MCC MC551-30

MCC
omponents
21201 Itasca Street Chatsworth
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MC551-30
Features
•
•
•
Extremely Low VF
Extremely thin package
Low stored charge
0.5 Amp Surface Mount
Schottky Barrier Diode
30 Volts
Mechanical Data
•
•
•
•
•
Case:Molded plastic, JEDEC SOD-323
Terminal : Solder plated, solderable per MIL-STD-750,Method 2026
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : 0.000159 ounce, 0.0045 gram
SOD323
Maximum Ratings
Operating Junction Temperature: -40°C to +125°C
Storage Temperature: -40°C to +125°C
MCC
Catalog
Number
Device
Marking
M C551-30
K
Repetitive
Peak Reverse
Voltage
A
B
K
•
•
Continuous
Reverse
Voltage
30V
E
C
D
20V
F
DIMENSIONS
INCHES
Electrical Characteristics @ 25°C Unless Otherwise Specified
Mean Rectifying
Current
Peak Forward Surge
Current
Maximum Forward
Voltage Drop Per
Element
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
TA = 25°C
IO
0.5A
IFSM
1000mA 8.3ms, half sine
DIM
A
B
C
D
E
F
MIN
.091
.063
.010
.045
.004
.031
MM
MAX
.106
.071
.017
.053
.012
.045
MIN
2.30
1.60
0.25
1.15
0.10
0.80
MAX
2.70
1.80
0.43
1.35
0.30
1.15
Suggested Solder
Pad Layout
VF
0.47V
0.36V
IR
30µΑ
TA = 25°C
IFM =500mA
I FM =100mA
TA = 25°C
VR=10V
0.074"
0.027”
0.022”
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NOTE
MCC
MC551-30
RATING AND CHARACTERISTIC CURVES
1000
10m
O
1
0
0.1
0.2
REVERSE CURRENT : (A)
25 o
C
o
C
25 o
C
75
10
5 Co
100
12
FORWARD CURRENT : (mA)
125 C
0.3
0.4
0.5
1m
O
75 C
100
10
O
25 C
1
0.1
0.6
10
FORWARD VOLTAGE : (V)
Fig. 1 Forward characteristics
80
60
40
20
0
0
25
50
75
100
AMBIENT TEMPERATURE : Ta
Fig. 4 Derating curve
(mounting on glass epoxy PCBs)
40
Fig. 2 Reverse characteristics
CAPACITANCE BETWEEN TERMINALS : (pF)
Io CURRENT (%)
100
20
REVERSE VOLTAGE : (V)
10
1
0
5
101
52
02
53
03
5
REVERSE VOLTAGE : V
Fig. 3 Capacitance between
terminals characteristics
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