MICREL SY89851U

SY89851U
Low Power, 3GHz, 1:2 LVPECL Fanout
Buffer/Translator with Internal Termination
General Description
The SY89851U is a low jitter, low skew, high-speed
1:2 differential fanout buffer optimized for precision
telecom
and
enterprise
server
distribution
applications. The SY89851U distributes clock
frequencies from DC to >3GHz, and data rates to
2.5Gbps guaranteed over temperature and voltage.
The SY89851U differential input includes Micrel's
unique, 3-pin input termination architecture that
directly interfaces to any differential signal (AC- or
DC-coupled) as small as 100mV (200mVpp) without
any level shifting or termination resistor networks in
the signal path. The outputs are 800mV, 100Kcompatible LVPECL with extremely fast rise/fall time
guaranteed to be less than 180ps.
The SY89851U operates from a 2.5V ±5% or 3.3V
±10% supply and is guaranteed over the full
industrial temperature range of –40°C to +85°C. The
SY89851U is part of Micrel's high-speed, Precision
®
Edge product line.
All support documentation can be found on Micrel's
web site at www.micrel.com.
Functional Block Diagram
Precision Edge
®
Features
• Precision 1:2, 800mV LVPECL fanout buffer
• Low power consumption: 80mW typ. (2.5V)
• Guaranteed AC performance over temperature
and voltage:
– DC to >3GHz clock throughput
– <340ps propagation delay
– <180ps rise/fall time
– <20ps output-to-output skew
• Ultra-low jitter design:
– <1psRMS random jitter
– <10psPP deterministic jitter
– <10psPP total jitter (clock)
• Unique, patented input termination and VT pin
accepts DC- and AC-coupled inputs (CML,
LVPECL, LVDS)
• 100K LVPECL-compatible outputs
• Power supply 2.5V ±5% or 3.3V ±10%
• –40°C to +85°C industrial temperature range
• Available in 16-pin (3mm x 3mm) QFN package
Applications
•
•
•
•
All SONET and GigE clock distribution
Fibre Channel applications
Backplane distribution
High-end, low skew, multiprocessor synchronous
clock distribution
Precision Edge is a registered trademark of Micrel, Inc.
July 2005
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SY89851U
Ordering Information(1)
Part Number
Package Type
Operating Range
Package Marking
Lead Finish
SY89851UMG
QFN-16
Industrial
851U with
Pb-Free bar-line indicator
Pb-Free
NiPdAU
QFN-16
Industrial
851U with
Pb-Free bar-line indicator
Pb-Free
NiPdAu
(2)
SY89851UMGTR
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC Electricals only.
2. Tape and Reel.
Pin Configuration
16-Pin QFN
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SY89851U
Pin Description
Pin Number
Pin Name
1,4
IN, /IN
Differential Inputs: This input pair is the differential signal input to the device.
Inputs accept AC- or DC-coupled signals as small as 100mV (200mVpp). Each
pin terminates to a VT pin through 50Ω. Note that these inputs will default to an
indeterminate state if left open. Please refer to the "Input Interface Applications"
section for more details.
2
VT
Input Termination Center-Tap: Each side of the differential input pair terminates
to a VT pin. The VT pins provide a center-tap to a termination network for
maximum interface flexibility. See “Input Interface Applications” section for more
details.
3
VREF-AC
Reference Voltage: This output biases to VCC–1.2V. It is used when ACcoupling the inputs (IN, /IN). For AC-coupled applications, connect VREF-AC to the
VT pin and bypass with a 0.01µF low ESR capacitor to VCC. Maximum
sink/source current is ±1.5mA. See “Input Interface Applications” section for
more details.
5,8,13,16
VCC
12,11
9,10
Q0, /Q0,
Q1, /Q1
6,7,14,15
GND,
Exposed Pad
July 2005
Pin Function
Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors and
place as close to each VCC pin as possible.
Differential Outputs: These 100K LVPECL-compatible output pairs are the
precision, low skew copies of the inputs. Unused output pairs may be left open.
Terminate with 50Ω to VCC–2V. See “LVPECL Output Interface Application”
section for more details.
Ground. GND and exposed pad must both be connected to the same ground
plane.
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SY89851U
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VCC) .......................... –0.5V to +4.0V
Input Voltage (IN, /IN) .............................–0.5V to VCC
LVPECL Output Current (IOUT)
Continuous ............................................... ±50mA
Surge ...................................................... ±100mA
Termination Current
Source or sink current on VT .................. ±100mA
VREF-AC Current
Source or sink current ............................... ±2mA
Input Current
Source or sink current on IN, /IN .............. ±50mA
Lead Temperature (soldering, 20sec.) ........... +260°C
Storage Temperature (Ts) ..................–65°C to 150°C
Supply Voltage (VCC).................. +2.375V to +2.625V
......................................................+3.0V to +3.6V
Ambient Temperature (TA) ................ –40°C to +85°C
(3)
Package Thermal Resistance
QFN (θJA)
Still-Air ..................................................... 60°C/W
QFN (ψJB)
Junction-to-Board .................................... 33°C/W
DC Electrical Characteristics(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
VCC
Power Supply
Condition
Min
Typ
Max
Units
2.375
2.5
2.625
V
3.0
3.3
3.6
V
32
45
mA
ICC
Power Supply Current
No load, max. VCC
RIN
Single-Ended Input Resistance
(IN-to-VT)
45
50
55
Ω
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
Ω
VIH
Input High Voltage
(IN, /IN)
VCC –1.6
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH-0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a.
