MITSUBISHI MGFX36V0717_11

< X/Ku band internally matched power GaAs FET >
MGFX36V0717
10.7 – 11.7 GHz BAND / 4W
DESCRIPTION
The MGFX36V0717 is an internally impedance-matched
GaAs power FET especially designed for use in 10.7 – 11.7
GHz band amplifiers. The hermetically sealed metal-ceramic
package guarantees high reliability.
FEATURES
Internally impedance matched
 High output power
P1dB=4.0W (TYP.) @f=10.7 – 11.7GHz
 High linear power gain
GLP=8.0dB (TYP.) @f=10.7 – 11.7GHz
 High power added efficiency
P.A.E.=28% (TYP.) @f=10.7 – 11.7GHz
APPLICATION
 For use in 10.7 – 11.7 GHz band power amplifiers
QUALITY
 IG
RECOMMENDED BIAS CONDITIONS
 VDS=10V  ID=1.2A Refer to Bias Procedure
Absolute maximum ratings
Symbol
(Ta=25C)
Parameter
Ratings
Keep Safety first in your circuit designs!
Unit
VGDO
Gate to drain breakdown voltage
-15
V
VGSO
Gate to source breakdown voltage
-15
V
ID
Drain current
2.8
A
IGR
Reverse gate current
-9.0
mA
mA
IGF
Forward gate current
18.0
PT *1
Total power dissipation
27.2
W
Tch
Cannel temperature
175
C
Tstg
Storage temperature
-65 to +175
C
Mitsubishi Electric Corporation puts the maximum
effort into making semiconductor products better
and more reliable , but there is always the
possibility that trouble may occur with them.
Trouble with semiconductors may lead to personal
injury , fire or property damage. Remember to give
due consideration to safety when making your
circuit designs , with appropriate measure such
as (I) placement of substitutive , auxiliary circuits ,
(ii) use of non-flammable material or (iii) prevention
against any malfunction or mishap.
*1 : Tc=25C
Electrical characteristics
Symbol
(Ta=25C)
Parameter
Test conditions
Limits
Min.
Typ.
Unit
IDSS
Saturated drain current
VDS=3V,VGS=0V
-
2
gm
Transconductance
VDS=3V,ID=1.1A
-
1
Max.
2.8
-
VGS(off)
P1dB
Gate to source cut-off voltage
VDS=3V,ID=10mA
Output power at 1dB gain compression
VDS=10V,ID(RF off)=1.2A
GLP
Linear Power Gain
f=10.7 – 11.7GHz
P.A.E.
Rth(ch-c) *2
A
S
-2
-3
-4
V
34.5
36
-
dBm
7
8
-
dB
Power added efficiency
-
28
-
%
Thermal resistance
-
-
5.5
C/W
*2 :Channel-case
Publication Date : Apr., 2011
1
< X/Ku band internally matched power GaAs FET >
MGFX36V0717
10.7 – 11.7 GHz BAND / 4W
MGFX36V0717 TYPICAL CHARACTERISTICS( Ta=25deg.C )
P1dB,GLP vs. f
Po,PAE vs. Pin
S11,S22 vs. f
S21,S12 vs. f
MGFX36V0717 S-parameters( Ta=25deg.C , VDS=10(V),IDS=1.2(A) )
S Parameters(Typ.)
f
(GHz)
S11
S21
S12
S22
Magn.
Angle(deg.)
Magn.
Angle(deg.)
Magn.
Angle(deg.)
Magn.
10.7
0.27
173
2.52
25
0.099
-5
0.62
-130
10.9
0.27
148
2.57
-3
0.155
-13
0.52
-148
11.1
0.28
122
2.67
-28
0.118
-35
0.36
-173
11.3
0.28
98
2.73
-51
0.120
-59
0.14
145
11.5
0.24
72
2.61
-73
0.119
-79
0.18
35
11.7
0.14
35
2.51
-91
0.115
-101
0.32
-35
Publication Date : Apr., 2011
2
Angle(deg.)
< X/Ku band internally matched power GaAs FET >
MGFX36V0717
10.7 – 11.7 GHz BAND / 4W
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors
may lead to personal injury, fire or property damage. Remember to give due consideration to safety when
making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
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Publication Date : Apr., 2011
3