MIC261203 28V, 12A Hyper Light Load™ Synchronous DC/DC Buck Regulator SuperSwitcher IIG™ General Description Features The Micrel MIC261203 is a constant-frequency, synchronous DC/DC buck regulator featuring adaptive ontime control architecture. The MIC261203 operates over a supply range of 4.5V to 28V. It has an internal linear regulator which provides a regulated 5V to power the internal control circuitry. MIC261203 operates at a constant 600kHz switching frequency in continuousconduction mode and can be used to provide up to 12A of output current. The output voltage is adjustable down to 0.8V. • • • • • • • • • • • Hyper Light Load™ efficiency – up to 80% at 10mA Hyper Speed Control™ architecture enables − High Delta V operation (VIN = 28V and VOUT = 0.8V) − Small output capacitance Input voltage range: 4.5V to 28V Output current up to 12A Up to 95% efficiency Adjustable output voltage from 0.8V to 5.5V ±1% FB accuracy Any CapacitorTM stable − zero-to-high ESR 600kHz switching frequency Power Good (PG) output Foldback current-limit and “hiccup” mode short-circuit protection Safe start-up into pre-biased loads 5mm x 6mm MLF® package –40°C to +125°C junction temperature range Micrel’s Hyper Light Load™ architecture provides the same high-efficiency and ultra-fast transient response as the Hyper Speed Control™ architecture under medium to heavy loads, but also maintains high efficiency under light load conditions by transitioning to variable frequency, discontinuous mode operation. The MIC261203 offers a full suite of protection features to • ensure protection of the IC during fault conditions. These • include undervoltage lockout to ensure proper operation • under power-sag conditions, thermal shutdown, internal soft start to reduce the inrush current, foldback currentApplications limit and “hiccup” mode short-circuit protection. The MIC261203 includes a Power Good (PG) output to allow • Distributed power systems simple sequencing. • Telecom/networking infrastructure All support documentation can be found on Micrel’s web • Printers, scanners, graphic cards and video cards site at: www.micrel.com. ___________________________________________________________________________________________________________ Typical Application Efficiency (VIN = 12V) vs. Output Current 100 95 5.0V 3.3V 2.5V 1.8V 1.5V 1.2V 1.0V 0.9V 0.8V EFFICIENCY (%) 90 85 80 75 70 65 60 55 V IN = 12V 50 0 3 6 9 12 15 OUTPUT CURRENT (A) Hyper Speed Control, Hyper Light Load, SuperSwitcher II, and Any Capacitor are trademarks of Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc. Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com July 2011 M9999-071311-A Micrel, Inc. MIC261203 Ordering Information Part Number MIC261203YJL Voltage Switching Frequency Junction Temperature Range Package Lead Finish Adjustable 600kHz –40°C to +125°C 28-Pin 5mm x 6mm MLF® Pb-Free Pin Configuration 28-Pin 5mm x 6mm MLF® (YJL) Pin Description Pin Number Pin Name 1 PVDD 3 NC No Connect. 4, 9, 10, 11, 12 SW Switch Node (Output): Internal connection for the high-side MOSFET source and low-side MOSFET drain. Due to the high speed switching on this pin, the SW pin should be routed away from sensitive nodes. PGND Power Ground. PGND is the ground path for the MIC26903 buck converter power stage. The PGND pins connect to the low-side N-Channel internal MOSFET gate drive supply ground, the sources of the MOSFETs, the negative terminals of input capacitors, and the negative terminals of output capacitors. The loop for the power ground should be as small as possible and separate from the Signal ground (SGND) loop. PVIN High-Side N-internal MOSFET Drain Connection (Input): The PVIN operating voltage range is from 4.5V to 26V. Input capacitors between the PVIN pins and the power ground (PGND) are required and keep the connection short. BST Boost (Output): Bootstrapped voltage to the high-side N-channel MOSFET driver. A Schottky diode is connected between the PVDD pin and the BST pin. A boost capacitor of 0.1μF is connected between the BST pin and the SW pin. Adding a small resistor at the BST pin can slow down the turn-on time of high-side N-Channel MOSFETs. CS Current Sense (Input): The CS pin senses current by monitoring the voltage across the low-side MOSFET during the OFF-time. The current sensing is necessary for short circuit protection and zero current cross comparator. In order to sense the current accurately, connect the low-side MOSFET drain to SW using a Kelvin connection. The CS pin is also the high-side MOSFET’s output driver return. 2, 5, 6, 7, 8, 21 13,14,15, 16,17,18,19 20 22 July 2011 Pin Function 5V Internal Linear Regulator (Output): PVDD supply is the power MOSFET gate drive supply voltage and created by internal LDO from VIN. When VIN < +5.5V, PVDD should be tied to PVIN pins. A 2.2µF ceramic capacitor from the PVDD pin-to-PGND (pin 2) must be place next to the IC. 2 M9999-071311-A Micrel, Inc. MIC261203 Pin Description (Continued) Pin Number Pin Name 23 SGND 24 FB Feedback (Input): Input to the transconductance amplifier of the control loop. The FB pin is regulated to 0.8V. A resistor divider connecting the feedback to the output is used to adjust the desired output voltage. 25 PG Power Good (Output): Open Drain Output. The PG pin is externally tied with a resistor to VDD. A high output is asserted when VOUT > 92% of nominal. 26 EN Enable (input): A logic level control of the output. The EN pin is CMOS-compatible. Logic high = enable, logic low = shutdown. In the off state, supply current of the device is greatly reduced (typically 5µA). The EN pin should not be left open. 27 VIN Power Supply Voltage (Input): Requires bypass capacitor to SGND. 28 VDD 5V Internal Linear Regulator (Output): VDD supply is the supply bus for the IC control circuit. VDD is created by internal LDO from VIN. When VIN < +5.5V, VDD should be tied to PVIN pins. A 1.0µF ceramic capacitor from the VDD pin to SGND pins must be place next to the IC. July 2011 Pin Function Signal ground. SGND must be connected directly to the ground planes. Do not route the SGND pin to the PGND Pad on the top layer, see PCB layout guidelines for details. 