MICREL SY58038UMG3

Micrel, Inc.
ULTRA PRECISION 8:1 MUX
WITH INTERNAL TERMINATION AND
1:2 LVPECL FANOUT BUFFER
Precision Edge®
SY58038U
®
Precision Edge
SY58038U
FEATURES
■ Selects between 1 of 8 inputs, and provides 2
precision, low skew LVPECL output copies
■ Guaranteed AC performance over temperature and
voltage:
• DC to 4.5Gbps throughput
• <500ps propagation delay IN-to-Q (VIN ≥ 100mV)
• <100ps tr / tf time
• <15ps skew (output-to-output)
■ Unique, patent-pending, channel-to-channel
isolation design provides superior crosstalk
performance
■ Ultra-low jitter design:
• <1psRMS random jitter
• <10psPP deterministic jitter
• <10psPP total jitter (clock)
• <1psRMS cycle-to-cycle jitter
• <0.7psRMS crosstalk-induced jitter
■ Unique, patent-pending, input termination and VT
pin accepts DC- and AC-coupled inputs (CML, PECL,
LVDS)
■ 800mV LVPECL output swing
■ Power supply 2.5V ±5% or 3.3V ±10%
■ –40°C to +85°C temperature range
■ Available in 44-pin (7mm × 7mm) MLF™ package
Precision Edge®
DESCRIPTION
The SY58038U is a low jitter, low skew, high-speed 8:1
multiplexer with a 1:2 differential fanout buffer optimized for
precision telecom and enterprise server distribution
applications. The SY58038U distributes clock frequencies
from DC to 3.5GHz, and data rates to 4.5Gpbs guaranteed
over temperature and voltage.
The SY58038U differential input includes Micrel’s unique,
3-pin input termination architecture that directly interfaces
to any differential signal (AC- or DC-coupled) as small as
100mV without any level shifting or termination resistor
networks in the signal path. The outputs are 800mV, 100K
compatible LVPECL with extremely fast rise/fall times
guaranteed to be less than 100ps.
The SY58038U features a patent-pending isolation design
that significantly improves channel-to-channel crosstalk
performance.
The SY58038U operates from a 2.5V ±5% or 3.3V ±10%
supply and is guaranteed over the full industrial temperature
range of –40°C to +85°C. The SY58038U is part of Micrel’s
high-speed, Precision Edge® product line.
Data sheets and support documentation can be found on
Micrel’s web site at www.micrel.com.
APPLICATIONS
■
■
■
■
Data communication systems
All SONET/SDH data/clock applications
All Fibre Channel applications
All Gigabit Ethernet applications
Precision Edge is a registered trademark of Micrel, Inc.
MLF and MicroLeadFrame are trademarks of Amkor Technology, Inc.
M9999-051305
[email protected] or (408) 955-1690
Rev.: B
1
Amendment: /0
Issue Date: May 2005
Precision Edge®
SY58038U
Micrel, Inc.
FUNCTIONAL BLOCK DIAGRAM
IN0
50Ω
VT0
50Ω
/IN0
VREF-AC0
IN1
50Ω
VT1
50Ω
/IN1
IN2
50Ω
8:1 MUX
VT2
50Ω
0
/IN2
VREF-AC1
IN3
1
50Ω
50Ω
Q0
3
/IN3
/Q0
4 MUX
IN4
50Ω
5
50Ω
6
VT4
/IN4
VREF-AC2
IN5
Q1
/Q1
7
S2
S1
S0
50Ω
VT5
50Ω
/IN5
IN6
50Ω
VT6
50Ω
/IN6
VREF-AC3
IN7
50Ω
VT7
50Ω
/IN7
SEL0 (CMOS/TTL)
SEL1 (CMOS/TTL)
SEL3 (CMOS/TTL)
TRUTH TABLE
SEL2
SEL1
SEL0
Q
/Q
L
L
L
IN0
/IN0
L
L
H
IN1
/IN1
L
H
L
IN2
/IN2
L
H
H
IN3
/IN3
H
L
L
IN4
/IN4
H
L
H
IN5
/IN5
H
H
L
IN6
/IN6
H
H
H
IN7
/IN7
M9999-051305
[email protected] or (408) 955-1690
1:2 Fanout
2
VT3
2
Precision Edge®
SY58038U
Micrel, Inc.
