V LVPECL
Driv er
R1
50
R2
50
FIGURE 2C. 2.5V LVPECL TERMINATION EXAMPLE
853001AG
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8
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
TERMINATION FOR 3.3V LVPECL OUTPUTS
50Ω transmission lines. Matched impedance techniques should
be used to maximize operating frequency and minimize signal
distortion. Figures 3A and 3B show two different layouts which
are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned
are recommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must
be used for functionality. These outputs are designed to drive
3.3V
Zo = 50Ω
125Ω
FOUT
FIN
125Ω
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
FIN
50Ω
Zo = 50Ω
VCC - 2V
1
RTT =
Z
((VOH + VOL) / (VCC – 2)) – 2 o
RTT
84Ω
FIGURE 3A. LVPECL OUTPUT TERMINATION
84Ω
FIGURE 3B. LVPECL OUTPUT TERMINATION
TERMINATION FOR 5V LVPECL OUTPUT
This section shows examples of 5V LVPECL output termination. Figure 4A shows standard termination for 5V LVPECL. The
termination requires matched load of 50Ω resistors pull down to
VCC - 2V = 3V at the receiver. Figure 4B shows Thevenin equivalence of Figure 4A. In actual application where the 3V DC power
supply is not available, this approached is normally used.
5V
5V
5V
5V
R3
84
PECL
PECL
Zo = 50 Ohm
R4
84
Zo = 50 Ohm
+
+
Zo = 50 Ohm
Zo = 50 Ohm
-
R1
50
-
PECL
R1
125
R2
50
PECL
R2
125
3V
FIGURE 4A. STANDARD 5V PECL OUTPUT TERMINATION
853001AG
FIGURE 4B. 5V PECL OUTPUT TERMINATION EXAMPLE
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9
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
LVPECL CLOCK INPUT INTERFACE
here are examples only. If the driver is from another vendor,
use their termination recommendation. Please consult with the
vendor of the driver component to confirm the driver termination requirements.
The PCLK /nPCLK accepts LVPECL, CML, SSTL and other
differential signals. Both VSWING and VOH must meet the VPP
and VCMR input requirements. Figures 5A to 5F show interface
examples for the HiPerClockS PCLK/nPCLK input driven by
the most common driver types. The input interfaces suggested
3.3V
3.3V
3.3V
3.3V
3.3V
R1
50
CML
Zo = 50 Ohm
R2
50
Zo = 50 Ohm
PCLK
R1
100
Zo = 50 Ohm
nPCLK
PCLK
nPCLK
Zo = 50 Ohm
HiPerClockS
PCLK/nPCLK
HiPerClockS
PCLK/nPCLK
CML Built-In Pullup
FIGURE 5A. HIPERCLOCKS PCLK/nPCLK INPUT DRIVEN
BY AN OPEN COLLECTOR CML DRIVER
FIGURE 5B. HIPERCLOCKS PCLK/nPCLK INPUT DRIVEN
BY A BUILT-IN PULLUP CML DRIVER
3.3V
3.3V
3.3V
3.3V
R3
125
3.3V
R4
125
Zo = 50 Ohm
3.3V LVPECL
Zo = 50 Ohm
C1
Zo = 50 Ohm
C2
PCLK
PCLK
Zo = 50 Ohm
nPCLK
LVPECL
R1
84
VBB
nPCLK
HiPerClockS
Input
PC L K/n PC LK
R5
100 - 200
R2
84
FIGURE 5C. HIPERCLOCKS PCLK/nPCLK INPUT DRIVEN
BY A 3.3V LVPECL DRIVER
R2
50
R1
50
R6
100 - 200
FIGURE 5D. HIPERCLOCKS PCLK/nPCLK INPUT DRIVEN
BY A 3.3V LVPECL DRIVER WITH AC COUPLE
2.5V
3.3V
3.3V
3.3V
2.5V
R3
120
SSTL
Zo = 50 Ohm
R4
120
C1
LVDS
Zo = 60 Ohm
PCLK
PCLK
R5
100
Zo = 60 Ohm
nPCLK
R1
120
nPCLK
Zo = 50 Ohm
HiPerClockS
PCLK/nPCLK
PC L K/n PC L K
R1
1K
R2
120
FIGURE 5E. HIPERCLOCKS PCLK/nPCLK INPUT DRIVEN
BY AN SSTL DRIVER
853001AG
VBB
C2
FIGURE 5F.
HIPERCLOCKS PCLK/nPCLK INPUT DRIVEN
BY A 3.3V LVDS DRIVER
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10
R2
1K
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
APPLICATION SCHEMATIC EXAMPLE
one termination example is shown in this schematic. For more
termination approaches, please refer to the LVPECL Termination Application Note.
Figure 6 shows an example of ICS853001 application schematic.