3 M9999-071311-A Micrel, Inc. MIC261203 Absolute Maximum Ratings(1,2) Operating Ratings(3) PVIN to PGND................................................ –0.3V to +29V VIN to PGND ....................................................–0.3V to PVIN PVDD, VDD to PGND ......................................... –0.3V to +6V VSW, VCS to PGND .............................. –0.3V to (PVIN +0.3V) VBST to VSW ........................................................ –0.3V to 6V VBST to PGND .................................................. –0.3V to 35V VFB, VPG to PGND............................... –0.3V to (VDD + 0.3V) VEN to PGND ........................................ –0.3V to (VIN +0.3V) PGND to SGND ........................................... –0.3V to +0.3V Junction Temperature .............................................. +150°C Storage Temperature (TS).........................–65°C to +150°C Lead Temperature (soldering, 10sec)........................ 260°C Supply Voltage (PVIN, VIN)............................... 4.5V to 28V PVDD, VDD Supply Voltage (PVDD, VDD)......... 4.5V to 5.5V Enable Input (VEN) .................................................. 0V to VIN Junction Temperature (TJ) ........................ –40°C to +125°C Maximum Power Dissipation......................................Note 4 Package Thermal Resistance(4) 5mm x 6mm MLF®-24L (θJA) .............................28°C/W Electrical Characteristics(5) PVIN = VIN = VEN = 12V, VBST – VSW = 5V; TA = 25°C, unless noted. Bold values indicate –40°C ≤ TJ ≤ +125°C. Parameter Condition Min. Typ. Max. Units 28 V Power Supply Input Input Voltage Range (VIN, PVIN) 4.5 Quiescent Supply Current VFB = 1.5V (non-switching) Shutdown Supply Current VEN = 0V 450 750 µA 5 10 µA 5 5.4 V 4.2 4.5 VDD Supply Voltage VDD Output Voltage VIN = 7V to 28V, IDD = 40mA 4.8 VDD UVLO Threshold VDD Rising 3.7 VDD UVLO Hysteresis 400 Dropout Voltage (VIN – VDD) IDD = 25mA 380 V mV 600 mV 5.5 V DC/DC Controller Output-Voltage Adjust Range (VOUT) 0.8 Reference 0°C ≤ TJ ≤ 85°C (±1.0%) 0.792 0.8 0.808 –40°C ≤ TJ ≤ 125°C (±1.5%) 0.788 0.8 0.812 V Load Regulation IOUT = 3A to 12A (Continuous Mode) 0.25 % Line Regulation VIN = 4.5V to 28V 0.25 % FB Bias Current VFB = 0.8V 50 500 nA Enable Control EN Logic Level High V 1.8 EN Logic Level Low EN Bias Current VEN = 12V 0.6 V 6 30 µA 600 750 kHz Oscillator Switching Frequency (6) Maximum Duty Cycle Minimum Duty Cycle (7) 450 VFB = 0V 82 % VFB = 1.0V 0 % 300 ns Minimum Off-Time July 2011 4 M9999-071311-A Micrel, Inc. MIC261203 Electrical Characteristics(5) (Continued) PVIN = VIN = VEN = 12V, VBST – VSW = 5V; TA = 25°C, unless noted. Bold values indicate −40°C ≤ TJ ≤ +125°C. Parameter Condition Min. Typ. Max. Units Soft-Start Soft-Start time 5 ms Short-Circuit Protection Current-Limit Threshold VFB = 0.8V, TJ = 25°C 18.75 26 33 A Current-Limit Threshold VFB = 0.8V, TJ = 125°C 17.36 26 33 A Short-Circuit Current VFB = 0V 6 A 6 Internal FETs Top-MOSFET RDS (ON) ISW = 3A 13 mΩ Bottom-MOSFET RDS (ON) ISW = 3A 5.3 SW Leakage Current VEN = 0V 60 µA VIN Leakage Current VEN = 0V 25 µA 95 %VOUT mΩ Power Good PG Threshold Voltage Sweep VFB from Low to High PG Hysteresis Sweep VFB from High to Low 5.5 %VOUT PG Delay Time Sweep VFB from Low to High 100 µs PG Low Voltage Sweep VFB < 0.9 × VNOM, IPG = 1mA 70 TJ Rising 160 °C 15 °C 85 92 200 mV Thermal Protection Over-Temperature Shutdown Over-Temperature Shutdown Hysteresis Notes: 1. Exceeding the absolute maximum rating may damage the device. 2. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5kΩ in series with 100pF. 3. The device is not guaranteed to function outside operating range. 4. PD(MAX) = (TJ(MAX) – TA)/ θJA, where θJA depends upon the printed circuit layout. A 5 square inch 4 layer, 0.62”, FR-4 PCB with 2oz finish copper weight per layer is used for the θJA. 5. Specification for packaged product only. 6. Measured in test mode. 7. The maximum duty-cycle is limited by the fixed mandatory off-time tOFF of typically 300ns. July 2011 5 M9999-071311-A Micrel, Inc. MIC261203 Typical Characteristics 0.6 VOUT = 1.8V 0.4 IOUT = 0A SWITCHING 0.2 4 10 16 22 VEN = 0V 45 30 15 4 10 16 22 4 28 VOUT = 1.8V IOUT = 3A 0.792 22 IOUT = 3A to 12A 0.0% -0.5% 10 16 22 4 28 600 VOUT = 1.8V IOUT = 3A 500 22 INPUT VOLTAGE (V) July 2011 28 VEN = VIN 12 8 4 16 22 28 PG/VREF Ratio vs. Input Voltage 100% VPG THRESHOLD/VREF (%) EN INPUT CURRENT (µA) 650 16 10 INPUT VOLTAGE (V) 16 10 VOUT = 1.8V Enable Input Current vs. Input Voltage 700 4 10 INPUT VOLTAGE (V) Switching Frequency vs. Input Voltage 550 15 0 4 INPUT VOLTAGE (V) 20 5 -1.0% 28 28 25 CURRENT LIMIT (A) TOTAL REGULATION (%) 0.800 22 30 VOUT = 1.8V 0.5% 16 Current Limit vs. Input Voltage Total Regulation vs. Input Voltage 0.804 16 10 INPUT VOLTAGE (V) 1.0% 10 V FB = 0.9V IDD = 10mA INPUT VOLTAGE (V) 0.808 4 4 0 Feedback Voltage vs. Input Voltage 0.796 6 2 0 28 INPUT VOLTAGE (V) FEEDBACK VOLTAGE (V) 8 REN = Open VDD VOLTAGE (V) 0.8 0.0 FREQUENCY (kHz) 10 60 SHUTDOWN CURRENT (µA) SUPPLY CURRENT (mA) 1.0 VDD Output Voltage vs. Input Voltage VIN Shutdown Current vs. Input Voltage VIN Operating Supply Current vs. Input Voltage 95% 90% 85% VREF = 0.7V 80% 0 4 10 16 22 INPUT VOLTAGE (V) 6 28 4 10 16 22 28 INPUT VOLTAGE (V) M9999-071311-A Micrel, Inc. MIC261203 Typical Characteristics (Continued) VIN Operating Supply Current vs. Temperature 1.0 VIN Shutdown Current vs. Temperature 10 VDD UVLO Threshold vs. Temperature 5 0.8 0.6 0.4 VIN = 12V VOUT = 1.8V 0.2 IOUT = 0A SWITCHING -25 0 25 50 75 6 4 VIN = 12V 100 -50 Hyst 0 25 50 75 100 -50 125 -25 0 0.800 0.796 LINE REGULATION (%) IOUT = 3A 75 100 125 0.4% 0.4% VIN = 12V 50 Line Regulation vs. Temperature Load Regulation