PACKAGE/ORDERING INFORMATION
VT5
/IN5
/IN6
VT6
/IN6
VREF-AC3
IN7
VT7
/IN7
SEL2
NC
Ordering Information(1)
44 43 42 41 40 39 38 37 36 35 34
IN5
VREF-AC2
/IN4
VT4
IN4
NC
/IN3
VT3
IN3
VREF-AC1
/IN2
1
33
2
32
3
31
4
30
5
29
6
28
7
27
8
26
25
24
23
9
10
11
Package Operating
Type
Range
Part Number
VT2
IN2
/IN1
VT1
IN1
VREF-AC0
/IN0
VT0
IN0
SEL1
SEL2
12 13 14 15 16 17 18 19 20 21 22
GND
VCC
/Q1
Q1
VCC
GND
VCC
/Q0
Q0
VCC
GND
Package
Marking
Lead
Finish
SY58038U
Sn-Pb
SY58038UMI
MLF-44
Industrial
SY58038UMITR(2)
MLF-44
Industrial
SY58038U
Sn-Pb
SY58038UMG(3)
MLF-44
Industrial
SY58038U with
Pb-Free bar-line indicator
Pb-Free
NiPdAu
SY58038UMGTR(2, 3)
MLF-44
Industrial
SY58038U with
Pb-Free bar-line indicator
Pb-Free
NiPdAu
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC electricals only.
2. Tape and Reel.
3. Pb-Free package recommended for new designs.
44-Pin MLF™ (MLF-44)
PIN DESCRIPTION
Pin Number
Pin Name
Pin Function
20, 18,
16, 14,
13, 11,
9, 7,
5, 3,
1, 43,
42, 40,
38, 36
IN0, /IN0,
IN1, /IN1,
IN2, /IN2,
IN3, /IN3,
IN4, /IN4,
IN5,/IN5,
IN6, /IN6,
IN7, /IN7
Differential Inputs: These input pairs are the differential signal inputs to the device. Inputs accept
AC or DC-coupled signals as small as 100mV. Each pin of a pair internally terminates to a VT
pin through 50Ω. Note that these inputs will default to an indeterminate state if left open.
Please refer to the “Input Interface Applications” section for more details.
19,15,
12, 8,
4, 44,
41, 37
VT0, VT1
VT2, VT3,
VT4, VT5,
VT6, VT7
Input Termination Center-Tap: Each side of the differential input pair terminates to a VT pin.
The VT pins provide a center-tap to a termination network for maximum interface flexibility.
See “Input Interface Applications” section for more details. For a CML or LVDS inputs, the VT
pin is left floating.
17,
10,
2
39
VREF-AC0,
VREF-AC1,
VREF-AC2,
VREF-AC3
Reference Voltage: This output biases to VCC–1.2V. It is used when AC coupling the inputs
(IN, /IN). For AC-coupled applications, connect VREF_AC to the VT pin and bypass with a
0.01µF low ESR capacitor to VCC. See “Input Interface Applications” section for more details.
21,
22,
35
SEL0,
SEL1,
SEL2
24, 27, 29, 32
VCC
25, 26,
30, 31
Q0,/Q0,
Q1,/Q1
23, 28, 33
GND,
Exposed Pad
The single-ended TTL/CMOS-compatible inputs select the inputs to the multiplexer. Note that
this input is internally connected to a 25kΩ pull-up resistor and will default to a logic HIGH state
if left open.
Positive Power Supply. Bypass with 0.1µF0.01µF low ESR capacitors as close to each VCC
pin.
Differential Outputs: These LVPECL output pairs are the outputs of the device. Unused output
pairs may be left open. Each output is designed to drive 800mV into 50Ω terminated to VCC–2V.
(or VCC–1.2V if AC-coupled).
Ground. GND and exposed pad must both be connected to the most negative potential of chip
ground.
3
Precision Edge®
SY58038U
Micrel, Inc.
Absolute Maximum Ratings(1)
Operating Ratings(2)
Power Supply Voltage (VCC ) ...................... –0.5V to +4.0V
Input Voltage (VIN) ......................................... –0.5V to VCC
LVPECL Output Current (IOUT)
Continuous ............................................................. 50mA
Surge .................................................................... 100mA
Termination Current(3)
Source or sink current on VT pin ........................ ±100mA
Lead Temperature (soldering, 20 sec.) ..................... 260°C
Storage Temperature Range (TS ) ........... –65°C to +150°C
Power Supply Voltage (VCC) ............... +2.375V to +2.625V
............................................................ +3.0V to +3.6V
Ambient Temperature Range (TA) ............. –40°C to +85°C
Package Thermal Resistance(4)
MLF™ (θJA)
Still-Air ............................................................. 24°C/W
MLF™ (ψJB)
Junction-to-board ............................................ 12°C/W
DC ELECTRICAL CHARACTERISTICS(5)
TA= –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage
VCC = 2.5V.
2.375
2.5
2.625
V
VCC = 3.3V.
3.0
3.3
3.6
V
120
170
mA
ICC
Power Supply Current
RIN
Input Resistance (IN-to-VT)
40
50
60
Ω
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
80
100
120
Ω
VIH
Input HIGH Voltage
(IN-to-/IN)
VCC–1.6
VCC
V
VIL
Input LOW Voltage
(IN-to-/IN)
0
VIH–0.1
V
See Figure 1a.
