VSM1506 Vishay Foil Resistors SURFACE MOUNT Bulk Metal® Foil Technology Discrete High Precision Surface Mount Chip Resistor FEATURES Product may not be to scale The VSM1506 Discrete Precision Chip Resistor uses the Bulk Metal® Foil (BMF) Technology for the resistance element. The BMF provides inherently a low and predictable temperature coefficient of resistance (TCR) and remarkable load life stability for precision analog applications. The predictable TCR variation is independent of value, date code, time and is expressed via the curve shown below. The VSM1506 has a newly designed, robust termination which insures safe handling during the manufacturing process as well as providing stability during the multiple thermal cyclings it will see over its service life. • High Precision, Low TCR • Temperature Coefficient of Resistance: Nominal TCR: + 0.6ppm/°C (0°C to + 25°C) - 0.6ppm/°C (+ 25°C to + 60°C) + 2.2ppm/°C (- 55°C to + 25°C) - 1.8ppm/°C (+ 25°C to + 125°C) • Resistance Range: 10Ω to 40KΩ • Tolerance: to ± 0.01% (See table 1) • Load Life Stability: ± 0.01% maximum ∆R under full rated power @ + 70°C for 2000 hours. • Shelf Life Stability: 50ppm/year (0.005%) maximum ∆R non-hermetically sealed • Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V) • Current Noise: < 0.010µV(rms)/volt of applied voltage • Non Inductive: < 3.0nH • Terminal Finishes Available: Lead (Pb)-free (Sn 99.3% Cu 0.7%) Tin/Lead Alloy (Sn 62% Pb 36% Ag 2%) TABLE 1 - TOLERANCE VERSUS RESISTANCE VALUE The load life specification has been improved providing even greater life stability and the ohmic value has been extended from 33K to 40K Ohms. A voltage divider can be fashioned by using two arbitrarily selected VSM1506s; with a resultant tracking specification of < 3ppm/°C. The VSM1506 replaces the VSM1505 for new designs. FIGURE 1 - NOMINAL TCR CURVE STANDARD TOLERANCE* (%) 100Ω to 40KΩ ± 0.01 50Ω to < 100Ω ± 0.05 25Ω to < 50Ω ± 0.1 10Ω to < 25Ω ± 0.25 *Tighter tolerances are available. Please contact Application Engineering. Soldering temperatures used during installation may cause resistance to shift up to 0.01%. TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS TEST –55 –50 VALUE (Ω) –25 +25 0 +500 +50 +75 +100 +400 MIL-PRF-55342G CHARACTERISTIC E ∆R LIMITS VSM1506 MAXIMUM ∆R LIMITS* Thermal Shock ± 0.10% ± 0.02% Low Temperature Operation ± 0.10% ± 0.02% Short Time Overload ± 0.10% ± 0.02% High Temperature Exposure ± 0.10% ± 0.03% Resistance to Bonding ± 0.20% ± 0.01% Moisture Resistance ± 0.20% ± 0.03% Life 2000 hours @ + 70°C ± 0.50% ± 0.01% +125 m +300 -5 +5 pp m pp Nominal Resistance/ Temperature (RT) Curve +200 +100 ∆R R (ppm) 0 Maximum Spread ±2.3 ppm/°C –100 –200 –300 –400 +2.2 ppm/°C Nominal Chord Slope (TCR) –1.8 ppm/°C Nominal Chord Slope (TCR) Standard Spread ±2.0 ppm/°C –500 –55°C / +25°C / +125°C are the test points with +25°C as the reference temperature The TCR for values < 100Ω are influenced by the termination composition and result in a deviation from this curve. Contact our application engineering department for detailed specification on low values Power @ + 70°C (mW) 100 Maximum Voltage (V) 63 Maximum Weight (mg) 12 *As shown + 0.01 Ohms to allow for measurement errors at low values. SALES • ISRAEL: [email protected] • FRANCE/SWITZERLAND/SOUTHERN EUROPE: [email protected] • AMERICAS: [email protected] • ASIA/JAPAN: [email protected] • UK/HOLLAND/SCANDANAVIA: [email protected] • GERMANY/CZECH REPUBLIC/AUSTRIA: [email protected] www.vishay.com 24 For technical questions in the Americas, contact [email protected] Document Number: 63071 For technical questions in Asia/Japan/Europe/Africa/Israel, contact [email protected] Revision 17-Aug-04 VSM1506 ® Bulk Metal Foil Technology Vishay Foil Resistors Discrete High Precision Surface Mount Chip Resistor Percent of Rated Power 125 –55°C FIGURE 3 - RECOMMENDED MOUNTING +70°C Rated Power 100 25% to 85% of T 75 A low profile solder fillet is recommended to avoid unnecessary stresses along top edge of metallization. IR and vapor phase reflow are best. Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction. 50 25 0 -75 –50 –25 0 +25 +50 +75 +100 +125 +150 +175 Ambient Temperature (°C) TABLE 3 - CHIP SIZES AND SPECIFICATIONS in inches (millimeters) Recommended Land Pattern Bottom View for Mounting Uncoated Ceramic L X G W T Footprint Z D L W ± 0.005 [0.13] ± 0.005 [0.13] T MAXIMUM ± 0.005 [0.13] D Z* MAXIMUM G* MINIMUM X* MAXIMUM 0.150 [3.81] 0.062 [1.57] 0.025 [0.64] 0.020 [0.50] 0.199 [5.046] 0.083 [2.108] 0.071 [1.806] *Land Pattern Dimensions are per IPC-782 TABLE 4 - ORDERING INFORMATION MODEL CHIP SIZE VSM 1506 RESISTANCE VALUE RESISTANCE RANGE LETTER DESIGNATOR MULTIPLIER FACTOR 5Ω to < 1KΩ R Example: 249R00 = 249Ω x 1.0 1K to 40K K x 103 Example: 10K000 = 10.0KΩ TOLERANCE TERMINATION PACKAGING T ± 0.01% Q ± 0.02% A ± 0.05% B ± 0.1% C ± 0.25% D ± 0.5% F ± 1.0% S - Lead (Pb)-free B - Tin/Lead T = Tape and Reel W = Waffle Pack SALES • ISRAEL: [email protected] • FRANCE/SWITZERLAND/SOUTHERN EUROPE: [email protected] • AMERICAS: [email protected] • ASIA/JAPAN: [email protected] • UK/HOLLAND/SCANDANAVIA: [email protected] • GERMANY/CZECH REPUBLIC/AUSTRIA: [email protected] For technical questions in the Americas, contact [email protected] Document Number: 63071 For technical questions in Asia/Japan/Europe/Africa/Israel, contact [email protected] Revision 17-Aug-04 www.vishay.com 25 SURFACE MOUNT FIGURE 2 - DERATING CURVE