vs. Temperature VOUT = 1.8V 25 TEMPERATURE (°C) TEMPERATURE (°C) LOAD REGULATION (%) FEEBACK VOLTAGE (V) -25 Feedback Voltage vs. Temperature 0.804 2 0 0 125 TEMPERATURE (°C) 0.808 Falling 3 1 IOUT = 0A 2 4 VEN = 0V 0.0 -50 8 VDD THRESHOLD (V) SUPPLY CURRENT (uA) SUPPLY CURRENT (mA) Rising 0.2% 0.0% VIN = 12V -0.2% VOUT = 1.8V 0.2% 0.0% VIN = 4.5V to 28V VOUT = 1.8V -0.2% IOUT = 3A IOUT =3A to 12A 0.792 -50 -25 0 25 50 75 100 -0.4% -0.4% 125 -50 TEMPERATURE (°C) -25 0 25 50 75 100 -50 125 700 50 75 100 125 100 125 30 V IN = 12V 25 CURRENT LIMIT (A) V OUT = 1.8V 5 IOUT = 3A VDD (V) FREQUENCY (kHz) 25 Current Limit vs. Temperature VDD vs. Temperature 6 0 TEMPERATURE (°C) TEMPERATURE (°C) Switching Frequency vs. Temperature 650 -25 600 550 4 VIN = 12V 3 VOUT = 1.8V 20 15 10 VIN = 12V VOUT = 5 IOUT =0A 500 -50 -25 0 25 50 75 TEMPERATURE (°C) July 2011 100 125 0 2 -50 -25 0 25 50 75 TEMPERATURE (°C) 7 100 125 -50 -25 0 25 50 75 TEMPERATURE (°C) M9999-071311-A Micrel, Inc. MIC261203 Typical Characteristics (Continued) Feedback Voltage vs. Output Current Efficiency vs. Output Current 100 12VIN 80 24V IN 70 VOUT = 1.8V 60 50 0 2 4 6 8 0.804 0.800 0.796 VIN = 12V VOUT = 1.8V VOUT = 1.8V 1.805 1.800 1.796 1.791 1.782 0 OUTPUT CURRENT (A) 2 4 6 8 10 0 12 2 4 6 8 Switching Frequency vs. Output Current 5.0 700 -0.5% -1.0% 6 8 3 POWER DISSIPATION (W) 3.3V 2.5V 1.8V 1.5V 1.2V 1.0V 0.9V 0.8V 85 80 75 70 65 60 VIN = 5V 50 0 3 6 9 12 OUTPUT CURRENT (A) July 2011 6 7.5 9 10.5 TA 25ºC 85ºC 125ºC 3.8 3.4 0 12 3 15 6 9 12 15 OUTPUT CURRENT (A) Die Temperature* (VIN = 5V) vs. Output Current 100 4.0 95 55 4.5 IC Power Dissipation (VIN = 5V) vs. Output Current 90 4.2 OUTPUT CURRENT (A) Efficiency (VIN = 5V) vs. Output Current 100 V FB < 0.8V 4.6 3.0 500 12 10 550 VIN = 5V 3.5 DIE TEMPERATURE (°C) 4 600 OUTPUT CURRENT (A) EFFICIENCY (%) VOUT = 1.8V 650 0.0% OUTPUT VOLTAGE (V) 0.5% FREQUENCY (kHz) LINE REGULATION (%) V IN = 5V VIN = 12V VOUT = 1.8V 2 12 Output Voltage (VIN = 5V) vs. Output Current VIN = 4.5V to 28V 0 10 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Line Regulation vs. Output Current 1.0% VIN = 12V 1.810 1.787 0.792 12 10 1.814 OUTPUT VOLTAGE (V) FEEDBACK VOLTAGE (V) EFFICIENCY (%) 1.819 0.808 90 Output Voltage vs. Output Current VOUT = 0.8V, 1.0V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V 3.0 2.5 2.0 1.5 3.3V 0.8V 1.0 80 60 40 VIN = 5V VOUT = 1.8V 20 0.5 0 0.0 0 0 3 6 9 OUTPUT CURRENT (A) 8 12 2 4 6 8 10 12 OUTPUT CURRENT (A) M9999-071311-A Micrel, Inc. MIC261203 Typical Characteristics (Continued) Efficiency (VIN = 12V) vs. Output Current 4.5 95 80 75 70 65 60 55 VIN = 12V 50 4.0 VOUT = 0.8V, 1.0V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 5.0V 3.5 3.0 2.5 2.0 5.0V 1.5 0.8V 1.0 6 9 12 40 VIN = 12V 3 80 1.8V 1.5V 1.2V 1.0V 0.9V 0.8V 75 70 65 60 55 VIN = 24V POWER DISSIPATION (W) 85 50 0 3 6 9 12 6 5.0V 0.8V 2 18 16 OUTPUT CURRENT (A) 8 6 VIN = 5V VOUT = 0.8, 1.2, 1.5V 2 0 0 25 50 75 100 AMBIENT TEMPERATURE (°C) July 2011 6 9 80 60 VIN = 24V 40 VOUT = 1.8V 2 12 125 16 12 3.3V 8 6 VIN = 5V 4 6 8 10 12 100 125 18 14 10 4 OUTPUT CURRENT (A) Thermal Derating* vs. Ambient Temperature 1.8V VOUT = 1.8, 2.5, 3.3V 2 -25 100 0 16 1.5V 12 0 3 Thermal Derating* vs. Ambient Temperature 12 10 20 1 0 0.8V 8 120 OUTPUT CURRENT (A) 14 6 140 4 3 4 Die Temperature* (VIN = 24V) vs. Output Current 5 18 -50 2 OUTPUT CURRENT (A) VIN = 24V VOUT = 0.8V, 1.0V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 5.0V Thermal Derating* vs. Ambient Temperature 4 0 12 0 15 OUTPUT CURRENT (A) 10 9 IC Power Dissipation (VIN = 24V) vs. Output Current 7 5.0V 3.3V 2.5V 90 6 OUTPUT CURRENT (A) Efficiency (VIN = 24V) vs. Output Current 95 VOUT = 1.8V 20 0 0 15 DIE TEMPERATURE (°C) 3 OUTPUT CURRENT (A) EFFICIENCY (%) 60 0.0 0 OUTPUT CURRENT (A) 80 0.5 OUTPUT CURRENT (A) EFFICIENCY (%) 85 POWER DISSIPATION (W) 5.0V 3.3V 2.5V 1.8V 1.5V 1.2V 1.0V 0.9V 0.8V 90 100 VIN = 12V DIE TEMPERATURE (°C) 100 Die Temperature* (VIN = 12V) vs. Output Current IC Power Dissipation (VIN = 12V) vs. Output Current 0.8V 14 12 1.8V 10 8 6 VIN = 12V 4 VOUT = 0.8, 1.2, 1.8V 2 0 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE (°C) 9 125 -50 -25 0 25 50 75 AMBIENT TEMPERATURE (°C) M9999-071311-A Micrel, Inc. MIC261203 Typical Characteristics (Continued) Thermal Derating* vs. Ambient Temperature Thermal Derating* vs. Ambient Temperature 18 18 16 2.5V 14 OUTPUT CURRENT (A) OUTPUT CURRENT (A) 16 12 5V 10 8 6 VIN = 12V 4 VOUT = 2.5, 3.3, 5V 2 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE (°C) 125 14 12 0.8V 10 8 2.5V 6 4 VIN = 24V 2 VOUT = 0.8, 1.2, 2.5V 0 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE (°C) Die Temperature* : The temperature measurement was taken at the hottest point on the MIC261203 case mounted on a 5 square inch 4 layer, 0.62”, FR-4 PCB with 2oz finish copper weight per layer; see Thermal Measurement section. Actual results will depend upon the size of the PCB, ambient temperature and proximity to other heat emitting components. July 2011 10 M9999-071311-A Micrel, Inc. MIC261203 Functional Characteristics July 2011 11 M9999-071311-A Micrel, Inc. MIC261203 Functional Characteristics (Continued) July 2011 12 M9999-071311-A Micrel, Inc. MIC261203 Functional Characteristics (Continued) July 2011 13 M9999-071311-A Micrel, Inc. MIC261203 Functional Diagram Figure 1. MIC261203 Block Diagram July 2011 14 M9999-071311-A Micrel, Inc. MIC261203 The maximum duty cycle is obtained from the 300ns tOFF(min): Functional Description The MIC261203 is an adaptive ON-time synchronous step-down DC/DC regulator with an internal 5V linear regulator and a Power Good (PG) output. It is designed to operate over a wide input voltage range from 4.5V to 28V and provides a regulated output voltage at up to 7A of output current. An adaptive ON-time control scheme is employed in to obtain a constant switching frequency and to simplify the control compensation. Over-current