SY88309BL 3.3V, 3.2Gbps PECL Limiting Post Amplifier with Wide Signal-Detect Range General Description Features The SY88309BL low-power limiting post amplifiers are designed for use in fiber-optic receivers. These devices connect to typical transimpedance amplifiers (TIAs). The linear signal output from TIAs can contain significant amounts of noise and may vary in amplitude over time. The SY88309BL quantizes these signals and output PECL-level waveforms. The SY88309BL operates from a single +3.3V power supply, over temperatures ranging from –40oC to +85oC. With their wide bandwidth and high gain, signals with data rates up to 3.2Gbps, and as small as 10mVpp, can be amplified to drive devices with CML or PECL inputs. It generates a Signal Detect (SD) open-collector TTL output. The SD function is optimized to detect a larger and wider input range, as shown in the characteristic curve on page 6. A programmable signal-detect level set pin (SDLVL) sets the sensitivity of the input amplitude detection. SD asserts high if the input amplitude rises above the threshold sets by SDLVL and de-asserts low otherwise. The SD output can be fed back to the EN input to maintain stability. Typically, 3.5dB LOS/SD hysteresis is provided to prevent chattering. Datasheet and support documentation can be found on Micrel’s web site at: www.micrel.com. • Signal Detect circuit optimized to detect a larger and wider input range (20mVPP-140mVPP) • Chatter-free Open-Collector TTL Signal-Detect (SD) • Single 3.3V power supply • 155Mbps to 3.2Gbps operation • Low-noise PECL data outputs • Programmable SD level set (SDLVL) • Available in a tiny 10-pin EPAD-MSOP and 16-pin QFN package Applications • • • • • PON Gigabit Ethernet 1X and 2X Fibre Channel SONET/SDH:OC-3/12/24/48 – STM 1/4/8/16 High-gain line driver and line receiver Markets • • • • • FTTX Optical transceivers Datacom/Telecom Low-gain TIA interface Long-reach FOM Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com November 2007 M9999-111507-C [email protected] or (408) 955-1690 Micrel, Inc. SY88309BL Typical Application Pin Configuration 10-Pin EPAD-MSOP (K10-2) 16-Pin QFN Ordering Information Package Type Operating Range Package Marking Lead Finish SY88309BLEY K10-2 Industrial 309B with Pb-Free bar line indicator Matte-Sn Pb-free SY88309BLEYTR(1) K10-2 Industrial 309B with Pb-Free bar line indicator Matte-Sn Pb-free SY88309BLMG QFN-16 Industrial 309B with Pb-Free bar line indicator NiPdAu Pb-free SY88309BLMGTR(1) QFN-16 Industrial 309B with Pb-Free bar line indicator NiPdAu Pb-free Part Number Note: 1. Tape and Reel. November 2007 2 M9999-111507-C [email protected] or (408) 955-1690 Micrel, Inc. SY88309BL Pin Description Pin Number (MSOP) Pin Number (QFN) Pin Name Type 1 15 EN TTL Input: Default is high. 2 1 DIN Data Input True data input with 50Ω termination to VREF. 3 4 /DIN Data Input Complementary data input with 50Ω termination to VREF. 4 6 VREF 5 14 SDLVL Input Signal-detect Level Set: A resistor from this pin to VCC sets the threshold for the data input amplitude at which the SD output will be asserted. 6 Exposed Pad 2, 3, 10, 11 Exposed Pad GND Ground Device ground. Exposed pad must be connected to PCB ground plane. 7 SD Open Collector TTL Output 8 9 /DOUT PECL Output Complementary data output. 9 12 DOUT PECL Output True data output. 10 5, 8, 13, 16 VCC Power supply Positive power supply. 7 November 2007 Pin Function Enable: De-asserts true data output when LOW. Reference Voltage: Placing a capacitor here to VCC helps stabilize SDLVL. 3 Signal-detect: Asserts high when the data input amplitude rises above the threshold sets by SDLVL. For proper operation, install an external 4.75kΩ pull-up resistor at this output. M9999-111507-C [email protected] or (408) 955-1690 Micrel, Inc. SY88309BL Absolute Maximum Ratings(1) Operating Ratings(2) Supply Voltage (VCC) .................................... 0V to +4.0V Input Voltage (DIN, /DIN) ................................... 0 to VCC Output Current (IOUT) Continuous.....................................................