FAIRCHILD FSA8108

FSA8108
Audio Jack Detection and Configuration Switch, Supports
Volume Up/Down & Send/End Keys
Features
Detection
Description
Audio Plug Connection
Volume Up/Down Key Press
Send/End Key Press
VDD
2.7 to 4.5V
VIO
1.6V to VDD
THD (MIC)
0.01% Typical
LDO Output for MIC Bias
Voltage
2.4V
ESD (IEC 61000-4-2)
15kV
Operating Temperature
Package
-40°C to 85°C
12-Ball WLCSP
Top Mark
Ordering Information
G6
FSA8108BUCX





Detects 3- or 4-Pole Audio Accessories
Removes Audio Jack Pop-and-Click Caused by
MIC Bias
Detects Key Press: Volume Up/Down, Send/End
Stuck Send/End Key Recovery
LDO Output for MIC Bias Voltage
Related Resources
 For samples and questions, please contact:
[email protected]
Applications


The FSA8108 is an audio jack detection switch for 3- or 4pole accessories that detects the audio plug connection. The
detection circuit monitors the microphone bias voltage to
detect a volume up/down or send/end key press. For system
flexibility, the FSA8108 features an I2C port with registers to
allow programmability of AC timing specifications.
Cellular Phones, Smart Phones
MP3 and PMP (Portable Media Player)
Figure 1.
© 2011 Fairchild Semiconductor Corporation
FSA8108 • Rev. 1.0.0
Typical Application Diagram
www.fairchildsemi.com
FSA8108 — Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys
August 2012
0.03 C
E
2X
F
A
0.80
B
1.20
PIN 1 AREA
(Ø0.200)
Cu Pad
(Ø0.300)
Solder Mask
0.40
D
0.40
0.03 C
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.378±0.018
0.208±0.021
0.625
0.547
0.05 C
C
SEATING PLANE
D
SIDE VIEWS
0.005
0.80
0.40
1.20
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
D
C
B
A
0.40
NOTES:
C A B
Ø0.260±0.02
12X
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
(Y)±0.018
F
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
1 2 3
(X)±0.018
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
BOTTOM VIEW
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: MKT-UC012ACrev1.
Figure 14.
12-Ball, 3x4 Array, 0.4mm Pitch, 250µm Ball, Wafer-Level Chip-Scale Package (WLCSP)
Nominal Values
Bump Pitch
Overall Package Height
Silicon Thickness
Solder Bump Height
Solder Bump Diameter
0.4mm
0.586mm
0.378mm
0.208mm
0.260mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Ordering Information
Part Number
FSA8108BUCX
Operating
Temperature
Range
Top
Mark
Package
-40 to +85°C
G6
12-Ball, 3x4 Array, 0.4mm Pitch, 250µm
Ball, Wafer-Level Chip-Scale Package
© 2011 Fairchild Semiconductor Corporation
FSA8108 • Rev. 1.0.0
D
E
X
Y
1.56mm 1.16mm 0.18mm 0.18mm
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20
FSA8108 — Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys
Physical Dimensions
FSA8108 — Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys
21
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© 2011 Fairchild Semiconductor Corporation
FSA8108 • Rev. 1.0.0
FSA8108 — Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys
22
www.fairchildsemi.com
© 2011 Fairchild Semiconductor Corporation
FSA8108 • Rev. 1.0.0
FSA8108 — Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys
23
www.fairchildsemi.com
© 2011 Fairchild Semiconductor Corporation
FSA8108 • Rev. 1.0.0