protection is implemented without the use of an external sense resistor. The device includes an internal soft-start function which reduces the power supply input surge current at start-up by controlling the output voltage rise time. Dmax = Continuous Mode In continuous mode, the output voltage is sensed by the MIC261203 feedback pin FB via the voltage divider R1 and R2, and compared to a 0.8V reference voltage VREF at the error comparator through a low gain transconductance (gm) amplifier. If the feedback voltage decreases and the output of the gm amplifier is below 0.8V, then the error comparator will trigger the control logic and generate an ON-time period. The ON-time period length is predetermined by the “FIXED tON ESTIMATION” circuitry: VOUT VIN × 600kHz Eq. 1 where VOUT is the output voltage and VIN is the power stage input voltage. At the end of the ON-time period, the internal high-side driver turns off the high-side MOSFET and the low-side driver turns on the low-side MOSFET. The OFF-time period length depends upon the feedback voltage in most cases. When the feedback voltage decreases and the output of the gm amplifier is below 0.8V, the ON-time period is triggered and the OFF-time period ends. If the OFF-time period determined by the feedback voltage is less than the minimum OFF-time tOFF(min), which is about 300ns, then the MIC261203 control logic will apply the tOFF(min) instead. tOFF(min) is required to maintain enough energy in the boost capacitor (CBST) to drive the highside MOSFET. July 2011 tS = 1- 300ns tS Eq. 2 where tS = 1/600kHz = 1.66μs. It is not recommended to use MIC261203 with a OFFtime close to tOFF(min) during steady-state operation. Also, as VOUT increases, the internal ripple injection will increase and reduce the line regulation performance. Therefore, the maximum output voltage of the MIC261203 should be limited to 5.5V and the maximum external ripple injection should be limited to 200mV. Please refer to “Setting Output Voltage” subsection in Application Information for more details. The actual ON-time and resulting switching frequency will vary with the part-to-part variation in the rise and fall times of the internal MOSFETs, the output load current, and variations in the VDD voltage. Also, the minimum tON results in a lower switching frequency in high VIN to VOUT applications, such as 24V to 1.0V. The minimum tON measured on the MIC261203 evaluation board is about 100ns. During load transients, the switching frequency is changed due to the varying OFF-time. To illustrate the control loop operation, both the steadystate and load transient scenarios will be analyzed. Figure 2 shows the MIC261203 control loop timing during steady-state operation. During steady-state, the gm amplifier senses the feedback voltage ripple, which is proportional to the output voltage ripple and the inductor current ripple, to trigger the ON-time period. The ONtime is predetermined by the tON estimator. The termination of the OFF-time is controlled by the feedback voltage. At the valley of the feedback voltage ripple, which occurs when VFB falls below VREF, the OFF period ends and the next ON-time period is triggered through the control logic circuitry. Theory of Operation The MIC261203 is able to operate in either continuous mode or discontinuous mode. The operating mode is determined by the output of the Zero Cross comparator (ZC) as shown in Figure 1. t ON(estimated) = t S - t OFF(min) 15 M9999-071311-A Micrel, Inc. MIC261203 Unlike true current-mode control, the MIC261203 uses the output voltage ripple to trigger an ON-time period. The output voltage ripple is proportional to the inductor current ripple if the ESR of the output capacitor is large enough. The MIC261203 control loop has the advantage of eliminating the need for slope compensation. In order to meet the stability requirements, the MIC261203 feedback voltage ripple should be in phase with the inductor current ripple and large enough to be sensed by the gm amplifier and the error comparator. The recommended feedback voltage ripple is 20mV~100mV. If a low-ESR output capacitor is selected, then the feedback voltage ripple may be too small to be sensed by the gm amplifier and the error comparator. Also, the output voltage ripple and the feedback voltage ripple are not necessarily in phase with the inductor current ripple if the ESR of the output capacitor is very low. In these cases, ripple injection is required to ensure proper operation. Please refer to “Ripple Injection” subsection in Application Information for more details about the ripple injection technique. Figure 2. MIC261203 Control Loop Timing Figure 3 shows the operation of the MIC261203 during a load transient. The output voltage drops due to the sudden load increase, which causes the VFB to be less than VREF. This will cause the error comparator to trigger an ON-time period. At the end of the ON-time period, a minimum OFF-time tOFF(min) is generated to charge CBST since the feedback voltage is still below VREF. Then, the next ON-time period is triggered due to the low feedback voltage. Therefore, the switching frequency changes during the load transient, but returns to the nominal fixed frequency once the output has stabilized at the new load current level. With the varying duty cycle and switching frequency, the output recovery time is fast and the output voltage deviation is small in MIC261203 converter. Discontinuous Mode In continuous mode, the inductor current is always greater than zero; however, at light loads the MIC261203 is able to force the inductor current to operate in discontinuous mode. Discontinuous mode is where the inductor current falls to zero, as indicated by trace (IL) shown in Figure 4. During this period, the efficiency is optimized by shutting down all the nonessential circuits and minimizing the supply current. The MIC261203 wakes up and turns on the high-side MOSFET when the