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b.
VT_IN
IN-to-VT
(IN, /IN)
VREF-AC
Output Reference Voltage
Note 5
0.2
VCC –1.3
V
VCC –1.2
1.28
V
VCC –1.1
V
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. This is a stress rating only and
functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet.
Exposure to absolute maximum ratings conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the
PCB. θJA and ψJB values are for a 4-layer board in still air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been
established.
5. VIH(min) not lower than 1.2V
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SY89851U
100K LVPECL Output DC Electrical Characteristics(6)
VCC = 2.5V ±5% or 3.3V ±10%; TA = –40°C to + 85°C; RL = 50Ω to VCC –2V, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOH
Output HIGH Voltage
(Q, /Q)
VCC–1.145
VCC–0.895
V
VOL
Output LOW Voltage
(Q, /Q)
VCC–1.945
VCC–1.695
V
VOUT
Output Voltage Swing
(Q, /Q)
See Figure 1a.
550
800
mV
VDIFF_OUT
Differential Output Voltage Swing
(Q, /Q)
See Figure 1b.
1100
1600
mV
Note:
6. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been
established.
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SY89851U
AC Electrical Characteristics(7)
VCC = 2.5V ±5% or 3.3V ±10%, RL = 50Ω to VCC –2V, VIN ≥ 100mV (200mVPP); TA = –40°C to + 85°C, unless
otherwise stated.
Symbol
fMAX
Parameter
Condition
Min
Typ
Maximum Operating Frequency
NRZ Data
2.5
3.5
Gbps
3
4
GHz
140
220
Clock
tpd
Differential Propagation Delay
tpd Tempco
∆tpd Temperature Coefficient
tSKEW
Output-to-Output Skew
Part-to-Part Skew
IN-to-Q
Max
340
130
Note 8
Note 9
6
Units
ps
fs/°C
20
120
ps
ps
Data
tJITTER
tr , tf
Random Jitter
Note 10
1
psRMS
Deterministic Jitter
Note 11
10
psPP
Cycle-to-Cycle Jitter
Note 12
1
psRMS
Total Jitter
Note 13
10
psPP
180
ps
Clock
Output Rise/Fall Time (20% to 80%)
At full output swing
50
100
Notes:
7.
High-frequency AC-parameters are guaranteed by design and characterization.
8.
Output-to-output skew is measured between two different outputs under identical input transitions.
9.
Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew
of the edges at the respective inputs.
10. Random jitter is measured with a K28.7 character pattern, measured at 2.5Gbps.
23
11. Deterministic jitter is measured at 2.5Gbps, with both K28.5 and 2
– 1 PRBS pattern.
12. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn – Tn-1 where T is the time between
rising edges of the output signal.
13. Total jitter definition: with an ideal clock input of frequency <fMAX, no more than one output edge in 10
deviate by more than the specified peak-to-peak jitter value.
July 2005
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12
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SY89851U
Typical Operating Characteristics
VCC = 3.3V, GND = 0V, VIN = 100mV (200mVPP), RL = 50Ω to VCC –2V, TA = 25°C, unless otherwise stated.
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SY89851U
Functional Characteristics
VCC = 3.3V, GND = 0V, VIN = 100mV (200mVPP), RL = 50Ω to VCC –2V, TA = 25°C, unless otherwise stated.
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SY89851U
Single-Ended and Differential Swings
Figure 1b. Differential Voltage Swing
Figure 1a. Single-Ended Voltage Swing
Timing Diagrams
Input and Output Stages
Figure 2a. Simplified Differential Input Stage
July 2005
Figure 2b. Simplified LVPECL Output Stage
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SY89851U
Input Interface Applications
Optional: may connect VT to VCC
Figure 3a. LVPECL Interface
(DC-Coupled)
Figure 3b. LVPECL Interface
(AC-Coupled)
Figure 3d. CML Interface
(AC-Coupled)
Figure 3e. LVDS Interface
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Figure 3c. CML Interface
(DC-Coupled)
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SY89851U
LVPECL Output Interface Applications
LVPECL has high input impedance, very low output
(open emitter) impedance, and small signal swing
which result in low EMI. LVPECL is ideal for driving
50Ω- and 100Ω-controlled impedance transmission
lines. There are several techniques for terminating
the LVPECL output including: Parallel TerminationThevenin Equivalent, Parallel Termination (3Resistor), and AC-Coupled Termination. Unused
output pairs may be left floating. However, singleended outputs must be terminated, or balanced.
Figure 4b. Parallel Termination
(3-Resistor)
Figure 4a. Parallel Thevenin-Equivalent
Termination
Related Product and Support Documentation
Part Number
Function
Data Sheet Link
SY58012U
5GHz, 1:2 LVPECL Fanout Buffer/Translator
with Internal Input Termination
www.micrel.com/product-info/products/sy58012u.shtml
HBW Solutions
New Products and Applications
www.micrel.com/product-info/products/solutions.shtml
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SY89851U
Package Information
16-Pin QFN
Package Notes:
1.
Package meets Level 2 Moisture Sensitivity Classification.
2.
All parts are dry-packaged before shipment.
3.
Exposed pad must be soldered to a ground for proper thermal management.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel
for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a
product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended
for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a
significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a
Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
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