0.1
1.7
V
See Figure 1b.
0.2
VIN
Input Voltage Swing
(IN-to-/IN)
VDIFF_IN
Differential Input Voltage Swing
(IN-to-/IN)
VT_IN
IN-to-VT (IN-to-/IN)
VREF-AC
Output Reference Voltage
No load, max. VCC.
Note 6
V
1.28
VCC–1.3 VCC–1.2 VCC–1.1
V
V
Notes:
1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability, use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. ΨJB uses 4-layer
θJA in still-air number unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIH (min), not lower than 1.2V.
4
Precision Edge®
SY58038U
Micrel, Inc.
LVPECL OUTPUT DC ELECTRICAL CHARACTERISTICS(7)
VCC = 2.5V ±5% or 3.3V ±10%; TA= –40°C to +85°C; RL = 50Ω to VCC–2V, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOH
Output HIGH Voltage
Q, /Q
VCC–1.145
VCC–0.895
V
VOL
Output LOW Voltage
Q, /Q
VCC–1.945
VCC–1.695
V
VOUT
Output Differential Swing
Q, /Q
See Figure 1a.
550
800
mV
VDIFF_OUT
Differential Output Voltage Swing
Q, /Q
See Figure 1b.
1100
1600
mV
Min
Typ
LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS(7)
VCC = 2.5V ±5% or 3.3V ±10%; TA= –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIH
Input HIGH Current
–125
IIL
Input LOW Current
–300
2.0
Note:
7. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5
Max
Units
VCC
V
0.8
V
30
µA
µA
Precision Edge®
SY58038U
Micrel, Inc.
AC ELECTRICAL CHARACTERISTICS(8)
VCC = 2.5V ±5% or 3.3V ±10%; TA= –40°C to +85°C, RL = 50Ω to VCC–2V, unless otherwise stated.
Symbol
Parameter
Condition
fMAX
Maximum Operating Frequency
Min
NRZ data
4.5
Clock
3.5
5
280
390
VOUT ≥ 400mV
tpd
Differential Propagation Delay
(IN-to-Q)
tJITTER
Output-to-Output Skew
Data
Clock
tr, tf
Units
Gbps
150
Differential Propagation Delay
Temperature Coefficient
tSKEW
Max
GHz
VIN ≥ 100mV
(SEL-to-Q)
∆tpd Tempco
Typ
500
ps
600
ps
220
fs/°C
Note 9
15
ps
Part-to-Part Skew
Note 10
150
ps
Random Jitter (RJ)
Note 11
1
psRMS
Deterministic Jitter (DJ)
Note 12
10
psRMS
Cycle-to-Cycle Jitter
Total Jitter (TJ)
Note 13
Note 14
1
10
psPP
psRMS
Crosstalk-induced Jitter
Note 15
0.7
psRMS
100
ps
Output Rise/Fall Time
At full output swing, 20% to 80%.
35
65
Notes:
8. High-frequency AC-parameters are guaranteed by design and characterization.
9. Output-to-output skew is measured between two different outputs under identical input transitions.
10. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the
respective inputs.
11. Random jitter is measured with a K28.7 character pattern, measured at <fMAX.
12. Deterministic jitter is measured at 2.5Gbps/3.2Gbps, with both K28.5 and 223–1 PRBS pattern.
13. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn – Tn–1 where T is the time between rising edges of the output
signal.
14. Total jitter definition: with an ideal clock input of frequency <fMAX, no more than one output edge in 1012 output edges will deviate by more than the
specified peak-to-peak jitter value.
15. Crosstalk is measured at the output while applying two similar differential clock frequencies that are asynchronous with respect to each other at the
inputs.
SINGLE-ENDED AND DIFFERENTIAL SWINGS
VDIFF_IN,
VDIFF_OUT 1600mV (Typ.)
VIN,
VOUT 800mV (Typ.)
Figure 1a. Single-Ended Voltage Swing
Figure 1b. Differential Voltage Swing
6
Precision Edge®
SY58038U
Micrel, Inc.
TYPICAL OPERATING CHARACTERISTICS
VCC = 3.3V, GND = 0, VIN = 100mV, TA = 25°C, unless otherwise stated.
Output Amplitude
vs. Frequency
Within Device Skew
vs. Temperature
1.2
800
700
600
500
400
300
0
1000 2000 3000 4000 5000
FREQUENCY (MHz)
365
PROPAGATION DELAY (ps)
WITHIN DEVICE SKEW (ps)
OUTPUT AMPLITUDE (mV)
900
1.0
0.8
0.6
0.4
0.2
0
-40 -20
0
20
40
60
80 100
TEMPERATURE (°C)
7
Propagation Delay
vs. Temperature
360
355
350
345
340
335
330
-40 -20
0
20
40
60
80 100
TEMPERATURE (°C)
Precision Edge®
SY58038U
Micrel, Inc.