feedback voltage VFB drops below 0.8V. The MIC261203 has a zero crossing comparator that monitors the inductor current by sensing the voltage drop across the low-side MOSFET during its ON-time. If the VFB > 0.8V and the inductor current goes slightly negative, then the MIC261203 automatically powers down most of the IC circuitry and goes into a low-power mode. Once the MIC261203 goes into discontinuous mode, both LSD and HSD are low, which turns off the high-side and low-side MOSFETs. The load current is supplied by the output capacitors and VOUT drops. If the drop of VOUT causes VFB to go below VREF, then all the circuits will wake up into normal continuous mode. First, the bias currents of most circuits reduced during the discontinuous mode are restored, then a tON pulse is triggered before the drivers are turned on to avoid any possible glitches. Finally, the high-side driver is turned on. Figure 4 shows the control loop timing in discontinuous mode. Figure 3. MIC261203 Load Transient Response July 2011 16 M9999-071311-A Micrel, Inc. MIC261203 Current Limit The MIC261203 uses the RDS(ON) of the internal low-side power MOSFET to sense over-current conditions. This method will avoid adding cost, board space and power losses taken by a discrete current sense resistor. The low-side MOSFET is used because it displays much lower parasitic oscillations during switching than the high-side MOSFET. In each switching cycle of the MIC261203 converter, the inductor current is sensed by monitoring the low-side MOSFET in the OFF period. If the inductor current is greater than 26A, then the MIC261203 turns off the highside MOSFET and a soft-start sequence is triggered. This mode of operation is called “hiccup mode” and its purpose is to protect the downstream load in case of a hard short. The load current-limit threshold has a fold back characteristic related to the feedback voltage as shown in Figure 5. Figure 4. MIC261203 Control Loop Timing (Discontinuous Mode) Current Limit Threshold vs. Feedback Voltage 30 CURRENT LIMIT THRESHOLD (A) During discontinuous mode, the zero crossing comparator and the current limit comparator are turned off. The bias current of most circuits are reduced. As a result, the total power supply current during discontinuous mode is only about 450μA, allowing the MIC261203 to achieve high efficiency in light load applications. 25 20 15 10 VDD Regulator The MIC261203 provides a 5V regulated output for input voltage VIN ranging from 5.5V to 28V. When VIN < 5.5V, VDD should be tied to PVIN pins to bypass the internal linear regulator. 5 0 0.0 0.2 0.4 0.6 0.8 1.0 FEEDBACK VOLTAGE (V) Figure 5. MIC261203 Current-Limit Soft-Start Soft-start reduces the power supply input surge current at startup by controlling the output voltage rise time. The input surge appears while the output capacitor is charged up. A slower output rise time will draw a lower input surge current. The MIC261203 implements an internal digital soft-start by making the 0.8V reference voltage VREF ramp from 0 to 100% in about 5ms with 9.7mV steps. Therefore, the output voltage is controlled to increase slowly by a staircase VFB ramp. Once the soft-start cycle ends, the related circuitry is disabled to reduce current consumption. VDD must be powered up at the same time or after VIN to make the soft-start function correctly. July 2011 Foldback Characteristic Power Good (PG) The Power Good (PG) pin is an open drain output which indicates logic high when the output is nominally 92% of its steady state voltage. A pull-up resistor of more than 10kΩ should be connected from PG to VDD. 17 M9999-071311-A Micrel, Inc. MIC261203 MOSFET Gate Drive The Block Diagram (Figure 1) shows a bootstrap circuit, consisting of D1 (a Schottky diode is recommended) and CBST. This circuit supplies energy to the high-side drive circuit. Capacitor CBST is charged, while the low-side MOSFET is on, and the voltage on the SW pin is approximately 0V. When the high-side MOSFET driver is turned on, energy from CBST is used to turn the MOSFET on. As the high-side MOSFET turns on, the voltage on the SW pin increases to approximately VIN. Diode D1 is reverse biased and CBST floats high while continuing to keep the high-side MOSFET on. The bias current of the high-side driver is less than 10mA so a 0.1μF to 1μF is sufficient to hold the gate voltage with minimal droop for the power stroke (high-side switching) cycle, i.e. ΔBST = 10mA x 1.67μs/0.1μF = 167mV. When the low-side MOSFET is turned back on, CBST is then recharged through D1. A small resistor RG, which is in series with CBST, can be used to slow down the turn-on time of the high-side N-channel MOSFET. The drive voltage is derived from the VDD supply voltage. The nominal low-side gate drive voltage is VDD and the nominal high-side gate drive voltage is approximately VDD – VDIODE, where VDIODE is the voltage drop across D1. An approximate 30ns delay between the high-side and low-side driver transitions is used to prevent current from simultaneously flowing unimpeded through both MOSFETs. July 2011 18 M9999-071311-A Micrel, Inc. MIC261203 Maximizing efficiency requires the proper selection of core material and minimizing the winding resistance. The high frequency operation of the MIC261203 requires the use of ferrite materials for all but the most cost sensitive applications. Lower cost iron powder cores may be used but the increase in core loss will reduce the efficiency of the power supply. This is especially noticeable at low output power. The winding resistance decreases efficiency at the higher output current levels. The winding resistance must be minimized although this usually comes at the expense of a larger inductor. The power dissipated in the inductor is equal to the sum of the core and copper losses. At higher output loads, the core losses are usually insignificant and can be ignored. At lower output currents, the core losses can