In this example, the device is operated at VCC = 3.3V. The
decoupling capacitor should be located as close as possible to
the power pin. The input is driven by a 3.3V LVPECL driver. Only
VCC
VCC
VCC
R7
133
R5
133
U1
R3
133
ICS853001
Zo = 50 Ohm
5
6
7
8
Zo = 50 Ohm
VEE
nQ
Q
VCC
VBB
nPCLK
PCLK
OE
4
3
2
1
-
VCC
Zo = 50 Ohm
+
C5
0.1u
LVPECL
R8
82.5
R1
133
Zo = 50 Ohm
R6
82.5
R4
82.5
R2
82.5
VCC=3.3V
FIGURE 6. APPLICATION SCHEMATIC EXAMPLE
853001AG
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11
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS853001.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS853001 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 5V + 5% = 5.25V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * ICC_MAX = 5.25V * 27mA = 141.75mW
Power (outputs)MAX = 27.83mW/Loaded Output pair
Total Power_MAX (3.465V) = 141.75mW + 27.83mW = 169.58mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = junction-to-ambient thermal resistance
Pd_total = Total device power dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 90.5°C/W per Table 5A below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.170W * 90.5°C/W = 100.4°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 5A. THERMAL RESISTANCE θJA FOR 8-PIN TSSOP, FORCED CONVECTION
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
101.7°C/W
90.5°C/W
2
89.8°C/W
TABLE 5B. THERMAL RESISTANCE θJA FOR 8-PIN SOIC, FORCED CONVECTION
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
153.3°C/W
112.7°C/W
128.5°C/W
103.3°C/W
115.5°C/W
97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
853001AG
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12
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 7.
VCC
Q1
VOUT
RL
50
VCC - 2V
FIGURE 7. LVPECL DRIVER CIRCUIT AND TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V - 2V.
CC
•
For logic high, VOUT = V
OH_MAX
(V
CC_MAX
•
– 1.005V
OH_MAX
OL_MAX
CC_MAX
CC_MAX
) = 1.005
-V
For logic low, VOUT = V
(V
=V
-V
OL_MAX
=V
CC_MAX
– 1.78V
) = 1.78V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
– (V
CC_MAX
- 2V))/R ] * (V
CC_MAX
L
-V
OH_MAX
) = [(2V - (V
CC_MAX
-V
OH_MAX
))/R ] * (V
CC_MAX
L
-V
OH_MAX
)=
[(2V - 1.005V)/50Ω] * 1.005V = 20mW
Pd_L = [(V
OL_MAX
– (V
CC_MAX
- 2V))/R ] * (V
L
CC_MAX
-V
OL_MAX
) = [(2V - (V
CC_MAX
-V
OL_MAX
))/R ] * (V
L
CC_MAX
-V
OL_MAX
)=
[(2V - 1.78V)/50Ω] * 1.78V = 7.83mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 27.83mW
853001AG
www.icst.com/products/hiperclocks.html
13
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
RELIABILITY INFORMATION
TABLE 6A θJAVS. AIR FLOW TABLE FOR 8 LEAD TSSOP
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
101.7°C/W
90.5°C/W
2
89.8°C/W
TABLE 6B. θJAVS. AIR FLOW TABLE 8 LEAD SOIC
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
153.3°C/W
112.7°C/W
128.5°C/W
103.3°C/W
115.5°C/W
97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS853001 is: 141
853001AG
www.icst.com/products/hiperclocks.html
14
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - G SUFFIX
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
FOR
8 LEAD TSSOP
PACKAGE OUTLINE - M SUFFIX FOR 8 LEAD SOIC
TABLE 7A. PACKAGE DIMENSIONS
SYMBOL
TABLE 7B. PACKAGE DIMENSIONS
Minimum
N
SYMBOL
Maximum
8
--
1.10
A
A1
0
0.15
A2
0.79
0.97
b
0.22
0.38
c
0.08
0.23
D
3.00 BASIC
E
4.90 BASIC
E1
3.00 BASIC
e
0.65 BASIC
e1
1.95 BASIC
α
aaa
0.40
0°
--
MINIMUN
N
A
L
Millimeters
Millimeters
MAXIMUM
8
1.35
1.75
A1
0.10
0.25
B
0.33
0.51
C
0.19
0.25
D
4.80
5.00
E
3.80
4.00
e
1.27 BASIC
H
5.80
6.20
h
0.25
0.50
0.80
L
0.40
1.27
8°
α
0°
8°
Reference Document: JEDEC Publication 95, MS-012
0.10
Reference Document: JEDEC Publication 95, MO-187
853001AG
www.icst.com/products/hiperclocks.html
15
REV. A JANUARY 29, 2005
ICS853001
Integrated
Circuit
Systems, Inc.
1:1, DIFFERENTIAL LVPECL-TO2.5V, 3.3V, 5V LVPECL/ECL BUFFER
TABLE 8. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
ICS853001AG
001A
8 lead TSSOP
tube
-40°C to 85°C
ICS853001AGT
001A
8 lead TSSOP
2500 tape & reel
-40°C to 85°C
ICS853001AGLF
01AL
8 lead "Lead-Free" TSSOP
tube
-40°C to 85°C
ICS853001AGLFT
01AL
8 lead "Lead-Free" TSSOP
2500 tape & reel
-40°C to 85°C
ICS853001AM
853001A
8 lead SOIC
tube
-40°C to 85°C
ICS853001AMT
853001A
8 lead SOIC
2500 tape & reel
-40°C to 85°C
ICS853001AMLF
853001AL
8 lead "Lead-Free" SOIC
tube
-40°C to 85°C
ICS853001AMLFT
853001AL
8 lead "Lead-Free" SOIC
2500 tape & reel
-40°C to 85°C
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product
for use in life support devices or critical medical instruments.
853001AG
www.icst.com/products/hiperclocks.html
16
REV. A JANUARY 29, 2005