FUNCTIONAL CHARACTERISTICS
VCC = 3.3V, GND = 0, VIN = 100mV, TA = 25°C, unless otherwise stated.
1.25Gbps Output (Q – /Q)
Output Swing
(400mV/div.)
Output Swing
(400mV/div.)
2.5Gbps Output (Q – /Q)
TIME (100ps/div.)
3.2Gbps Output (Q – /Q)
200MHz Output (Q – /Q)
Output Swing
(400mV/div.)
Output Swing
(400mV/div.)
TIME (200ps/div.)
TIME (600ps/div.)
1.25GHz Output (Q – /Q)
2.5GHz Output (Q – /Q)
Output Swing
(400mV/div.)
Output Swing
(400mV/div.)
TIME (75ps/div.)
TIME (50ps/div.)
TIME (100ps/div.)
8
Precision Edge®
SY58038U
Micrel, Inc.
Output Swing
(400mV/div.)
5GHz Output (Q – /Q)
TIME (30ps/div.)
9
Precision Edge®
SY58038U
Micrel, Inc.
INPUT AND OUTPUT STAGES
VCC
VCC
IN
50Ω
VT
GND
50Ω
/Q
/IN
Q
Figure 2a. Simplified Differential Input Stage
Figure 2b. Simplified LVPECL Output Stage
INPUT INTERFACE APPLICATIONS
VCC
VCC
VCC
IN
IN
LVPECL
LVPECL
/IN
VCC
GND
IN
/IN
SY58038U
0.01µF
NC
Rpd
Rpd
VT
SY58038U
VCC
VT
VREF-AC
VREF-AC
GND
For VCC = 3.3V, Rpd = 50Ω.
For VCC = 2.5V, Rpd = 19Ω.
Figure 3a. LVPECL
Interface (DC-Coupled)
0.01µF
For 3.3V, Rpd = 100Ω.
For 2.5V, Rpd = 50Ω.
Figure 3b. LVPECL
Interface (AC-Coupled)
VCC
VCC
IN
CML
IN
/IN
SY58038U
LVDS
/IN
GND
VCC
SY58038U
VT
VREF-AC
0.01µF
Figure 3d. CML
Interface (AC-Coupled)
GND
/IN
SY58038U
Rpd
GND
CML
NC
VT
NC
VREF-AC
Figure 3e. LVDS Interface
10
GND
NC
VT
NC
VREF-AC
Option: May connect VT to VCC.
Figure 3c. CML
Interface (DC-Coupled)
Precision Edge®
SY58038U
Micrel, Inc.
OUTPUT INTERFACE APPLICATIONS
+3.3V
+3.3V
ZO = 50Ω
R1
130Ω
+3.3V
R1
130Ω +3.3V
+3.3V
Zo = 50Ω
Zo = 50Ω
ZO = 50Ω
VCC
R2
82Ω
R2
82Ω
50Ω
C1
0.01µF
(optional)
Figure 4a. Parallel Thevenin-Equivalent
Termination
50Ω
Rb
Figure 4b. Parallel Termination
(3-Resistor)
Note:
Note:
For +2.5V system, R1 = 250Ω, R2 = 62.5Ω.
For +2.5V system, Rb =19Ω.
For +3.3V system, Rb = 50Ω.
RELATED MICREL PRODUCTS AND SUPPORT DOCUMENTATION
Part Number
Function
Data Sheet Link
SY58037U
Ultra Precision 8:1 MUX with Internal Termination
and 1:2 CML Fanout Buffer
http://www.micrel.com/product-info/products/sy58037u.shtml
SY58038U
Ultra Precision 8:1 MUX with Internal Termination
and 1:2 LVPECL Fanout Buffer
http://www.micrel.com/product-info/products/sy58038u.shtml
SY58039U
Ultra Precision 8:1 MUX with Internal Termination
and 1:2 400mV LVPECL Fanout Buffer
http://www.micrel.com/product-info/products/sy58039u.shtml
MLF™ Application Note
www.amkor.com/products/notes_papers/MLF_AppNote_0902.pdf
New Products and Applications
www.micrel.com/product-info/products/solutions.shtml
HBW Solutions
11
Precision Edge®
SY58038U
Micrel, Inc.
44 LEAD MicroLeadFrame™ (MLF-44)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heat Dissipation
VEE
Heavy Copper Plane
VEE
Heavy Copper Plane
PCB Thermal Consideration for 44-Pin MLF™ Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC.
TEL
2180 FORTUNE DRIVE SAN JOSE, CA 95131
+ 1 (408) 944-0800
FAX
+ 1 (408) 474-1000
WEB
USA
http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
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