be a significant contributor. Core loss information is usually available from the magnetics vendor. Copper loss in the inductor is calculated by Equation 7: Application Information Inductor Selection Values for inductance, peak, and RMS currents are required to select the output inductor. The input and output voltages and the inductance value determine the peak-to-peak inductor ripple current. Generally, higher inductance values are used with higher input voltages. Larger peak-to-peak ripple currents will increase the power dissipation in the inductor and MOSFETs. Larger output ripple currents will also require more output capacitance to smooth out the larger ripple current. Smaller peak-to-peak ripple currents require a larger inductance value and therefore a larger and more expensive inductor. A good compromise between size, loss and cost is to set the inductor ripple current to be equal to 20% of the maximum output current. The inductance value is calculated by Equation 3: L= PINDUCTOR(Cu) = IL(RMS)2 × RWINDING VOUT × (VIN(max) − VOUT ) VIN(max) × fsw × 20% × IOUT(max) Eq. 3 The resistance of the copper wire, RWINDING, increases with the temperature. The value of the winding resistance used should be at the operating temperature. where: fSW = switching frequency, 600kHz 20% = ratio of AC ripple current-to-DC output current VIN(max) = maximum power stage input voltage The peak-to-peak inductor current ripple is: ΔIL(pp) = VOUT × (VIN(max) − VOUT ) VIN(max) × fsw × L PWINDING(Ht) = RWINDING(20°C) × (1 + 0.0042 × (TH – T20°C)) Eq. 8 where: TH = temperature of wire under full load T20°C = ambient temperature RWINDING(20°C) = room temperature winding resistance (usually specified by the manufacturer) Eq. 4 The peak inductor current is equal to the average output current plus one half of the peak-to-peak inductor current ripple. IL(pk) =IOUT(max) + 0.5 × ΔIL(pp) Output Capacitor Selection The type of the output capacitor is usually determined by its equivalent series resistance (ESR). Voltage and RMS current capability are two other important factors for selecting the output capacitor. Recommended capacitor types are tantalum, low-ESR aluminum electrolytic, OSCON and POSCAP. The output capacitor’s ESR is usually the main cause of the output ripple. The output capacitor ESR also affects the control loop from a stability point of view. Eq. 5 The RMS inductor current is used to calculate the I2R losses in the inductor. 2 IL(RMS) = IOUT(max) + July 2011 ΔIL(PP) 12 Eq. 7 2 Eq. 6 19 M9999-071311-A Micrel, Inc. MIC261203 The maximum value of ESR is calculated: ESR COUT ≤ ΔVOUT(pp) Input Capacitor Selection The input capacitor for the power stage input VIN should be selected for ripple current rating and voltage rating. Tantalum input capacitors may fail when subjected to high inrush currents, caused by turning the input supply on. A tantalum input capacitor’s voltage rating should be at least two times the maximum input voltage to maximize reliability. Aluminum electrolytic, OS-CON, and multilayer polymer film capacitors can handle the higher inrush currents without voltage de-rating. The input voltage ripple will primarily depend on the input capacitor’s ESR. The peak input current is equal to the peak inductor current, so: Eq. 9 ΔIL(PP) where: ΔVOUT(pp) = peak-to-peak output voltage ripple ΔIL(PP) = peak-to-peak inductor current ripple The total output ripple is a combination of the ESR and output capacitance. The total ripple is calculated by Equation 10: 2 ΔVOUT(pp) ΔVIN = IL(pk) × ESRCIN ΔIL(PP) ⎞ ⎛ 2 ⎟ + ΔIL(PP) × ESR C = ⎜⎜ OUT ⎟ C f 8 × × OUT SW ⎠ ⎝ Eq. 10 ( ) The input capacitor must be rated for the input current ripple. The RMS value of input capacitor current is determined at the maximum output current. Assuming the peak-to-peak inductor current ripple is low: where: D = duty cycle COUT = output capacitance value fSW = switching frequency ICIN(RMS) ≈ IOUT(max) × D × (1 − D) ΔIL(PP) Eq. 14 The power dissipated in the input capacitor is: As described in the “Theory of Operation” subsection in the Functional Description section, the MIC261203 requires at least 20mV peak-to-peak ripple at the FB pin to make the gm amplifier and the error comparator behave properly. Also, the output voltage ripple should be in phase with the inductor current. Therefore, the output voltage ripple caused by the output capacitors value should be much smaller than the ripple caused by the output capacitor ESR. If low-ESR capacitors, such as ceramic capacitors, are selected as the output capacitors, a ripple injection method should be applied to provide the enough feedback voltage ripple. Please refer to the “Ripple Injection” subsection for more details. The voltage rating of the capacitor should be twice the output voltage for a tantalum and 20% greater for aluminum electrolytic or OS-CON. The output capacitor RMS current is calculated by Equation 11: ICOUT (RMS) = Eq. 13 PDISS(CIN) = ICIN(RMS)2 × ESRCIN Eq. 15 Ripple Injection The VFB ripple required for proper operation of the MIC261203 gm amplifier and error comparator is 20mV to 100mV. However, the output voltage ripple is generally designed as 1% to 2% of the output voltage. For a low output voltage, such as a 1V, the output voltage ripple is only 10mV to 20mV, and the feedback voltage ripple is less than 20mV. If the feedback voltage ripple is so small that the gm amplifier and error comparator can’t sense it, then the MIC261203 will lose control and the output voltage is not regulated. In order to have some amount of VFB ripple, a ripple injection method is applied for low output voltage ripple applications. Eq. 11 12 The power dissipated in the output capacitor is: 2 PDISS(COUT ) = ICOUT (RMS) × ESR COUT July 2011 Eq. 12 20 M9999-071311-A Micrel, Inc. MIC261203 The applications are divided into three situations according to the amount of the feedback voltage ripple: 1. Enough ripple at the feedback voltage due to the large ESR of the output capacitors. MIC261203 As shown in Figure 6a, the converter is stable without any ripple injection. The feedback voltage ripple is: ΔVFB(pp) = R2 × ESR COUT × ΔIL (pp) R1 + R2 Figure 6c. Invisible Ripple at FB Eq. 16 In this situation, the output voltage ripple is less than 20mV. Therefore, additional ripple is injected into the FB pin from the switching node SW via a resistor Rinj and a capacitor Cinj, as shown in Figure 6c. The injected ripple is: where ΔIL(pp) is the peak-to-peak value of the inductor current ripple. 