+50mA Surge ...........................................................+100mA /EN Voltage ........................................................ 0 to VCC VREF Current .......................................-800µA to +500µA Voltage ......................................................... VREF to VCC Lead Temperature (soldering, 20sec.) .................. 260°C Storage Temperature (Ts) .....................-65°C to +150°C Supply Voltage (VCC)............................ +3.0V to +3.6V Ambient Temperature (TA).................. –40°C to +85°C Junction Temperature (TJ) ................ –40°C to +125°C Junction Thermal Resistance(3) EPAD-MSOP θJA (Still-Air) .............................................. 38oC/W ψJB ............................................................ 22oC/W QFN θJA (Still-Air) .............................................. 61oC/W ψJB ............................................................ 38oC/W DC Electrical Characteristics VCC = 3.0V to 3.6V; RL = 50Ω to VCC-2V; TA = –40°C to +85°C; typical values at VCC = 3.3V, TA = 25oC. Symbol Parameter Condition ICC Power Supply Current No output load Min Typ Max Units 38 60 mA VCC V VSDLVL SDLVL Voltage VOH PECL Output HIGH Voltage VCC-1.085 VCC-0.955 VCC-0.880 VREF V VOL PECL Output LOW Voltage VCC-1.830 VCC-1.705 VCC-1.555 V VOFFSET Differential Output Offset VREF Reference Voltage ZI Single-Ended Input Impedance +160 mV VCC-1.48 VCC-1.32 VCC-1.16 V 40 50 60 Ω Min Typ Max Units 0.8 V 20 µA 100 µA TTL DC Electrical Characteristics VCC = 3.0V to 3.6V; TA = –40°C to +85°C. Symbol Parameter Condition VIH EN Input HIGH Voltage VIL EN Input LOW Voltage IIH EN Input HIGH Current IIL EN Input LOW Current VIN = 0.5V IOH SD Output Leakage VOH = 3.6V 100 µA VOL SD Output LOW Level IOL = +4mA 0.5 V 2.0 VIN = 2.7V VIN = VCC V -300 µA Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Thermal performance assumes the use of a 4-layer PCB. Exposed pad must be soldered (or equivalent) to the device’s most negative potential on the PCB. November 2007 4 M9999-111507-C [email protected] or (408) 955-1690 Micrel, Inc. SY88309BL AC Electrical Characteristics VCC = 3.0V to 3.6V; RL = 50Ω to VCC-2V; TA = –40°C to +85°C; typical values at VCC = 3.3V, TA = +25°C. Symbol Parameter Condition tr, tf Output Rise/Fall Time (20% to 80%) Note 4 tJITTER Min Typ Max Units 150 ps Deterministic Note 5 15 psPP Random Note 6 5 psRMS VID Differential Input Voltage Swing Figure 1 VOD Differential Output Voltage Swing VID > 12mVPP, Figure 1 TOFF SD Assert Time 2 10 µs TON SD De-assert Time 2 10 µs SDAL Low SD Assert Level 5 1800 1500 RSDLVL = 15kΩ, Note 8 mVPP mVPP 27 mVPP SDDL Low SD De-assert Level RSDLVL = 15kΩ, Note 8 18 mVPP HYSL Low SD/LOS Hysteresis RSDLVL = 15kΩ, Note 7 3.4 dB SDAM Medium SD Assert Level RSDLVL = 5kΩ, Note 8 53 80 mVPP SDDM Medium SD De-assert Level RSDLVL = 5kΩ, Note 8 21 36 HYSM Medium SD/LOS Hysteresis RSDLVL = 5kΩ, Note 7 2 3.5 6 dB SDAH High SD Assert Level RSDLVL = 100Ω, Note 8 137 200 mVPP SDDH High SD De-assert Level RSDLVL = 100Ω, Note 8 70 94 HYSH High SD/LOS Hysteresis RSDLVL = 100Ω, Note 7 2 3.5 B-3dB 3dB Bandwidth 1.8 GHz AV(Diff) Differential Voltage Gain 42 dB S21 Single-ended Small-Signal Gain 36 dB 30 mVPP mVPP 6 dB Notes: 4. Amplifier in limiting mode. Input is a 200MHz, 100mVpp square wave. 5. Deterministic jitter measured using 3.2Gbps K28.5 pattern, VID = 10mVPP. 6. Random jitter measured using 3.2Gbps K28.7 pattern, VID = 10mVPP. 7. This specification defines electrical hysteresis as 20log (LOS De-assert/LOS Assert). The ratio between optical hysteresis and electrical hysteresis is found to vary between 1.5 and 2, depending upon the level of received optical power and ROSA characteristics. Based upon that ratio, the optical hysteresis corresponding to the electrical hysteresis range 2dB-6dB, shown in the AC characteristics table, will be 1dB-3dB Optical Hysteresis. 