MCC
Micro Commercial Components
Features
•
•
•
Glass Passivated Diode Construction
High Temperature Soldering Guaranteed:260oC/10 Second
Saves Space On Printed Circuit Board
Mechanical Data
•
•
•
•
Lead Free Finish/RoHS Compliant (NOTE 1)("P" Suffix
designates RoHS Compliant. See ordering information)
Case Material:Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
Teminals: Plated leads Solderable per MIL-STD-750,Method 2026
Moisture Sensitiviy:Level 1 per J-STD-020C
MCC
Part
Number
MB05S
MB1S
MB2S
MB4S
MB6S
MB8S
MB10S
Device
Marking
MB05S
MB1S
MB2S
MB4S
MB6S
MB8S
MB10S
MB05S
THRU
MB10S
omponents
20736 Marilla Street Chatsworth
!"#
$
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TM
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
0.5 Amp Single Phase
Glass Passivated
Bridge Rectifier
50 to 1000 Volts
MBS -1
∼
35V
70V
140V
280V
420V
480V
700V
∼
+
A
Notch in case
K
M
J
O
Electrical Characteristics @ 25 C Unless Otherwise Specified
Typical Junction
Capacitance
Rating For Fusing
Operating Junction
and Storage
Temperature Range
Notes:
IF(AV)
IFSM
0.5 A(2)
0.8 A(3)
35A
F
C
G
H
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Typical Thermal
Resistance
D
B
E
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
-
See Fig.1
8.3ms, half sine
N
+
~
-
~
Case Style
VF
IR
1.0V
5uA
100uA
RthJA
R thJA
R thJL
CJ
(2)
O
85
C /W
O
(3)
C /W
70
(2)
O
20
C /W
13pF
I2t
TJ
TSTG
5.0A2s
-55to+150
O
C
IFM = 0.4A;
TA = 25OC
O
C
TA = 25
O
C
TA = 125
per leg
Measured at
1.0MHz, VR=4.0V
t<8.30ms
C
D
M
N
.252
.150
.179
.019
.090
.004
.027
.058
.195
.039
.006
.275
6
.165
.195
.031
.106
.008
.043
.062
.205
.049
.016
6.40
3.80
4.55
0.50
2.30
0.10
0.70
1.47
4.95
0.99
0.15
7.00
2.70
4.20
4.95
0.80
2.70
0.20
1.10
1.57
5.21
1.24
0.41
Mounting Pad Layout
0.023 MIN.
(0.58 MIN.)
1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7
2. On glass epoxy P.C.B. mounted on 0.05 x 0.05”(1.3 x 1.3mm)pads
3. On aluminum substrate P.C.B. with an area of 0.8” x 0.8”(20 x 20mm) mounted
on 0.05 x 0.05”(1.3x 1.3mm) solder pad
0.272 MAX.
(6.91 MAX.)
0.030 MIN.
(0.76 MIN.)
0.105 (2.67)
0.095 (2.41)
Revision: 12
www.mccsemi.com
1 of 3
2009/10/22
MCC
MB05S thru MB10S
TM
Micro Commercial Components
Figure 2
Typical Reverse Characteristics
Figure 1. Derating Curve for Output Rectified Current
100
60
Average Forward Rectified Current (A)
0.8
Aluminum Substrate
40
0.7
0.6
20
0.5
10
Glass
Epoxy
P.C.B.
0.4
0.3
6
4
0.2
2
Resistive or Inductive Load
0.1
µAmps 1
0
0
20
40
60
100
80
120
140
.6
160
Ambient Temperature (°C)
.4
.2
TA=25°C
.1
.06
Figure 3
Typical Forward Characteristics
.04
20
.02
10
.01
20
40
60
6
80
100
120
140
Volts%
Instantaneous Reverse Leakage Current - MicroAmperesversus
Percent Of Rated Peak Reverse Voltage - Volts%
4
2
25°C
Amps
Figure 5
Peak Forward Surge Current
1
60
.6
50
.4
40
.2
30
.1
Amps
.06
.04
20
10
.02
0
.01
.4
.6
.8
1.0
1.2
1
2
4
6
1.4
8 10
20
40
60 80 100
Cycles
Volts
Peak Forward Surge Current - Amperes versus
Number Of Cycles At 50Hz - Cycles
Instantaneous Forward Current - Amperesversus
Instantaneous Forward Voltage - Volts
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Revision: 12
2 of 3
2009/10/22
MCC
TM
Micro Commercial Components
Ordering Information
Device
Packing
(Part Number)-TP
Tape&Reel;3Kpcs/Reel
***IMPORTANT NOTICE***
Micro Commercial Components Corp . reserves the right to make changes without further notice to any
product herein to make corrections, modifications , enhancements , improvements , or other changes .
Micro Commercial Components Corp . does not assume any liability arising out of the application or
use of any product described herein; neither does it convey any license under its patent rights ,nor
the rights of others . The user of products in such applications shall assume all risks of such use
and will agree to hold Micro Commercial Components Corp . and all the companies whose
products are represented on our website, harmless against all damages.
***APPLICATIONS DISCLAIMER***
Products offer by Micro Commercial Components Corp . are not intended for use in Medical,
Aerospace or Military Applications.
www.mccsemi.com
Revision: 12
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2009/10/22
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