2. Inadequate ripple at the feedback voltage due to the small ESR of the output capacitors. ΔVFB(pp) = VIN × K div × D × (1 - D) × The output voltage ripple is fed into the FB pin through a feedforward capacitor Cff in this situation, as shown in Figure 6b. The typical Cff value is between 1nF and 100nF. With the feedforward capacitor, the feedback voltage ripple is very close to the output voltage ripple: ΔVFB(pp) ≈ ESR × ΔIL (pp) K div = Eq. 17 R1//R2 R inj + R1//R2 1 Eq. 18 fSW × τ Eq. 19 where VIN = Power stage input voltage D = duty cycle fSW = switching frequency τ = (R1//R2//Rinj) × Cff 3. Virtually no ripple at the FB pin voltage due to the very-low ESR of the output capacitors. MIC261203 In Equations 21 and 22, it is assumed that the time constant associated with Cff must be much greater than the switching period: 1 T = << 1 fSW × τ τ Figure 6a. Enough Ripple at FB Eq. 20 If the voltage divider resistors R1 and R2 are in the kΩ range, a Cff of 1nF to 100nF can easily satisfy the large time constant requirements. Also, a 100nF injection capacitor Cinj is used in order to be considered as short for a wide range of the frequencies. MIC261203 Figure 6b. Inadequate Ripple at FB July 2011 21 M9999-071311-A Micrel, Inc. MIC261203 The process of sizing the ripple injection resistor and capacitors is: Step 1. Select Cff to feed all output ripples into the feedback pin and make sure the large time constant assumption is satisfied. Typical choice of Cff is 1nF to 100nF if R1 and R2 are in kΩ range. Step 2. Select Rinj according to the expected feedback voltage ripple using Equation 22: K div = ΔVFB(pp) VIN × fSW × τ D × (1- D) Eq. 21 Figure 7. Voltage-Divider Configuration Then the value of Rinj is obtained as: R inj = (R1//R2) × ( 1 − 1) K div In addition to the external ripple injection added at the FB pin, internal ripple injection is added at the inverting input of the comparator inside the MIC261203, as shown in Figure 8. The inverting input voltage VINJ is clamped to 1.2V. As VOUT is increased, the swing of VINJ will be clamped. The clamped VINJ reduces the line regulation because it is reflected as a DC error on the FB terminal. Therefore, the maximum output voltage of the MIC261203 should be limited to 5.5V to avoid this problem. Eq. 22 Step 3. Select Cinj as 100nF, which could be considered as short for a wide range of the frequencies. Setting Output Voltage The MIC261203 requires two resistors to set the output voltage as shown in Figure 7. The output voltage is determined by Equation 23: VOUT = VFB × (1 + R1 ) R2 Eq. 23 where VFB = 0.8V. A typical value of R1 can be between 3kΩ and 10kΩ. If R1 is too large, it may allow noise to be introduced into the voltage feedback loop. If R1 is too small, it will decrease the efficiency of the power supply, especially at light loads. Once R1 is selected, R2 can be calculated using: Figure 8. Internal Ripple Injection R2 = July 2011 VFB × R1 VOUT − VFB Eq. 24 22 M9999-071311-A Micrel, Inc. MIC261203 Thermal Measurements Measuring the IC’s case temperature is recommended to insure it is within its operating limits. Although this might seem like a very elementary task, it is easy to get erroneous results. The most common mistake is to use the standard thermal couple that comes with a thermal meter. This thermal couple wire gauge is large, typically 22 gauge, and behaves like a heatsink, resulting in a lower case measurement. Two methods of temperature measurement are using a smaller thermal couple wire or an infrared thermometer. If a thermal couple wire is used, it must be constructed of 36 gauge wire or higher then (smaller wire size) to minimize the wire heat-sinking effect. In addition, the thermal couple tip must be covered in either thermal grease or thermal glue to make sure that the thermal couple junction is making good contact with the case of the IC. Omega brand thermal couple (5SC-TT-K-36-36) is adequate for most applications. Wherever possible, an infrared thermometer is recommended. The measurement spot size of most infrared thermometers is too large for an accurate reading on a small form factor ICs. However, a IR thermometer from Optris has a 1mm spot size, which makes it a good choice for measuring the hottest point on the case. An optional stand makes it easy to hold the beam on the IC for long periods of time. July 2011 23 M9999-071311-A Micrel, Inc. MIC261203 Inductor PCB Layout Guidelines Warning!!! To minimize EMI and output noise, follow these layout recommendations. PCB Layout is critical to achieve reliable, stable and efficient performance. A ground plane is required to control EMI and minimize the inductance in power, signal and return paths. The following guidelines should be followed to insure proper operation of the MIC261203 regulator. IC • A 2.2µF ceramic capacitor, which is connected to the PVDD pin, must be located right at the IC. The PVDD pin is very noise sensitive and placement of the capacitor is very critical. Use wide traces to connect to the PVDD and PGND pins. • A 1.0uF ceramic capacitor must be placed right between VDD and the signal ground SGND. The SGND must be connected directly to the ground planes. Do not route the SGND pin to the PGND Pad on the top layer. • Place the IC close to the point-of-load (POL). • Use fat traces to route the input and output power lines. • Signal and power