8. See “Typical Operating Characteristics” for a graph showing how to choose a particular RSDLVL for a particular SD assert and its associated deassert amplitude. November 2007 5 M9999-111507-C [email protected] or (408) 955-1690 Micrel, Inc. SY88309BL Typical Operating Characteristics SD Assert SD De-assert Functional Characteristics November 2007 6 M9999-111507-C [email protected] or (408) 955-1690 Micrel, Inc. SY88309BL Functional Block Diagram Detailed Description stage. The SY88309BL low-power limiting post amplifiers operate from a single +3.3V power supply, over temperatures from –40oC to +85oC. Signals with data rates up to 3.2Gbps and as small as 10mVpp can be amplified. Figure 1 shows the allowed input voltage swing. The SY88309BL generates an SD output allowing feedback to EN for output stability. SDLVL sets the sensitivity of the input amplitude detection. Signal Detect The SY88309BL generates a chatter-free SD opencollector TTL output, as shown in Figure 4. SD asserts high if the input amplitude rises above the threshold sets by SDLVL and de-asserts low otherwise. The SD output can be fed back to the EN input to maintain stability Input Amplifier/Buffer Figure 2 shows a simplified schematic of the input stage. The high-sensitivity of the input amplifier allows signals as small as 10mVpp to be amplified. The input amplifier also allows input signals as large as 1800mVPP. Input signals below 12mVPP are linearly amplified with a typical 42dB differential voltage gain. Since it is a limiting amplifier, these devices output typically 1500mVPP voltage-limited waveforms for input signals greater than 12mVPP. Applications requiring the SY88309BL to operate with strong signals should have the upstream TIA placed as close as possible to the devices’ input pins. This ensures the best performance of the device. Output Buffer The SY88309BL PECL output buffers are designed to drive 50Ω lines. The output buffer requires appropriate termination for proper operation. An external 50Ω resistor to VCC-2V for each output pin provides this. Figure 3 shows a simplified schematic of the output November 2007 Signal-Detect Level Set Programmable SD level set pin (SDLVL) sets the threshold of the input amplitude detection. Connecting an external resistor between VCC and SDLVL set the voltage at SDLVL. This voltage ranges from VCC to VREF. The external resistor creates a voltage divider between VCC and VREF, as shown in Figure 5. Hysteresis The SY88309BL typically provide 3.5dB SD electrical hysteresis. By definition, a power ratio measured in dB is 10log (power ratio). Power is calculated as V2IN/R for an electrical signal. Hence, the same ratio can be stated as 20log (voltage ratio). While in linear mode, the electrical voltage input changes linearly with the optical power and therefore, the ratios change linearly. Thus, the optical hysteresis in dB is half the electrical hysteresis in dB given in the data sheet. Since the SY88309BL are electrical devices, this data sheet refers to hysteresis in electrical terms. With 3.5dB SD hysteresis, a voltage factor of 1.5 is required to assert or de-assert SD. 7 M9999-111507-C [email protected] or (408) 955-1690 Micrel, Inc. SY88309BL Figure 1. VIS and VID Figure 2. Input Structure Figure 3. Output Structure Figure 4. SD Output Structure Figure 5. SDLVL Setting Circuit November 2007 8 M9999-111507-C [email protected] or (408) 955-1690 Micrel, Inc. SY88309BL Package Information 10-Pin EPAD-MSOP (K10-2) November 2007 9 M9999-111507-C [email protected] or (408) 955-1690 Micrel, Inc. SY88309BL 16-Pin QFN PCB Thermal Consideration for 16-Pin QFN Package (Always solder, or equivalent, the exposed pad to the PCB) Package Notes: 1. Package meets Level 2 qualification. 2. All parts are dry-packaged before shipment. 3. Exposed pad must be soldered to a ground for proper thermal management, solder void has to be less than 50% of the epad area. November 2007 10 M9999-111507-C [email protected] or (408) 955-1690 Micrel, Inc. SY88309BL MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2007 Micrel, Incorporated. November 2007 11 M9999-111507-C [email protected] or (408) 955-1690