grounds should be kept separate and connected at only one location. Place the input capacitor next. • Place the input capacitors on the same side of the board and as close to the IC as possible. • Keep both the PVIN pin and PGND connections short. • Place several vias to the ground plane close to the input capacitor ground terminal. • Use either X7R or X5R dielectric input capacitors. Do not use Y5V or Z5U type capacitors. • Do not replace the ceramic input capacitor with any other type of capacitor. Any type of capacitor can be placed in parallel with the input capacitor. • If a Tantalum input capacitor is placed in parallel with the input capacitor, it must be recommended for switching regulator applications and the operating voltage must be derated by 50%. • In “Hot-Plug” applications, a Tantalum or Electrolytic bypass capacitor must be used to limit the overvoltage spike seen on the input supply with power is suddenly applied. July 2011 Keep the inductor connection to the switch node (SW) short. • Do not route any digital lines underneath or close to the inductor. • Keep the switch node (SW) away from the feedback (FB) pin. • The CS pin should be connected directly to the SW pin to accurate sense the voltage across the lowside MOSFET. • To minimize noise, place a ground plane underneath the inductor. • The inductor can be placed on the opposite side of the PCB with respect to the IC. It does not matter whether the IC or inductor is on the top or bottom as long as there is enough air flow to keep the power components within their temperature limits. The input and output capacitors must be placed on the same side of the board as the IC. Output Capacitor Input Capacitor • • • Use a wide trace to connect the output capacitor ground terminal to the input capacitor ground terminal. • Phase margin will change as the output capacitor value and ESR changes. Contact the factory if the output capacitor is different from what is shown in the BOM. • The feedback trace should be separate from the power trace and connected as close as possible to the output capacitor. Sensing a long high current load trace can degrade the DC load regulation. Optional RC Snubber • 24 Place the RC snubber on either side of the board and as close to the SW pin as possible. M9999-071311-A Micrel, Inc. MIC261203 Evaluation Board Schematic Figure 9. Schematic of MIC261203 Evaluation Board (J11, R13, R15 are for testing purposes) July 2011 25 M9999-071311-A Micrel, Inc. MIC261203 Bill of Materials Item Part Number C1 Open 12105C475KAZ2A C2, C3 GRM32ER71H475KA88L C3225X7R1H475K C15 C6, C7, C10 C8 C9 C12 GRM32ER60J107ME20L C11, C16 R1 R2 R3 R4 R5 4.7µF Ceramic Capacitor, X7R, Size 1210, 50V 2 100µF Ceramic Capacitor, X5R, Size 1210, 6.3V 3 0.1µF Ceramic Capacitor, X7R, Size 0603, 50V 3 1.0µF Ceramic Capacitor, X7R, Size 0603, 10V 1 2.2µF Ceramic Capacitor, X5R, Size 0603, 10V 1 4.7nF Ceramic Capacitor, X7R, Size 0603, 50V 1 220µF Aluminum Capacitor, 35V 1 40V, 350mA, Schottky Diode, SOD323 1 Cooper Bussmann(8) 1.0µH Inductor, 21A Saturation Current 1 (3) TDK AVX(1) Murata(2) (3) 06035C104KAT2A AVX(1) GRM188R71H104KA93D Murata(2) (3) C1608X7R1H104K TDK 0603ZC105KAT2A AVX(1) GRM188R71A105KA61D Murata(2) (3) C1608X7R1A105K TDK 0603ZD225KAT2A AVX(1) GRM188R61A225KE34D Murata(2) (3) C1608X5R1A225K TDK 06035C472KAZ2A AVX(1) GRM188R71H472K Murata(2) B41851F7227M (3) TDK EPCOS(4) Open SD103AWS-7 SD103AWS L1 Murata(2) TDK SD103AWS D1 Qty. AVX(1) C3225X5R0J107M C1608X7R1H472K C14 Description Open 12106D107MAT2A C4, C5, C13 Manufacturer HCF1305-1R0-R CRCW06032R21FKEA CRCW06032R00FKEA CRCW060319K6FKEA CRCW06032K49FKEA CRCW060320K0FKEA MCC(5) Diodes Inc(6) (7) Vishay (7) 2.21Ω Resistor, Size 0603, 1% 1 (7) 2.00Ω Resistor, Size 0603, 1% 1 (7) 19.6kΩ Resistor, Size 0603, 1% 1 (7) 2.49kΩ Resistor, Size 0603, 1% 1 (7) 20.0kΩ Resistor, Size 0603, 1% 1 (7) Vishay Dale Vishay Dale Vishay Dale Vishay Dale Vishay Dale R6, R14, R17 CRCW060310K0FKEA Vishay Dale 10.0kΩ Resistor, Size 0603, 1% 3 R7 CRCW06034K99FKEA Vishay Dale(7) 4.99kΩ Resistor, Size 0603, 1% 1 CRCW06032K87FKEA (7) 2.87kΩ Resistor, Size 0603, 1% 1 (7) 2.00kΩ Resistor, Size 0603, 1% 1 (7) 1.18kΩ Resistor, Size 0603, 1% 1 (7) 806Ω Resistor, Size 0603, 1% 1 (7) 475Ω Resistor, Size 0603, 1% 1 R8 R9 R10 R11 R12 July 2011 CRCW06032K006FKEA CRCW06031K18FKEA CRCW0603806RFKEA CRCW0603475RFKEA Vishay Dale Vishay Dale Vishay Dale Vishay Dale Vishay Dale 26 M9999-071311-A Micrel, Inc. MIC261203 Bill of Materials (Continued) Item R13 Part Number CRCW06030000FKEA Manufacturer Description Qty. (7) 0Ω Resistor, Size 0603, 5% 1 (7) Vishay Dale R15 CRCW060349R9FKEA Vishay Dale 49.9Ω Resistor, Size 0603, 1% 1 R16, R18 CRCW06031R21FKEA Vishay Dale(7) 1.21Ω Resistor, Size 0603, 1% 2 R20 Open U1 MIC261203YJL Micrel. Inc.(9) 28V, 12A Hyper Light Load™ Synchronous DC/DC Buck Regulator 1 Notes: 1. AVX: www.avx.com. 2. Murata: www.murata.com. 3. TDK: www.tdk.com. 4. EPCOS: www.epcos.com. 5. SANYO: www.sanyo.com. 6. Diode Inc.: www.diodes.com. 7. Vishay: www.vishay.com. 8. Cooper Bussmann: www.cooperbussmann.com. 9. Micrel, Inc.: www.micrel.com. July 2011 27 M9999-071311-A Micrel, Inc. MIC261203 PCB Layout Recommendations Figure 10. MIC261203 Evaluation Board Top Layer Figure 11. MIC261203 Evaluation Board Mid-Layer 1 (Ground Plane) July 2011 28 M9999-071311-A Micrel, Inc. MIC261203 PCB Layout Recommendations (Continued) Figure 12. MIC261203 Evaluation Board Mid-Layer 2 Figure 13. MIC261203 Evaluation Board Bottom Layer July 2011 29 M9999-071311-A Micrel, Inc. MIC261203 Recommended Land and Solder Stencil Pattern July 2011 30 M9999-071311-A Micrel, Inc. MIC261203 Package Information 28-Pin 5mm x 6mm MLF® (YJL) MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Micrel’s terms and conditions of sale for such products, Micrel assumes no liability whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2011 Micrel, Incorporated. July 2011 31 M9999-071311-A